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Microsoft to trim additional 1,000 |
10/23/2015 |
The cuts are in addition to earlier moves to shed about 7,800 jobs in connection with plans to scale back the former Nokia Corp. handset business.
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Texas Instruments to gain on automobile electronics |
10/23/2015 |
TI is benefiting not only from the growth in U.S. car sales, but also because cars are getting smarter. The company’s chips are in automobile navigation systems, and brake safety and lane changing systems.
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Rail safety rules to delay |
10/23/2015 |
Rail companies currently face a Dec. 31 deadline to implement positive train control, a GPS-based system that can track train movements and automatically slow or stop them from entering dangerous situations.
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WD reached agreement to acquire SanDisk |
10/22/2015 |
The transaction is subject to shareholder and regulatory approval and is expected to close in the third quarter of 2016. It has been approved by the boards of directors of both companies.
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Memrister made tri-level |
10/20/2015 |
The component has three stable resistive states. As a result, it can not only store the 0 or 1 of a standard bit, but can also be used for information encoded by three states – the 0, 1 and 2 of a ‘trit’.
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Powerchip to build new 12 inch fab in China |
10/20/2015 |
Powerchip in mid-2015 announced the company had reached an agreement with Hefei Construction Investment and Holding to invest in a wafer foundry in Hefei in the Chinese province of Anhui. The foundry will be a 12-inch fab running 0.15-micron, 0.11-micron and 90nm manufacturing processes initially for LCD driver
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AMD sold package plant in Asia |
10/20/2015 |
The deal is consistent with AMD’s strategy to “focus the company on improving our long term financial performance by building great products and simplifying our business model."
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Intel purchased VIA Telecom for modem technology |
10/16/2015 |
“CDMA is required for any smartphone on Verizon’s huge network. Without CDMA. CDMA is also required elsewhere in some networks in Taiwan, Korea, and for China Telecom. Intel cannot be a major player in the LTE modem market.”
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TSMC introduced lower cost version of 16nm FinFET process |
10/16/2015 |
TSMC president and co-CEO CC Wei suggested previously that the 16FFC process will be ready for volume production in the second half of 2016. Wei also estimated that TSMC's 16nm FinFET technology will receive a total of about 50 product tape-outs covering different chip products.
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Counterfeit is blooming, thanks to the online world |
10/16/2015 |
"Counterfeiters have proven every bit as adaptable and creative as big business, with the Internet allowing them to refine approaches, increase reach and target the lucrative world of online buyers,"
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