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| Renesas offered $3.2B for Intersil |
9/14/2016 |
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Renesas is paying a 14 percent premium to Intersil’s closing price on Monday, or $22.50 per share, according to a statement to the Tokyo Stock Exchange on Tuesday.
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| HP Inc. agreed to buy Samsung printer business |
9/13/2016 |
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The transaction, which is subject to regulatory approval, is expected to close within 12 months, the companies said Monday. After it is completed, Samsung has agreed to make an equity investment of $100 million to $300 million in HP through open-market stock purchases.
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| 5.1 quake hit South Korea |
9/13/2016 |
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The concerned factory is one of indirect processing plants that produce small plastic cases for Galaxy S smartphone and tab series. LG Display’s production lines in the same district also temporarily stopped the automatic moving line for LCD panels as the earthquake outbreak can break the large and thin panels.
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| Infineon introduced MOSFET with 280 mohm |
9/13/2016 |
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The 800 V CoolMOS P7 series offers up to 0.6% efficiency gain which translates into 2 to 8 °C lower MOSFET temperature compared to the CoolMOS C3 or to competitor parts tested in typical flyback applications.
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| DRAM supply can fall short without continuous investment |
9/13/2016 |
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DRAM market will experience a slight supply excess in the first half of 2017 while it will be in short supply in the second half. This is largely due to the fact that DRAM manufacturers are reducing the excessive investment.
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| IBM P8 server employs Nvidia's NVLink interconnect technology |
9/12/2016 |
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The large data requirements of AI applications means that memory access and inter-processor communications can quickly become a bottleneck. So IBM is also using Nvidia’s proprietary NVLink interconnect technology to address that problem.
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| Backend manufacturer ASE see revenue increase |
9/12/2016 |
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Market watchers expect ASE to generate consolidated revenues of between NT$73.5 billion and NT$74 billion in the third quarter of 2016 representing sequential growth of 17-19%.
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| Weebit Nano to develope commercial ReRAM |
9/12/2016 |
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ReRAM technology (advanced resistive random-access memory) is based on silicon oxide (SiOx) and the partners said that they will be looking to develop SiOx ReRAM memory that is scalable to 40nm, which could open up significant opportunities.
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| iPhone 7 boost Broadcom sales |
9/9/2016 |
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The outlook came as Broadcom reported revenue of ₹25,427.48 crore ($3.792 billion), up 7% from the prior quarter.
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| Dell finalized EMC acquisition |
9/9/2016 |
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The merger between Dell and EMC is a response to overall declining markets in both Dell’s and EMC’s core businesses as technology shifts to mobile devices and toward lower-margin hardware such as servers and storage used in cloud computing. Together, the two companies can presumably sell far more of Dell’s products to EMC’s customers, analysts say.
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| DRAM contract prices to go up |
9/8/2016 |
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DRAM and NAND flash memory prices are forecast to increase in the fourth quarter of 2016, with contract prices for DRAM set to rise more than 10% sequentially.
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| GE quietly acquired two 3D printing companies |
9/8/2016 |
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GE is upping its old-school manufacturing capabilities with technology that will allow it to quickly punch out components for the automotive, airline and health industries at the whim of any client.
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| U.S. car sales down |
9/8/2016 |
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General Motors and Ford saw their sales numbers decline by 5 percent and 8 percent, respectively, between August 2015 and August 2016.
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| HDMI Alternate Mode uses USB Type-C connector |
9/7/2016 |
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HDMI Alternate Mode allows HDMI-enabled source devices to utilise a USB Type-C connector to directly connect to HDMI-enabled displays, and deliver native HDMI signals over a simple cable without the need for cumbersome protocol and connector adapters or dongles.
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| 3D printer to print multi-layer PCB |
9/6/2016 |
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Nano Dimension Technologies has shipped the first DragonFly 2020 system designated for 3D circuitry and PCBs, marking a major milestone for the company.
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| WD to expand on 3D ReRAM |
9/6/2016 |
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Western Digital's plan is to release storage-class memory products based on 3D ReRAM within a couple of years manufactured in the same wafer fab that produces stacked NAND flash memory.
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| TSMC foundary market challenged |
9/6/2016 |
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Tower Semiconductor, which trades as TowerJazz, and Chinese foundry SMIC are expected to enjoy a surge in sales in 2016—partly due to past investments in wafer fabs—and as a result takes market share from market leader TSMC and United Microelectronics Corp.
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