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| Field programmable analog array is finding markets |
8/26/2016 |
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What is it that has enabled Silego Inc. (Santa Clara, Calif.) to ship more than 1 billion units of its configurable mixed-signal ICs (CMICs) in the last two years? The answer would seem to be: by taking account of application knowledge and specific functionality.
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| New GDDR6 with GPU by 2018 |
8/26/2016 |
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GDDR6 will be a faster and more power-efficient form of graphics memory. GDDR6 will provide throughput of around 14Gbps (bits per second), an improvement of 10Gbps with GDDR5
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| Samsung looking onto low cost HNM3 |
8/26/2016 |
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Samsung is proposing a low-cost HBM that would reduce costs in multiple ways. The number of connects per-die would shrink, reducing the number of vias required for each chip. The company wants to replace the large silicon interposer with an organic layer, and believes it can cut costs by removing the on-die buffer as well.
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| Analyst : China's bid for semi dominance unrealistic |
8/25/2016 |
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China’s effort to build a world-leading semiconductor industry is part of a broader effort to wean itself off foreign technology. But financial investment will not be enough to buy leadership of the semiconductor sector, which is worth around $1 trillion according to Singapore-based Bain partner Kevin Meehan.
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| Foundry business to grow 9% this year |
8/25/2016 |
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For 2016, the pure-play foundry market is expected to increase by 9% and greatly outperform the growth rate of total IC market, which is forecast to drop by 2% this year.
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| European simi distributor see slow business |
8/25/2016 |
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While Eastern Europe, Germany, Austria, Iberia and Turkey held up well, France and Italy finished on average and the UK, Switzerland, Norway, Sweden, Belgium, Luxembourg, Russia, Poland and Israel came back negative.
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| Consumer product recall at its height |
8/25/2016 |
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Index found that recall activity increased over the second quarter of 2016 across sectors, highlighting the continued importance of recall preparedness, communication and execution.
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| Rumor - Apple iPhone will have curved display next year |
8/24/2016 |
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Next year's lineup of iPhones could include three different and distinct variants: a "4.7-inch model, another that will be 5.5-inches and a premium handset that will be either 5.5-inches or larger equipped with a screen bent on the two sides."
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| Nvidia announced mobile processor for autonomous cars |
8/24/2016 |
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The Drive PX 2 uses two Parker processors and two Pascal-based graphics processing units (GPUs) to power deep-learning applications for self-driving cars. Such cars have to be smart enough to recognize visual obstacles, such as bikers or pedestrians.
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| Samsung is setting up to refurbish smartphones |
8/23/2016 |
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The world's top smartphone maker will refurbish high-end phones returned to the company by users who signed up for one-year upgrade programs in markets such as South Korea and the United States. Samsung would then re-sell these phones at a lower price.
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| Cypress offer complete USB 3 power delivery interface solution |
8/23/2016 |
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USB PD 3.0 provides a number of key enhancements over the current version of the spec, USB PD 2.0 improving the robustness of power sources, sinks and cables. Cypress’s EZ-PD CCG3 and CCG4 USB-C port controllers are believed to be the first solutions to support the USB PD 3.0 specification from the USB Implementers Forum (USB-IF).
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| Renesas wants to buy Intersil |
8/23/2016 |
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Intersil makes chips essential to regulating power in such products as automobiles, industrial machinery and smartphones. It supplies automakers in the U.S., Europe and Asia, and more of its offerings are expected to find their way into electric cars and fuel cell vehicles.
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| China looks to buy Korean chip design technology |
8/23/2016 |
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Tsinghua is in talks to buy Korean fabless, or semiconductor, firms that design chips without production facilities, such as Silicon Mitus, Map and Zinitix, according to Chosun Biz.
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| Galaxy Note 7 pre-sale broke all record |
8/22/2016 |
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Judging from the successful pre-order of Galaxy Note 7, it’s estimated that the total shipments of the model will reach up to 18 million units by the end of 2016.
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| Mobile DRAM business is good |
8/22/2016 |
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Global sales of mobile DRAM increased 17.2% sequentially to US$3.93 billion in the second quarter of 2016. Rising smartphone shipments from China-based vendors including Huawei, Oppo and Vivo, as well as the overall bit supply, led to the revenue increase.
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| Altera Stratix 10 to sell under Intel label by year end |
8/22/2016 |
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Krzanich pledged to ship before the end of the year Altera’s flagship, the Stratix 10 FPGAs. It will wear the Intel brand and use both Intel’s 14nm process technology and be the first chip to use its embedded multi-die interconnect packaging technology.
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| DDR5, the next generation DRAM |
8/22/2016 |
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Specifications for DDR5 memory will be released this year, and deployment of the DRAM will begin in 2020, according to a slide deck presented at the Intel Developer Forum this week.
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| Merger on major wafer suppliers |
8/19/2016 |
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GlobalWafers Co. says greater market share can be achieved in the silicon-wafer market after the Taiwanese supplier to chipmakers agreed to buy SunEdison Semiconductor Ltd. for $683 million including debt, adding new customers and production facilities.
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| SK Hynix debutes UFS 2.1 memory |
8/19/2016 |
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It provides more than three times faster sequential read performance compared to that of the existing embedded Multi Media Card (eMMC) 5.1, reading and writing sequentially at 800 megabytes and 200 megabytes per second, respectively.
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| Samsung to spearhead UFS memory |
8/19/2016 |
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“As King Arthur subjugated the whole nation with the magical sword Excalibur, the Excalibur of a future mobile world will be none other than UFS.” said Cho Hee-chang, a senior research fellow at the Memory Business Division at Samsung Electronics.
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