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| SEMICON China 2022 cancelled |
5/18/2022 |
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SEMI has cancelled SEMICON China 2022, originally scheduled for June 15-17 at the National Exhibition and Convention Center (NECC) in Shanghai, due to the ongoing COVID-19 pandemic and related government control measures in the region.
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| Startup Axelera Unveils AI Test Chip |
5/18/2022 |
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AI chip startup Axelera has tested and validated a chip as a test vehicle for its Thetis digital in–memory compute core. The company’s tests show the 12–nm chip can achieve 39.3 TOPS with a power efficiency of 14.1 TOPS/W in an area of 9mm2.
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| SMIC post 67% revenue growth for Q1 |
5/17/2022 |
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SMIC has reported a revenue of $1.84 billion in the first quarter of 2022 (1Q22), up by 16.6% from the previous quarter, and by 66.9% from the same period last year.
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| Micron to apply new memory chip price model |
5/16/2022 |
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Chipmaker Micron Technology Inc (MU.O) on Thursday announced it was experimenting with a new pricing model for its chips called forward pricing agreements that would aim to stabilize the steep price fluctuations that plague the industry.
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| Software to differentiate the future EV |
5/16/2022 |
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There are of course many facets to why software is important. It allows for brand differentiation, it allows new services to be delivered over the lifetime of the car, it allows for new mobility models, and more.
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| EV batteries do not give zero carbon footprint |
5/16/2022 |
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The carbon footprint of mining and producing the raw materials used in batteries is comparable with that of tailpipe emissions. The e-mobility revolution has hidden expenses, including the recycling of battery components.
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| NAND Flash wafer prices start to slide |
5/13/2022 |
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suppliers are increasingly motivated to cut prices in exchange for sales due to weak retail demand since March, and a more conservative outlook for shipments of other end products, according to TrendForce.
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| Western Digital to meet cloud challenges with HDD and SSD |
5/13/2022 |
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Western Digital Corp.’s (WD) latest batch of new storage products is a reminder that hard drive technology isn’t going anywhere as customers of all sizes grapple with exponential data growth and raise their performance expectations of storage media.
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| MIPS to focus on RISC-V based multiprocessor IP core products |
5/13/2022 |
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The company said its new eVocore family of IP cores are highly scalable and configurable, enabling customers to blend coherent clusters of multi-threaded, multi-core CPUs in unique combinations to meet their exact power and performance requirements.
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| India's ISMC is getting closer to build a new IC fab |
5/12/2022 |
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The project would invest about $3 billion in a 65–nm analog chip fab, according to a statement by India’s Next Orbit Ventures, a fund management firm that aims to kickstart the effort. Israel’s Tower Semiconductor said it will be a technology provider for the project.
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| Infineon offers Coreless Current Sensor Ideal for EV Applications |
5/12/2022 |
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The coreless open loop current sensor offers an accurate and stable current measurement – provided as an analog output voltage. Based on Infineon’s market-proven temperature and stress compensation the measurement error is very low with proper calibration. TLE4972 adopts differential measurement concept which suppresses common mode magnetic interferences and is suitable to operate precisely in a magnetically noisy environment.
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| Samsung offers first DRAM memory module in CXL format |
5/11/2022 |
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The new CXL DRAM is built with an application-specific integrated circuit (ASIC) CXL controller and is the first to pack 512GB of DDR5 DRAM, featuring four times the memory capacity and one-fifth the system latency over the previous Samsung CXL offering.
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| TI offers new solid-state relays safer for EV |
5/11/2022 |
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Texas Instruments Inc. (TI) has launched a new portfolio of solid-state relays, including automotive-qualified isolated drivers and switches, that deliver industry-leading reliability to help make electric vehicles (EVs) safer. The new isolated solid-state relays also provide the smallest solution size while reducing the bill-of-materials (BOM) cost of powertrain and 800-V battery-management systems.
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| 300mm fabs are being built for analog and power semiconductors |
5/11/2022 |
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Among the 10 300-mm fabs scheduled to begin operations in 2022, two will be focused on producing non-IC products like power semiconductors. One is a CR Micro fab in Chongqing, China for power semiconductors, and the other fab in Xiamen, China.
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