Home
News
Products
Corporate
Contact
 
Saturday, March 8, 2025

News
Industry News
Publications
CST News
Help/Support
Software
Tester FAQs
Industry News
TI adds more platform for DLP Applications 8/20/2008
Texas Instruments has unveiled a new platform designed to ease the development of applications for digital light processors (DLP).
Intel unveils its own SSD Drive 8/20/2008
Intel have launched a family of solid-state drives claiming significant performance advances over its many competitors.
Hynix unveiled 16GB DDR3 DIMM at IDF 8/20/2008
Hynix announced that it is using MetaRAM's new DDR3 technology in its next generation R-DIMMs, including the world's first 16GB 2-rank DIMM Memory.
Hynix adds more investment stake at ProMos 8/19/2008
Hynix Semiconductor will become the second-largest institutional shareholder at Taiwan 's ProMOS.
SIS to postpone spin-off till next year 8/19/2008
Silicon Integrated System (SiS) has announced it will postpone the planned spin-off of three subsidiaries from the original schedule of September 1 this year to January 1 next year.
IBM unveils 22-nm SRAM Memory 8/19/2008
IBM and its development partners have claimed their first working SRAM cell implemented in a 22-nm manufacturing process. The SRAM cell was built at its 300-mm fab in Albany, New York.
Elpida unveils 16GB FBDIMM Memory 8/18/2008
Elpida Memory announced a 16GB Fully Buffered DIMM (FB-DIMM) that is composed by 2Gb of DDR2 components.
Toshiba unveils 32GB embedded NAND flash 8/18/2008
Toshiba announced the launch of the 32GB embedded NAND flash memory modules that are thelargest density yet announced, with the modules also having full compliance with the e-MMC and eSD standards.
Elpida delivers 2.5Gbps DDR3 chip 8/18/2008
Elpida Memory have developed a 1Gb DDR3 SDRAM that delivers a speed up to 2.5Gbps
Intel unveils smaller version of SSD 8/15/2008
Intel has introduced a smaller version of its solid-state drive for mini-notebooks, an emerging PC category that's showing strong market growth worldwide.
Intel help push CPU unit shipment growth 8/15/2008
The PC processor business grow 3.1 percent in unit shipments in the June quarter with Intel drove most of the growth, but intense price competition drove revenues down 4.5 percent, according to International Data Corp. said.
Rambus to cut headcount on cost saving 8/15/2008
Rambus Inc. said it will reduce its workforce by approximately 90 positions or about 21 percent of its headcount and will take a restructuring charge of about $4.0 million in the next two quarters.
Applied Material reports lower earnings 8/14/2008
Applied Materials Inc.'s third-quarter net income dropped 65% on lower sales and margins.
Sandisk see new applicants for NAND flash 8/14/2008
The NAND flash memory market is still seeing a horrific downturn, as the industry is saddled with too much capacity
Philips unload all TSMC shares 8/14/2008
Royal Philips Electronics has sold approximately 383 million shares of common stock in Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC).
Crocus to run MRAM prototype production 8/13/2008
Crocus Technologies Inc. claims that it has qualified its manufacturing environment for the development and prototyping of its MRAM technology.
Best Buy to carry iPhone after Labor Day 8/13/2008
Best Buy said Wednesday it will begin selling the hot Apple device in its retail outlets after Labor Day.
Sub-notebook - a huge market for SSD 8/13/2008
SSD vendors may have finally found a ''killer application'' for SSDs, which are based on NAND flash memories. The ultra mobile PC, netbook and related sub-notebook segments could become a big driver for SSDs, said Doreet Oren, director of product marketing for SSDs at SanDisk Corp.
AMD Dresden production manager left 8/13/2008
After less than two years at AMD's Dresden site, the company's manufacturing vice president Elke Eckstein has moved on. One of Germany's very few female semiconductor managers now is Chief Operating Officer for Osram Opto Semiconductor in Regensburg
Global wafer shipments increase 6%, SEMI said 8/12/2008
Reflecting macroeconomic concerns and following the slightly weaker Q1, silicon wafer area shipments on a worldwide basis grew more than 6% sequentially during Q2 over Q1 area shipments
Samsung, Unidym extends collaboration in carbon nanotube technology 8/12/2008
Unidym Inc., a subsidiary of Arrowhead Research Corp., has entered into a second joint development agreement with Samsung Electronics Co. Ltd. to extend their collaboration into a second year.
Toshiba unveils 32GB NAND flash 8/12/2008
Toshiba Corp. launched 32GB embedded NAND flash memory devices that fully comply with the eMMC and eSD standards.
Lenovo reports $110 million quarterly profit 8/11/2008
Lenovo Group Ltd., the world's fourth-largest PC maker, posted a 65.3 percent rise in net quarterly profit, the slowest growth in a year, as it copes with a U.S. slowdown and weaker Chinese demand after a devastating earthquake.
TSMC, UMC July sales dropped 8/11/2008
TSMC and UMC both announced July sales that were weakened by the global slowing on a macroeconomic level.
Intel to release energy saving Core i7 chip 8/11/2008
Intel Corp. said it plans to sell its new generation of chips for desktop computers under the established "Core" brand, with the first chips of the new line to be called Core i7.
 614  |  615  |  616  |  617  |  618  |  619  |  620  |  621  |  622  |  623 

CST Inc. Memory Tester DDR Tester
Copyright © 1994 - 2023 CST, Inc. All Rights Reserved