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Broadcom partners with Tencent on high-bandwidth co-packaged optics switches 8/26/2022 The company said it will deploy its first switch with optics inside, called Humboldt, in the cloud giant’s data centers next year. Taiwan National Cheng Kung University (NCKU) teams with Purdue University in Semiconductor R & D 8/25/2022 the two parties pledged to further enhance the collaboration of academic exchange, R&D, and talent development in semiconductors, and sustainable manufacturing. Hyundai Motor invest in Bos Semiconductors, an automotive semiconductor startup 8/25/2022 .Bos Semiconductor is a fabless startup which specializes in manufacturing system semiconductors used in automotive software. Intel developed new funding model with investor 8/25/2022 Brookfield Asset Management of Canada will pay for the two fabs previously announced by Intel in Chandler, Arizona on a 51-49% basis with Intel taking the 51% share plus operating control. Flexium Selects Keysight for Liquid Crystal Polymer Transceiver Applications 8/25/2022 Keysight Technologies Inc. and Flexium Interconnect Inc. are collaborating to improve millimeter wave modules and material test accuracy and efficiency. Electronics supply chain show signs of stabilizing 8/24/2022 Electronic component availability is improving, and prices are stabilizing across many categories, it concluded that global supply chain issues, extended lead times, geopolitical uncertainty, elevated logistics and labor costs would remain problematic for the electronics ecosystem and specific end markets into the first half of 2023. Semiconductor capital spending on track to $185.5B this year 8/24/2022 IC Insights forecasts that semiconductor capex will only grow by 21% to $185.5 billion this year, down from the projected $190.4 billion and 24% growth at the beginning of this year. Sony Semiconductor Solutions Corp.’s picks Efinix FPGA for HDR Camera Board 8/24/2022 The small form factor development kit leverages the tiny 3.6-by-4.5mm wafer level chip scale package available for the Trion T20, whose embedded MIPI, integrated DDR3, high I/O to logic ratio, and small physical size make it ideal for edge and IoT applications. Intel Graphics (AXG) Group Lags behind competitors AMD and Nvidia 8/24/2022 While the scars of Intel’s disastrous second-quarter results and closure of the Optane memory business are still fresh, a new report from John Peddie Research calls its GPU business results embarrassing. South Korea's semiconductor shipment to China continue to expand 8/23/2022 The research by the Korea Chamber of Commerce and Industry (KCCI) showed that semiconductors took up only 3.2 percent of South Korea's total exports to China in 2000 but jumped 12.4 times to 39.7 percent 20 years later. U.S. Chip 4 alliance could hold back China's momentum 8/23/2022 Chip 4 alliance is a proposed alliance of semiconductor powerhouses in the U.S., Taiwan, Japan, and South Korea to enhance cooperation on the design and production of sophisticated semiconductors. JEDEC advanced UFSHCI 4.0 standard 8/23/2022 UFS 4.0 introduces significant bandwidth and data protection improvements over the earlier version of the standard. Kyocera to construct a new production facility at its Kokubu Plant Campus in Kagoshima, Japan 8/23/2022 This will increase its production capacity of multilayer ceramic capacitors (MLCCs), strengthen engineering development capabilities, and ensure ample manufacturing space as Kyocera’s business expands. Applied Materials generated revenue of $6.52 billion for the quarter 8/22/2022 The company generated $1.47 billion in cash from operations and returned $1.23 billion to shareholders including $1.00 billion in share repurchases and $225 million in dividends. US EDA Software Ban May Affect China's Advanced IC Design 8/22/2022 Even if China purchased a large amount of authorized EDA software before the current sanction takes effect, the software must connect to the developer for license updates before it can be used. Cadence has collaborated with GlobalFoundries (GF) to accelerate 5G and mobile design innovation 8/22/2022 As a proof point, the Cadence full-flow RF solution was used to design and tape out a 28GHz 5G mmWave IC on the GF 22FDX platform and design an integrated antenna as a complete system-in-package (SiP) solution. EAC to highlight EV semiconductor contents 8/22/2022 The EV market is gradually taking off, driven by a combination of legislation, government tax breaks, and popularity with consumers. A recent Gartner forecast estimates 6 million electric cars will be shipped in 2022, up from 4.5 million in 2021, and this figure will reach 36 million cars by 2030. KIOXIA Europe is sampling new industrial-grade 3D NAND devices 8/19/2022 Densities range from 512 gigabits (64 gigabytes) to 4 terabits (512 gigabytes) to support the requirements of industrial applications - including telecommunication, networking, and embedded computing. Digi-Key to celebrate ribbon cutting of expansions at headquarters 8/19/2022 The new facility allows Digi-Key to pick, pack and ship nearly three times the previous daily average of 27,000 packages to customers in more than 180 countries around the world. Micron’ cuts Capex after announcing $40 billion expansion in the U.S. 8/19/2022 “We’re responding to a market condition where supply needs to be adjusted. We need to work through this and figure out a way to right-size the capacity.” Electronic Asia to show latest trends and technology developments in the electronics and semiconductor industry 8/19/2022 This year’s conference will focus on Internet of Things (IoT), automotive electronics, wireless technologies, and the supply chain. Samsung SDI forms battery R & D unit in Germany 8/18/2022 It will work with universities, research institutes and startups in various regions to improve the performance of batteries and develop a new generation as demand for electric vehicles grows. Teledyne LeCroy offers test equipment ready for USB4 8/18/2022 The merging of USB with Thunderbolt 3 into USB4 should eventually mean that users will have one I/O cable for everything. While consumers will have to wait until at least 2020 for the first USB4 products, engineers must first design and test those products. Silicon Motion offers NAND Memory Solutions for Autonomous and Electric Automotive Applications 8/18/2022 Any NAND flash storage device must keep pace with capacity requirements, low latency, and performance by delivering fast read and write speeds and high data throughput. Despite this consolidation, there will be a variety of different NAND storage types to support the required data storage demands in autonomous and electric vehicles. It is important to have softwaae defined cars 8/18/2022 The concept of the software–defined car contrasts with this vision and aims at the introduction of software distributed on a limited number of processors, which share sensors and the communication network to enable advanced features like autonomous driving, powertrain, body control and infotainment.  113  |  114  |  115  |  116  |  117  |  118  |  119  |  120  |  121  |  122

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