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| Altera Stratix 10 to sell under Intel label by year end |
8/22/2016 |
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Krzanich pledged to ship before the end of the year Altera’s flagship, the Stratix 10 FPGAs. It will wear the Intel brand and use both Intel’s 14nm process technology and be the first chip to use its embedded multi-die interconnect packaging technology.
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| DDR5, the next generation DRAM |
8/22/2016 |
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Specifications for DDR5 memory will be released this year, and deployment of the DRAM will begin in 2020, according to a slide deck presented at the Intel Developer Forum this week.
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| Merger on major wafer suppliers |
8/19/2016 |
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GlobalWafers Co. says greater market share can be achieved in the silicon-wafer market after the Taiwanese supplier to chipmakers agreed to buy SunEdison Semiconductor Ltd. for $683 million including debt, adding new customers and production facilities.
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| SK Hynix debutes UFS 2.1 memory |
8/19/2016 |
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It provides more than three times faster sequential read performance compared to that of the existing embedded Multi Media Card (eMMC) 5.1, reading and writing sequentially at 800 megabytes and 200 megabytes per second, respectively.
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| Samsung to spearhead UFS memory |
8/19/2016 |
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“As King Arthur subjugated the whole nation with the magical sword Excalibur, the Excalibur of a future mobile world will be none other than UFS.” said Cho Hee-chang, a senior research fellow at the Memory Business Division at Samsung Electronics.
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| Intel to foundary ARM processor |
8/18/2016 |
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Officials from Intel and ARM announced that Intel's chip foundry business will build chips for mobile and consumer devices based on ARM's architecture. The agreement will boost Intel's custom manufacturing business.
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| Apple to open R & D lab in China |
8/17/2016 |
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Apple has more than doubled its number of corporate sites in China to 45 since 2011, so the move may help it consolidate some of those facilities. Its spending on research and development has quadrupled in the same time frame.
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| 3D printing puts a lence on image sensor chip |
8/17/2016 |
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Timo Gissibl printed optical free form surfaces and miniature objectives directly onto CMOS image chips, creating an extremely compact sensor with integrated optics. The researchers hope that using such optics, smaller and lighter cameras could be designed for drones and robots.
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| Chemical sensor on a chip |
8/17/2016 |
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The Cornell researchers are using a new material — the titanium dioxide — in a design can make a sensor more sensitive and small enough to be used in the field.
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| Micron shows super fast storage with 3D Xpoint memory |
8/16/2016 |
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Micron (NASDAQ: MU) claimed its Quantx line delivers PCI Express (PCIe) SSD performance with read latencies at less than 10 microseconds and writes at less than 20 microseconds. That, the chipmaker asserted, is 10 times better than NAND flash-based SSDs.
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| Western Digital to get into 3D ReRAM |
8/16/2016 |
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While Western Digital didn’t reveal any fixed timeline for when these products will launch or their specifications, they have confirmed their decision to use SanDisk’s Resistive RAM technology alongside 3D manufacturing to create these special purpose SSDs.
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| China is now number one in Supercomputer with their own chips |
8/16/2016 |
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The Sunway TaihuLight claimed the top slot on the latest edition of the Top500 list, which ranks supercomputers in terms of calculation speed. No other supercomputer came close to China's new system, whose theoretical peak performance is 93 petaflops.
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| Korea to take 75% of DRAM market |
8/15/2016 |
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According to DRAM Exchange,Samsung Electronics’ DRAM sales rose 8.7 percent in the second quarter to $4.32 billion (about 4.75 trillion won) from $3.97 billion in the first quarter. SK Hynix also recorded $2.41 billion in the second quarter in sales, up 4 percent from $2.32 billion in the first quarter.
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| AMD moving back from ARM server to x86 |
8/15/2016 |
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Instead of ARM-based servers, AMD is relying again on x86 chips, this time based on the promising Zen architecture, to take market share from Intel.
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| El-Khoury replaces Rogers as CEO at Cypress |
8/15/2016 |
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El-Khoury is a nine-year veteran of Cypress, and helped shepherd the company's acquisition of chipmaker Spansion in 2015, and this year's purchase of Broadcom's internet of things operations.
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| Samsung talked about 1 terabit 3D NAND with 100 layers |
8/15/2016 |
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"1 terabit NAND flash will soon hit the market, and that means a chipmaker can stack up 100 layers of cells inside a chip,” Kim Ki-nam, the chief of Samsung’s chip business division, said at the Flash Memory Summit
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| TSMC July revenue down 6.1% |
8/12/2016 |
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TSMC estimated previously that revenues would climb to between NT$254 billion and NT$257 billion in the third quarter of 2016 representing sequential growth of 14.5-16%.
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