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GlobalFoundries invested big in Saratoga County, NY 8/3/2016
GlobalFoundries has invested $1.03 billion over the past seven years to purchase building materials and manufacturing equipment for its Malta, New York, factory, as the company competes to produce the most advanced computer chips in the world.
Macronix to overtake Cypress in NOR leadership ? 8/3/2016
Dr. Chih-Yuan Lu emphasized that with the continual stability of Macronix’s market share, he is confident that they will take the top spot in global market share at the end of the year.
UMC offers 180nm process for automotive electronics 8/3/2016
This automotive grade allows for the semiconductors to offer a high reliability in vehicles where high-temperature environments are an issue for other ICs.
ARM expanded IoT team at Israel Center 8/3/2016
ARM has recruited about 40 engineers in Israel and continues to grow the design centre. Will position it as a leading global IoT engineering research centre.
WD's late entry to 3D NAND will help Micron position 8/2/2016
Western Digital's Q4 concall was mostly bad news for the company, confirming that it is probably a year late in the 3D business. WDC's problems are Micron's opportunities, especially in 3D NAND. The outlook for Micron's NAND business is considerably brighter.
Galaxy S7 put Samsung back into the limelight 8/2/2016
The Galaxy S7 has pushed Samsung back into the limelight, after a two year slump the firm is back on form. Samsung Galaxy S7 units are selling by the boatload.
MediTek enjorys high revenue growth in Q2 8/2/2016
MediaTek has announced pre-tax profits of NT$7.75 billion (US$245.2 million) for the second quarter of 2016, up 46.8% sequentially. Pre-tax EPS for the quarter came to NT$4.93.
VR and AR might become the growth engine for memories 8/2/2016
Industry sources say that the expansion of the VR and AR market is primarily to increase the demand of NAND flash which keeps storing data when a device’s DRAM and power are shut off. To realize 3D VR contents through VR devices, like the Gear VR, requires a lot of memory.
Qualcomm signed 3G/4G advanced CDMA license with China OPPO 8/1/2016
Under the terms of the agreement, Qualcomm has granted OPPO a royalty bearing patent license to develop, manufacture and sell 3G (WCDMA and CDMA2000) and 4G, including 3-mode (LTE-TDD, TD-SCDMA and GSM) complete terminals.
Samsung to have 64 layer 3D NAND in production by Q4 8/1/2016
When Samsung releases a 64-layer V NAND-based SSDs, they will be able to mass-produce 15.32-plus TB SSDs for servers. Since A 15.32TB product fetches about 10 million won, demand will lopsided toward Samsung Electronics, further boosting profitability.
Rambus PHY IP reach DDR4 3200 8/1/2016
Rambus Inc. said it has developed the first production-ready 3200 Mbps DDR4 PHY available on Globalfoundries Inc.'s FX-14 ASIC platform using its power-performance optimized 14nm LPP process.
ST to buy NFC/RFID IP from Ams 8/1/2016
Included in the deal are NFC front end and antenna boost solutions, as well as integrated HF/UHF RFID reader assets. Around 50 employees will transfer to ST.
Ted Hsu to succeed chairman Johnny Shih at Asustek 7/29/2016
gThe succession plan has already begun and I plan to complete it within one to two years from now,h Shih told a news conference.
10nm Snapdragon 830 might fill Samsung S8 7/29/2016
Next-generation Qualcomm Snapdragon 830 chip will be based on 10nm process and come with Kyro 200 core design, Adreno 540 GPU, X16 modem with download speeds of up to 980 Mbps, and LPDDR4X memory that can support 4K x 2K video recording.
Inotera re-afirmed that the Nanya Micron deal will go on 7/29/2016
An update will be provided later in the second half of 2016, said Lee, adding that Nanya will fully cooperate with Micron to go through relevant procedures as required and complete the deals.
Samsung to concentrate on 10nm 7/29/2016
“The 10-nanometer chip production boasts the highest efficiency and is fit for commercialization,”
Rambus analysed the need for memory bandwidth 7/28/2016
Over the next five years, it is estimated that the total memory bandwidth will need to increase approximately 33% per year to keep pace with processor improvements. Given this projection, DRAM of all variants should achieve speeds of over 12Gbps by 2020 for optimal performance.
Tsinghua merges with XMC to become a power house in memory 7/28/2016
The newly merged entity is called Changjiang Storage Co. and has a registered capital of 18.9 billion yuan ($2.8 billion), according to a website operated by the State Administration for Industry and Commerce.
White House to promote EV charging infustructure 7/28/2016
The White House announced that nearly 50 entities signed onto a document of "Guiding Principles to Promote Electric Vehicles and Charging Infrastructure," including state governments, electric utilities and companies such as automakers Ford, General Motors, Mercedes-Benz, Nissan and Tesla.
LG to invest $1.75 billion into flexible display 7/28/2016
The South Korean company said mass production of flexible displays will start in late 2018, at a scale that will supply enough 5.7-inch sized flexible screens for 3 million handsets per month.
Samsung to expand Austin R&D center 7/27/2016
Samsung Austin R&D Center, which develops system large-scale integration for premium mobile devices, would be relocating its offices from its current location at Ladera Bend to a new, larger and updated 112,000-square-foot space in northeast Austin.
China's LeEco to acquire Vizio 7/27/2016
Under the $2 billion agreement, LeEco will acquire all of Vizio's hardware and software operations, technology, and intellectual property. Vizio's data business, Inscape, will spin off as a separate, privately owned company.
ADI to take over Linear Tech at $14.8 billion 7/27/2016
Linear Technology shareholders will receive $46 a share in cash plus 0.2321 of a share of Analog Devices for each share of Linear Technology. The transaction is expected to close in the first half of next year.
Intel expands chip production at Dalian, China 7/27/2016
It will produce nonvolatile memory (NVM) modules based on 300-millimeter integrated wafers.
DHL test out parcel delivery by drone 7/26/2016
The parcelcopter dealt with heavy loads, long distances, and delivery to an alpine region conquering geographical and meteorological challenges.
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