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Fujitsu Semiconductor and Panasonic have developed the densest ReRAM. 11/22/2016
It is targeted at battery-operated wearables and medical devices such as hearing aids, which require high density, low power consumption electronic components.
Chinese to appeal directly to Obama on purchase of Aixtron 11/22/2016
An American security panel that advises the White House on foreign deals had recommended the two sides drop their plan, citing unspecified national security concerns. Aixtron said it and its Chinese suitor would do something unusual: They would appeal to President Barack Obama directly to approve the deal.
Snapdragon 835 goes beyond mobile 11/22/2016
AR, VR and AI will affect mobile shipments. On spec, the Snapdragon 835 SoC will enable richer apps to be built, advancing the platform shift.
China Changjiang Storage to negotiate memory license from Micron 11/18/2016
"We are in talks with Micron for possible licensing for its NAND flash as well as DRAM technology, but have yet to reach a conclusion,"
Component cost up as PC production volume goes down 11/18/2016
¡°The market demand for notebooks is flat. The strong orders for components from PC vendors last quarter and this quarter could lead to inventory correction at the beginning of next year,¡±
China made "huge progress" in High Performance Computer 11/18/2016
According to the latest rankings released this week at Salt Lake City, China's Sunway TaihuLight has once again been named the world's fastest supercomputer, the eighth time in a row that a Chinese-made machine has taken the semiannual TOP500 crown.
UMC opens 12" China fab 11/18/2016
Fab 12X is part of a 3-way joint venture foundry company between UMC, Xiamen Municipal Government and Fujian Electronics and Information Group. The JV foundry, named United Semi, will initially offer 55nm and 40nm process.
Macronix to jump onto 3D NAND bandwagon 11/17/2016
"Our 3D-NAND is based on charge-trap flash, something we have been working on since 1998. We have long experience."
IC Insight elects Nvidia and MediaTek top growth companies 11/17/2016
The fastest growing top-20 company in 2016 is forecast to be US-based Nvidia, which is expected to post a 35% on-year increase in sales. The second-fastest growing top-20 company in 2016 is expected to be Taiwan-based MediaTek, which is forecast to post a 29% increase in sales.
Government suggested that the connected world needs more security 11/17/2016
In a report obtained by The Associated Press, the Homeland Security Department described runaway security problems with devices that have been made internet-capable in recent years, a group that includes medical implants, surveillance cameras, home appliances, digital video recorders, thermostats and baby monitors.
Wholesale prices stayed flat in October 11/17/2016
The Labor Department said Wednesday that its producer price index was flat last month after rising 0.3 percent in September. Services prices fell 0.3 percent, pulled down by a record 5.7 percent drop in the price of brokerage and other financial services.
New Fujifilm Taiwan plant to supply semiconductor material 11/16/2016
Network of existing production sites in Asia include Shizuoka (Japan), Hsinchu (Taiwan), Suzhou (China) and Cheonan (Korea) – in order to strengthen its supply of advanced semiconductor materials.
Qualcomm opened test facility in Shanghai 11/16/2016
This is reportedly Qualcomm's first semiconductor manufacturing test facility in the world. The new company will focus on chip and system tests and it will expand to wafer tests in the future.
Intel starts $6 billion semiconductor line in Israel 11/16/2016
The upgrade to the machinery came at a cost of $6 billion, including a $300 million grant from the Israeli government.
ReRAM startup transfers technology to Leti in France 11/16/2016
Weebit Nano was founded in 2014 to develop a memory technology invented by Professor James Tour of Rice University with the potential to be 1000 times faster, more reliable, more energy-efficient and cheaper than flash.
Macronix offer flash for automotive applications 11/15/2016
Macronix International Co. Ltd. (Hsinchu, Taiwan) has launched AEC-Q100 compliant NAND flash memories with capacities of 1Gbit to 16Gbit.
Chinese fabs juggling for positions in memory production 11/15/2016
Three major China-based DRAM players are expected to emerge and compete for the title of China's number-one DRAM producer starting 2018.
Samsung buys into automotive electronics by acquiring Harman 11/15/2016
Samsung added that Harman products, which included connected car devices and audio systems, are installed in an estimated 30 million vehicles worldwide.
German Siemens to acquire Mentor Graphics 11/15/2016
Siemens will pay Mentor Graphics shareholders $37.25 per share, a 21-percent premium to Friday's closing price. Total price comes to $4.5 billion. It expects to fund the deal from cash reserves, Siemens said on Monday.
iPhone 8 to have revolutionary wireless charging 11/14/2016
According to a report in BGR, the Cupertino giant is working with Energous to introduce wireless charging technology for iPhone 8. If rumours are anything to go by, the wireless technology being developed by Apple is like no other we’ve seen yet.
DRAM market predicts to grow in 2017 11/14/2016
The research report, released by Market information advisory firm TrendForce Corp. (W–M‰È‹Z), indicated that dynamic random access memory (DRAM) chips would continue to grow in 2017.
Tohiba reaps profit as memory price bounce back 11/14/2016
Toshiba posted an operating profit of 76.7 billion yen ($721 million) for the second quarter, versus a loss of 82.6 billion yen in the same period a year earlier.
Nvidia registered record revenue 11/14/2016
Revenue rose 53.6 percent to $2.00 billion in the third quarter, blowing past analysts' expectations of $1.69 billion.
Trump win creates uncertainty in Tech Industry 11/11/2016
The Semiconductor Industry Association has long advocated free trade such as the Trans Pacific Partnership and other trade deals and relaxed immigration for foreign nationals with advanced STEM degrees.
JEDEC released update on NAND flash interface interoperability spec. 11/11/2016
This standard was jointly developed by JEDEC and the Open NAND Flash Interface Workgroup, hereafter referred to as ONFI.
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