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Crossbar ReRAM is worth notice 1/17/2017
Imagine a 1T1R scheme would be used in embedded memory applications, involving caching, with the 1TnR design used in storage drives such as SSDs in formats such as M.2 or even NVDIMMs.
Samsung: Note 7 fault is in the battery 1/17/2017
The smartphone maker is expected to release the results of its investigation on January 23. Samsung will reveal that the battery was the main reason for the fires—not a design flaw or firmware issue.
SMIC rated "fastest growing foundry" 1/17/2017
Shanghai-based SMIC saw its annual sales in 2016 surge by 31 percent while the top-ten foundry players had growth averaging 11 percent during the same period, according to IC Insights.
450 mm wafer dream takes a break 1/17/2017
The Global 450 Consortium (G450C)--a joint R&D program that involved Intel, TSMC, Globalfoundries, IBM, Samsung, the SUNY Polytechnic Institute--quietly wound down its work at the end of last year with member companies concluding that the timing was not right for an optional Phase 2.
Taiwan Powertech scraps $2 billion deal with China 1/16/2017
Powertech, a Taiwanese chip tester and packager, said the plan was being scrapped because a one-year period authorized by its shareholders to get the deal approved in Taiwan was about to lapse and local regulators had yet to give a green light.
Apple and TSMC are seriously considering U.S. manufacturing plants 1/16/2017
Softbank's Masayoshi Son, whose group has an alliance with Foxconn, promised Trump that they would consider investing in manufacturing goods in the US, to create jobs.
Low power Mobil Processors are finding other applications 1/16/2017
Chips increasingly are finding their way into autonomous vehicles, the Internet of Things, unmanned aerial vehicles, virtual reality, and other applications far beyond phone calls and text messages. Moreover, they are gaining in complexity as they are adapted for other markets.
Known semiconductor foundries all grown in 2016 1/16/2017
In 2016, the “Big 4” pure-play foundries (i.e., TSMC, GlobalFoundries, UMC, and SMIC) held an 85% share of the total worldwide pure-play IC foundry market.
Macronix memory design shows up on Qualcomm system 1/13/2017
Macronix announced that its NAND MCP memory solution has been adopted and incorporated by Qualcomm for a Qualcomm Technologies' LTE Cat. M1/NB-1 Technologies Inc. as a part of the reference design chipset, the MDM9206 modem.   
Google: Memory latency have to go down 1/13/2017
Google wants memory chips with lower latency. “We can get as much bang for the buck improving memory latency as processor performance,” said Sabada, pointing to promising work on new memory architectures.
China's Tsinghua Unigroup to build IC manufacturing in Wuhan, Chengdu and Nanjing 1/13/2017
Total investment in Yangtze River Storage Tech's new plant in Wuhan is estimated at US$24 billion. The facility will be dedicated to producing 3D NAND flash memory with volume production slated for 2018.
Higher Q4 profit for TSMC 1/13/2017
The Taiwanese company reported a record net income of NT$100.2 billion ($3.15 billion) in the three months ended December, surpassing the NT$96.2 billion average of analysts’ estimates compiled by Bloomberg.
Manufacturing orders down while tools orders areup 1/12/2017
Industry analysts for manufacturing technology forecast that orders may begin to rebound as early as April.
Toshiba rolls out high temperature eMMC 1/11/2017
The new line-up includes densities of 8GB, 16GB, 32GB and 64GB,featuring an enhanced operational temperature range of -40°C to 105°C.
SK Hynixs offer highest density LPDDR4 memory MCP 1/11/2017
The 8-gigabyte LPDDR4X chip boasts the "world's highest density" and features faster data processing speed while consuming less electricity, SK hynix said in a statement.
MediaTek broke revenue rcords in 2016 1/11/2017
MediaTek saw its 2016 revenues climb 29.2% on year to a record high of NT$275.51 billion (US$8.6 billion). Robust performance of its China-based handset clients and a bigger share of the smartphone-chip market led to MediaTek's impressive revenue resut for the year.
Memories to constitute the biggest thrust in 2017 1/11/2017
The strong memory CAGR is driven by surging low-power memory requirements for DRAM and NAND flash in portable wireless devices like smartphones and by growing demand for solid-state drives (SSD) used in big-data storage applications.
Manufacturers considering building factories in the U.S. 1/10/2017
South Korean media reported that LG is considering building a home appliance production line in Tennessee. The company has three production factories in Mexico -- Reynosa, Mexicali and Monterrey -- and most products from these plants are exported to the U.S. tariff-free.
SK Hynix show 8GB mobile DRAM module 1/10/2017
SK Hynix claims that it has announced the world’s first highest density of 8GB RAM for smartphones of the future.
The new TimeSync Wi-Fi 1/10/2017
TimeSync, as it is called, would let devices work in alignment on tasks like streaming audio into different rooms of a house without distortion.
ARM push for open source on vehicals 1/10/2017
ARM noted that the next big solutions will involve open vehicle platforms, software-defined cars, security, and built-in connectivity for over-the-air software updates.
China rebuts U.S. report Chinese semiconductor threat on U.S. security 1/9/2017
US semiconductor sector faces challenges in innovation, competitiveness and integrity. The report noted "that Chinese policies are distorting markets in ways that undermine innovation, subtract from US market share, and put US national security at risk."
Inventec warns about cost to produce in the U.S. 1/9/2017
Inventec, the electronic contract manufacturer which supplies HP, Dell and Apple, said on Friday it would move some production to the U.S. if its customers agreed, in response to U.S. President-elect Donald Trump's vow to increase local jobs.
LG likely to post a $29.6 million lost 1/9/2017
“The profit loss of the mobile communication (MC) business unit is expected to become bigger while the profits of home entertainment business unit and H&A business unit are likely to decrease due to the price rise of LCD panels and sales promotion expenses in the end of the year,”
Automotive MEMS to increase 1/9/2017
IHS Markit estimates that the value of this market in 2016 was $2.8 billion, with automotive MEMS use growing at a compound annual growth rate of 6.9% from 2015 to 2022, to reach $3.2 billion in 2022. 
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