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Major fab expansion are likely concentrated in Taiwan and Korea 6/16/2022
Taiwan and South Korea will account for more than half of the $109 billion in expenditures on fab equipment this year.
Korea's unionized truckers strike might affect semiconductor Supply Chain 6/15/2022
The eight-day strike has delayed cargo shipments for industries from autos to petrochemicals and spirits in the export-heavy nation, and cost South Korea's industry more than $1.2 billion in lost output and unfilled deliveries, according to the industry ministry.
IC gear spending to exceed $109 billion this year 6/15/2022
Front-end fab equipment spending is expected to increase 20% y-o-y to an all-time high of $109 billion in 2022, marking a third consecutive year of growth following a 42% surge in 2021, reports SEMI.
SK hynix supplied the first HBM3 DRAM module to Nvidia 6/15/2022
The announcement comes just seven months after the company became the first in the industry to develop HBM3 in October, and is expected to solidify the company’s leadership in the premium DRAM market.
Altair has acquired Concept Engineering 6/15/2022
Altair has acquired Concept Engineering, a provider of electronic system visualization software that accelerates the development, manufacture, and service of complex electrical and electronic systems.
Global semiconductor shortage shows signs of turning around 6/14/2022
Mercedes Benz AG, Daimler Truck Holding AG, and BMW AG are among carmakers now getting enough of the high-tech components to produce at full capacity after experiencing crippling outages for months.
Top ten chip design company total revenue to exceed $39 billions in Q1 6/14/2022
Qualcomm, NVIDIA, and Broadcom ranked in the top three and, after the acquisition of Xilinx, AMD surpassed MediaTek to take fourth position. According to TrendForce, tracking of IC design industry trends.
Qualcomm seals up acquisition deal for startup Cellwize 6/14/2022
“It brings in-house key software assets in the form of the non real time RIC and service management and orchestration (SMO), as well as AI and machine learning capabilities to help accelerate 5G RAN deployments including bridging from non-open RAN deployments.”
Intel new chip lineup includes faster and cheaper processors 6/14/2022
This week, Intel is expected to detail just how it's going to make chips in the near future that are faster, less costly and more reliable from a manufacturing standpoint .
Denso Corp. may consider spinning off its chip business for $3.1 billion 6/13/2022
Well known as the world’s second-biggest auto-parts maker, Denso has also quietly built up a presence in automotive chips. Now, with semiconductor-related capital expenditures totaling around 160 billion yen over the past three years, Denso ranks as the world’s fifth-largest supplier of automotive chips by sales.
Purdue University offers specialized semiconductor engineering degree 6/13/2022
“In order to satisfy the increased demands that we see with perhaps 13 new fabs being built in the U.S. over the next five years or so, we see a demand for something like 50,000 new semiconductor engineers,” Mark Lundstrom, a professor of Electrical and Computer Engineering at Purdue University, told EE Times. “That’s more than double the number of semiconductor engineers that U.S. universities are currently producing.”
IDC predicts Semiconductor equipment market to pull back in 2022 6/13/2022
IDC warns that chip manufacturers building new capacity could lead to a glut of chips.
Renesas Electronics offers MPU geared for motor drives 6/13/2022
The RZ/T2M combines fast and highly precise real-time motor control capabilities and the latest industrial Ethernet on a single-chip, while also supporting functional safety operation. By providing all essential peripheral functions for motor control, the RZ/T2M enables customers to reduce the number of external components, thereby decreasing BOM costs and product size.
Powertech Technology (PTI) to see memory backend assembly and test business to increase 6/10/2022
Despite some noises on the market suggesting slowdowns in handsets and other consumer devices are dragging down both DRAM and NAND flash prices, PTI has been busy fulfilling orders from its Japan-based client in the second quarter.
Senator Maria Cantwell convene a classified briefing with Pentagon officials and Intel 6/10/2022
Lawmakers will negotiate a compromise measure to provide $52 billion in subsidies for U.S. semiconductor manufacturing.
Chip shortage puts further stress on Engineering resources 6/10/2022
Many believe the worldwide chip shortage issue will not ease until 2023, and it is set to get worse over the next 18 months as longer lead times and higher prices kick in due to major disruption of supply lines and production capability. This has triggered the need for new strategies from Governments and companies to counter the situation.
6G will offer download speeds approaching one terabit per second, and unlimited bandwidth 6/10/2022
6G technology will make huge improvements in bandwidth utilization, data delivery, and application enablement. It is expected 6G will offer download speeds approaching one terabit per second, one micro-second latency, and unlimited bandwidth.
Western Digital Corp reviewing strategic alternatives, for splitting off its storage units 6/9/2022
The announcement comes a month after prominent activist investor Elliott Management disclosed a stake of nearly $1 billion in the company and pushed it to separate its flash and hard-drive business. Elliott owns roughly 6% in the California-based company.
Marvell joins the Universal Chiplet Interconnect Express (UCIe) Consortium 6/9/2022
Marvell’s contributions to the UCIe standard will leverage the company’s advanced chiplet interconnect and packaging experience to help further the consortium’s objective of developing open standards that create a more robust ecosystem for inter-operable chiplets.
TI processors help expand edge artificial intelligence (AI) processing into next-generation applications 6/9/2022
The low-power design of the new processors enables support for dual-screen displays and small-size human-machine interface (HMI) applications.
Siemens Sofware Secures Embedded RISC-V Development 6/9/2022
Siemens’ Nucleus ReadyStart embedded development solution includes a host of new features that help customers enhance the security, flexibility, and cloud connectivity of their next-generation embedded products based on the RISC-V architecture.
NEC Corp to collaborate with NTT Docomo Inc. And Nippon Telegraph on 6G experimental trials. 6/8/2022
6G will require dramatic advances in communications technology to achieve 10 to 100 times higher speeds and capacities than 5G, with ultra-low power consumption of 1/100 and coverage that reaches from the depths of the ocean to the heights of outer space.
99% of EV buyers want wireless charging 6/8/2022
It is clear that wireless charging is set to transform the EV ownership experience, reducing barriers for adoption and improving the public charging landscape with interoperability.
Siemens Software’s now enables designers to leverage the newest GlobalFoundries silicon photonics platform 6/8/2022
GF Fotonix is the first in the industry to combine its differentiated 300mm photonics and RF-CMOS features on a silicon wafer, delivering best-in-class performance at scale.
TSMC commits to 2 nm node through Nanosheet Technology 6/8/2022
TSMC has chosen nanosheet technology for production of its next 2 nm node starting in 2025 to help cut energy consumption in high–performance computing (HPC) systems.
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