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| Chinese's love for Fairchild does not cease |
1/4/2016 |
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Fairchild, which agreed to a merger last month with ON Semiconductor Corp., said it received a revised, unsolicited acquisition offer of $21.70 a share in cash. That would value the company’s equity at $2.46 billion. The amended proposal from a bidder from the same group led by China Resources’ semiconductor arm.
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| Qualcomm's Snapdragon found its way into drones |
1/4/2016 |
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The company has begun teasing its drone-related news to be announced at CES 2016 next week, and has demoed Snapdragon Flight, its new drone system, complete with an autopilot mode.
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| Samsung to mass produce 14nm NAND |
12/30/2015 |
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While everybody else is finishing up designs on flat NAND memory chips measuring an incredible 14nm, Samsung is already preparing to enter mass production on their own design.
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| Samsung up $2 billion investment into Vietnam |
12/30/2015 |
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A Ho Chi Minh City government official said the Vietnamese government had given a green light to Samsung Asia Pte Ltd [SAMECP.UL] increasing its investment in the city's Saigon Hi-Tech Park.
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| Samsung dedicated processor for wearable health monitoring |
12/30/2015 |
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According to Soreon Research, the wearables market could be worth more than $41 billion in 2020, which is why some companies are planning to get a piece of the billion-dollar pie by offering high-tech products with sophisticated capabilities.
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| Chairman of China Telecom being investigated |
12/29/2015 |
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Chinese President Xi Jinping’s ongoing corruption investigations have already included leading politicians, bosses of state enterprises and senior bankers. The party watchdog cracked down on more than 70 senior officials at state firms in 2014.
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| Intel completd merger of Altera |
12/29/2015 |
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In August, Jason Waxman, vice president of Intel’s cloud platform group, said he expected that FGPAs could represent a third of the processors running all data center operations in 2020.
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| Renesas 6 month CEO resigned |
12/29/2015 |
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Renesas has appointed Tetsuya Tsurumaru, the Representative Director, President and COO to the position of Representative Director, President and CEO effective immediatelyy.
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| Hon Hei proposed to buy Sharp |
12/28/2015 |
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The proposed acquisition price is about 50 percent higher than Sharp's current market value, indicating that Hon Hai wants to use the good offer to gain the upper hand and win consensus from the Japanese firm during negotiations for the acquisition.
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| Mediatek Helio X20 scores high on benchmark |
12/28/2015 |
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Mediatek Helio X20 chipset (or SoC) that has not quite gone under the spotlight as much as the Snapdragon 820 from Qualcomm, but it has appeared on a GeekBench posting with some rather impressive results.
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| AMD to use Samsung foundry services |
12/23/2015 |
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Samsung Electronics’ System LSI Foundry Business Department will start mass-producing AMD’s new GPU ‘Greenland (development code name)’ along with Global Foundry (GF) starting from 2nd quarter of 2016.
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| Startup offers new low-K dielectric material for semiconductor |
12/23/2015 |
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SBA Materials has an impressive roster of investors – Intel Capital (through three rounds in two years), Samsung Venture Investment Corporation, Air Liquide Venture Capital, Tokyo Electron Venture Capital, Rock Hankin, William Cook (a co-founder and former CEO of the startup), Southern Cross Venture Partners, and Sun Mountain Capital.
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| Packaging Conference full of TSV presentations |
12/22/2015 |
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Attendees heard presentations from executives of Amkor Technology, the Defense Advanced Research Projects Agency (DARPA), Northrop Grumman, Taiwan Semiconductor Manufacturing, Teledyne Scientific & Imaging, and Xilinx, among other companies.
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| Toshiba to spin off mainstay flash memory chip division |
12/21/2015 |
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Toshiba has gained a competitive edge in the market for NAND flash memory, used in smartphones, tablet devices and other products, but has faced fierce competition with foreign rivals, including Samsung Electronics Co.
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| ARM wants to supply system and software also |
12/21/2015 |
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To address the market for internet-connected IoT devices, for example, ARM has partnered with IBM to create a complete IoT development platform with hardware, embedded software and cloud computing services.
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