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| Toshiba shareholders voted against splitting the company |
3/25/2022 |
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Toshiba shareholders voted against the management’s plan to split the company into two parts – infrastructure products and devices. Shareholders also voted against a proposal by activist shareholder 3D Investment Partners of Singapore to consider other options including a sale of the company to private equity.
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| Intel CEO Pat Gelsinger urged US Congress to pass Chip Bill |
3/25/2022 |
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Gelsinger made his comments alongside the CEOs of memory vendor Micron and semiconductor equipment maker LAM Research during a US Senate Committee hearing that largely focused on the pros and cons of passing subsidies for chipmakers.
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| IC production reports minimal damage by quakes in Japan |
3/25/2022 |
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According to TrendForce, in the main quake zone, only Kioxia’s K1 Fab (located in Kitakami) will face the possibility of a further downgrade to 1Q22 production. Some of the remaining memory or semiconductor companies in the region are conducting machine inspections but the overall impact has been muted.
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| Tablet shipment increased by 76% in Thailand |
3/25/2022 |
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According to the International Data Corp.’s (IDC) Quarterly Personal Computing Device Tracker, Heightened demand for online grocery and food delivery services amid the coronavirus outbreak also drove commercial usage.
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| Qualcomm se $100M as Snapdragon Metaverse Fund |
3/24/2022 |
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Qualcomm announced this week its Snapdragon Metaverse Fund, which boasts a total investment of $100 million meant to support both developers and companies actively producing extended reality (XR) ecosystems as well as the augmented reality (AR) and artificial intelligence (AI) technologies designed to advance the XR experience.
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| In-memory computing draws attention |
3/24/2022 |
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As interest in artificial intelligence (AI) and in-memory computing significantly increases, resistive random-access memory (ReRAM) could be the key to unlocking their ability to imitate the human brain—yet challenges remain.
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| Nvidia unveiled its next-generation GPU architecture — named Hopper |
3/23/2022 |
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Nvidia has not opted to go down the trendy chiplets route favored by Intel and AMD for their mammoth GPUs. While the H100 is the first GPU to use HBM3, its compute die is monolithic, 80 billion transistors in 814mm2 built on TSMC’s 4N process. Memory and compute are packaged via TSMC’s CoWoS 2.5D packaging.
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| Knockoff semiconductors hazardous to national security |
3/22/2022 |
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The fear is that within the planet's complex supply chains, someone under pressure from customers to fulfill orders by any means necessary accepts components that turn out to be fake, and these will end up in equipment. These parts can be readily picked up from online marketplaces, and they look convincing enough.
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| 5G-capable smartphones reached 51% globally |
3/22/2022 |
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Sales penetration of 5G-capable smartphones reached 51% globally in January 2022, surpassing the penetration of 4G smartphones for the first time, according to Counterpoint Technology Market Research’s Global Monthly Handset Model Sales Tracker.
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| Autotalks’ V2X chipset installed in approximately 2,000 buses along Seoul City’s expressways |
3/21/2022 |
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V2X communication involves communication between Vehicle-to-Vehicle (V2V), Vehicle-to-Infrastructure (V2I), and Vehicle-to-Pedestrian (V2P). In Seoul, V2X systems aim to intelligently alert bus drivers of pedestrian collision, school zones (i.e., areas in front of schools) and silver zones (i.e., a designated pedestrian safety zone for the elderly that adopts speed limit measures), as well as warn of road and weather conditions.
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