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| Software to differentiate the future EV |
5/16/2022 |
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There are of course many facets to why software is important. It allows for brand differentiation, it allows new services to be delivered over the lifetime of the car, it allows for new mobility models, and more.
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| EV batteries do not give zero carbon footprint |
5/16/2022 |
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The carbon footprint of mining and producing the raw materials used in batteries is comparable with that of tailpipe emissions. The e-mobility revolution has hidden expenses, including the recycling of battery components.
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| NAND Flash wafer prices start to slide |
5/13/2022 |
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suppliers are increasingly motivated to cut prices in exchange for sales due to weak retail demand since March, and a more conservative outlook for shipments of other end products, according to TrendForce.
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| Western Digital to meet cloud challenges with HDD and SSD |
5/13/2022 |
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Western Digital Corp.’s (WD) latest batch of new storage products is a reminder that hard drive technology isn’t going anywhere as customers of all sizes grapple with exponential data growth and raise their performance expectations of storage media.
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| MIPS to focus on RISC-V based multiprocessor IP core products |
5/13/2022 |
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The company said its new eVocore family of IP cores are highly scalable and configurable, enabling customers to blend coherent clusters of multi-threaded, multi-core CPUs in unique combinations to meet their exact power and performance requirements.
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| India's ISMC is getting closer to build a new IC fab |
5/12/2022 |
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The project would invest about $3 billion in a 65–nm analog chip fab, according to a statement by India’s Next Orbit Ventures, a fund management firm that aims to kickstart the effort. Israel’s Tower Semiconductor said it will be a technology provider for the project.
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| Infineon offers Coreless Current Sensor Ideal for EV Applications |
5/12/2022 |
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The coreless open loop current sensor offers an accurate and stable current measurement – provided as an analog output voltage. Based on Infineon’s market-proven temperature and stress compensation the measurement error is very low with proper calibration. TLE4972 adopts differential measurement concept which suppresses common mode magnetic interferences and is suitable to operate precisely in a magnetically noisy environment.
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| Samsung offers first DRAM memory module in CXL format |
5/11/2022 |
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The new CXL DRAM is built with an application-specific integrated circuit (ASIC) CXL controller and is the first to pack 512GB of DDR5 DRAM, featuring four times the memory capacity and one-fifth the system latency over the previous Samsung CXL offering.
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| TI offers new solid-state relays safer for EV |
5/11/2022 |
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Texas Instruments Inc. (TI) has launched a new portfolio of solid-state relays, including automotive-qualified isolated drivers and switches, that deliver industry-leading reliability to help make electric vehicles (EVs) safer. The new isolated solid-state relays also provide the smallest solution size while reducing the bill-of-materials (BOM) cost of powertrain and 800-V battery-management systems.
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| 300mm fabs are being built for analog and power semiconductors |
5/11/2022 |
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Among the 10 300-mm fabs scheduled to begin operations in 2022, two will be focused on producing non-IC products like power semiconductors. One is a CR Micro fab in Chongqing, China for power semiconductors, and the other fab in Xiamen, China.
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| Semiconductor Chip Bill moves ahead |
5/10/2022 |
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Members of Congress will meet Thursday to open negotiations on a compromise measure that would fund $52 billion in semiconductor manufacturing subsidies and boost U.S. competitiveness with Chinese technology.
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| 9% spending growth predicted for R& D |
5/10/2022 |
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Research and development (R&D) spending by semiconductor companies worldwide is forecast to grow by 9% in 2022 to $80.5 billion after climbing by an above average 13% in 2021 to a record-high $71.4 billion,
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| Lisa Su to keynote at COMPUTEX 2022 |
5/10/2022 |
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Dr. Lisa Su, Chair and CEO of AMD, will be the first speaker of the COMPUTEX 2022 CEO Keynote series. The digital keynote will take place on May 23, at 2:00 PM (UTC+8), with the keynote theme “AMD Advancing the High-Performance Computing Experience.”
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| Kyocera to build $500M IC packaging factory |
5/9/2022 |
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Kyocera has announced a plan to build a $500m manufacturing facility, the largest it has ever operated in Japan, expanding production capacity for components including organic semiconductor packages and crystal device packages.
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| Apple Hires 31-Year Ford Veteran to Ramp Up Electric-Car Work |
5/9/2022 |
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The tech giant hired Desi Ujkashevic for the car project, according to people with knowledge of the matter. Ujkashevic had worked at Ford since 1991, most recently serving as its global director of automotive safety engineering. Before that, she helped oversee engineering of interiors, exteriors, chassis and electrical components for many Ford models.
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| Kubos is working on improving its cubic GaN technology to make more efficient LEDs |
5/9/2022 |
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Kubos Semiconductors Ltd., a developer of LEDs based on cubic gallium nitride, has identified in collaboration with researchers at Manchester and Cambridge Universities the potential for Kubos’s proprietary material to deliver LEDs capable of switching at faster speeds than those produced in the hexagonal crystal phase.
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| GlobalFoundries announced a US$117 million agreement with DoD |
5/6/2022 |
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GlobalFoundries has announced a US$117 million agreement with the US Department of Defense (DoD) to provide a strategic supply of US-made semiconductors that are critical to national security systems. Securely manufactured at GF's Fab 8 in Malta, New York.
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| A power struggle at Arm China |
5/6/2022 |
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Wu, Arm China and its British parent Arm Ltd have been embroiled in a two-year-long dispute and the latest development shows a resolution is not imminent.
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| Apple is going after engineers for steaing SOC design |
5/6/2022 |
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Apple’s lawsuit claims that Rivos, which has hired over 40 former Apple employees in the past year, has committed trade secret theft of its homegrown chip designs. The lawsuit especially names two former Apple engineers as defendants in this case:
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