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| Toshiba to build new factory for 3D NAND Flash |
3/18/2016 |
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The company is investing in the plant, which will make its proprietary 3D flash chips, over a period of three years till March 2019. Toshiba expects output to begin no earlier than 2018.
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| Acura to produce NSX Super car in U.S. |
3/18/2016 |
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The 2017 NSX starts at $156,000 and features a 3.5-liter twin-turbocharged V-6 engine with 573 horsepower that is hand-built in nearby Anna, Ohio.
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| WD shareholders approved SanDisk merger |
3/17/2016 |
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Western Digital shareholders voted to issue new stock to finance the acquisition. The transaction is expected to close in the second quarter of this year.
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| Most of Google Search are encrypted |
3/17/2016 |
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Encryption shields 77 percent of the requests sent from around the world to Google's data centers, up from 52 percent at the end of 2013, according to company statistics released Tuesday.
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| U.S. regulators approved Microchip acquisition of Atmel |
3/16/2016 |
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Microchip (Chandler, Ariz.) said the U.S. Federal Trade Commission cleared the transaction on March 11 and that the German Federal Cartel Office cleared it on Feb. 26. The Korea Fair Trade Commission (KFTC) is the only agency still reviewing the deal from an anti-trust perspective.
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| What is up with Virtual Reality? |
3/16/2016 |
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Oculus and HTC both said initial orders for the Rift and Vive systems sold out within minutes. A consumer edition of the lower-powered Samsung Gear VR, a mobile Oculus headset that works with Samsung smartphones, sold out when it was first released last year.
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| SMIC license ReRAM technology from Crossbar |
3/15/2016 |
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The deal will enable customers of Semiconductor Manufacturing International Corp. (SMIC) to integrate non-volatile ReRAM blocks based on its 40nm CMOS manufacturing process into microcontrollers and SoCs aimed at a wide swatch of markets.
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| DARPA working on new chip cooling technology |
3/15/2016 |
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The goal is to enhance the performance of RF MMIC power amplifiers and embedded high performance computing systems through chip-level heat removal techniques. Basically, they’re developing a way to cool high-powered microchips from the inside using microscopic drops of water.
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| 3D XPoint memory to be in MacBooks |
3/14/2016 |
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Optane is a brand name for a new type of memory and SSD based on 3D Xpoint, a technology jointly developed by Intel and Micron that can be 10 times denser than DRAM, and 1,000 times faster and more durable than flash storage.
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| DARPA to develope vertical takeoff unpiloted aircraft |
3/14/2016 |
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The goal is to build a demonstrator aircraft that can reach a top sustained speed of 300 to 400 knots and carry cargo loads of at least 40 percent of the plane's expected 10,000- to 12,000-pound gross weight.
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| What is in the next Android? |
3/14/2016 |
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By the time phones running on the software hit the market this fall, Android N is expected to eventually be named after a sweet food beginning with "n'' in the tradition of all the previous versions that Google has made.
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| Qualcomm works with Red Hat to boost ARM server chips |
3/11/2016 |
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In an effort to exploit advanced features on its server chips and appeal to as many developers as possible, Qualcomm is working with Red Hat to port a version of the Enterprise Linux Server for ARM Development Preview.
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| VW emmissions probe extends to employees |
3/10/2016 |
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In May 2014, the company denied allegations that it misled investigators and attributed the problem to a group of lower-level employees "whose identity is still being determined."
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| Sloppy corporate data management caused Apple to hesitate |
3/10/2016 |
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“We see this everyday where government and private agencies hand out mobile devices to employees and then fail to install the simple mobile device management software that could keep the company or agency itself safe from attack."
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| U.S. put Chinese ZTE under restrictions |
3/9/2016 |
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The sanctions took effect Tuesday after ZTE was found to be "acting contrary to the national security or foreign policy interests" of the U.S., the Commerce Department said. The department released documents it said showed ZTE set up front companies to evade U.S. controls on high-tech exports to Iran.
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