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| 2021 ends up with $103 billion in IC equipment sales |
12/16/2021 |
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IC equipment sales surged 44.7% from the previous industry record of US$71 billion in 2020, according to SEMI. The growth is expected to continue with the global total semiconductor manufacturing equipment market expanding to US$114 billion by 2022.
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| An open approach to FPGA development |
12/16/2021 |
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An open approach to FPGA development is emerging as promoters seek to foster an open-source ecosystem of development tools that will extend the technology.
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| SEMICON Southeast Asia 2022 to take place in Penang |
12/15/2021 |
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SEMICON SEA 2022 will shine a spotlight on the supply chain disruptions that have battered the semiconductor industry, as well as an increased emphasis on environmental and sustainability challenges that industry players need to grapple with.
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| IBM and Samsung claim they’ve made a breakthrough in 1-nanometer threshold |
12/14/2021 |
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The two companies unveiled a new design for stacking transistors vertically on a chip. With current processors and SoCs, transistors lie flat on the surface of the silicon, and then electric current flows from side-to-side. By contrast, Vertical Transport Field Effect Transistors (VTFET) sit perpendicular to one another and current flows vertically.
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| DRAM shipment forecast on 2022 declining |
12/14/2021 |
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PC OEMs’ DRAM inventory has lowered by several weeks, TrendForce has also further reduced its forecast of DRAM price drops for 1Q22. Even so, the overall demand for DRAM will still enter a cyclical downturn in 1Q22, during which DRAM ASP will also maintain a downward trajectory with an 8-13% QoQ decline.
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| EV market drives demand for 6 in wafers |
12/13/2021 |
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Demand from the global automotive market for 6-inch silicon carbide (SiC) wafers is expected to reach 1.69 million units in 2025 thanks to the rising penetration rate of EVs and the trend towards high-voltage 800V EV architecture, according to TrendForce.
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| Murata teams with Michelin to develop tire management system |
12/13/2021 |
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The companies ae to co-developed a new generation of RFID modules that are embedded into tires. The robust passive RFID tags require no external power supply and will continue to operate while being driven on for extremely high mileages.
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| Intel unveils comeback plan |
12/13/2021 |
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At IEEE International Electron Devices Meeting (IEDM) 2021, Intel outlined its path toward more than 10x interconnect density improvement in packaging with hybrid bonding, 30% to 50% area improvement in transistor scaling, major breakthroughs in new power and memory technologies, and new concepts in physics that may one day revolutionize computing.
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| Memory sales boosted up global semiconductor revenue in Q3 |
12/13/2021 |
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Preliminary data shows the NAND market reached nearly $18.7 billion in 3Q21,” said Craig Stice, Omdia’s chief semiconductor analyst. “The NAND market was fueled by strong shipment growth to meet demand coming out of the enterprise and data center markets, as well as stable demand out of the smartphone market.”
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| Qualcomm executive moved to join AI computer vision startup MemryX |
12/10/2021 |
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Kressin has become chief executive of MemryX, founded in 2019 by University of Michigan professors Wei Lu and Zhengya Zhan. MemryX is working on its second generation of a chip aimed at helping cameras in places such as cars and factory robots recognize objects, a field called computer vision.
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| Power management IC prices jumped 10% |
12/10/2021 |
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Due to factors such as production running at full capacity and a shortage of raw materials, PMIC suppliers have currently announced longer lead times with consumer electronic IC lead times increasing to 12~26 weeks, automotive IC lead times reaching 40~52 weeks, and a cessation of orders for certain exclusive production models.
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| SiLC Technologies (SiLC) offers new LiDAR sensor |
12/9/2021 |
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The new Eyeonic Vision Sensor takes LiDAR provide accurate instantaneous depth, velocity, and dual-polarization intensity information while enabling immunity to multi-user and environmental interference.
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| NEC Corp budgets $4.4 billion for acquisitions |
12/9/2021 |
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NEC Corp could spend up to 500 billion yen ($4.4 billion) over the next five years on acquisitions in order to bolster its technology offerings, including 5G mobile broadband, the company’s CEO said.
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| IC market forecast to grow 25% in 2022 |
12/9/2021 |
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A “direction indicator” more accurately describes the expected direction and intensity of the annual IC market growth rate as compared to the previous year.
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| Foxconn and Stellantis N.V. forms partnership to design EV chips |
12/9/2021 |
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The collaboration will support Stellantis’ initiatives to reduce semiconductor complexity, design an all-new family of purpose-built semiconductors to support Stellantis vehicles, and provide capabilities and flexibility in this area of growing importance as vehicles become increasingly software-defined.
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| Intel plans to take Mobileye public next year |
12/8/2021 |
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Spinning Mobileye out into a separate publicly traded company could increase value for Intel shareholders, its parent company said in an announcement that went out late Monday. A source told TechCrunch the IPO is expected to take about six months.
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