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Toshiba lays out roadmap for large capacity HDD 2/11/2022 In four years from now, the company foresees HDDs with more than 40TB storage Pixelworks Semiconductor appoit of two new senior vice presidents 2/11/2022 Frank Liu has been appointed to the role of Senior Vice President of Operations, and Linna Liu has been appointed to serve as Chief Financial Officer and Senior Vice President of Finance. Cadence Design Systems Inc. offers new DRAM verification solution 2/11/2022 Customers can quickly and effectively perform IP-to-SoC-level verification of advanced designs with multiple DDR interfaces. Ferrari and Qualcomm partners in auto chip 2/10/2022 Qualcomm’s announcement does call out that it’ll be working with Ferrari to “design, develop and integrate Ferrari’s digital cockpits, Samsung spent $36 billion on fab upgrade in 2021 2/10/2022 According to the South Korean chip giant Wednesday, the company poured 43.6 trillion won ($36.4 billion) for upgrades to and the expansion of its chip plants in Korea and China where advanced DRAM chips and vertical NAND flash memory chips are produced. Arrow Electronics ranked #1 in the "Wholesalers: Electronics and Office Equipment" 2/10/2022 Arrow topped all nine criteria in the World’s Most Admired Companies list, including innovation, people management, use of corporate assets, social responsibility, quality of management, financial soundness, long-term investment value, quality of products/services, and global competitiveness. Failed merger deal drives Arm towards planning IPO on 2023 2/10/2022 European and U.S. regulators raising objections about the transaction’s adverse impact on Arm’s licensees. Nvidia argued unsuccessfully to assuage those concerns. Arm has a new CEO 2/9/2022 Arm’s board of directors has appointed 35-year semiconductor industry leader Rene Haas as chief executive officer and member of the board of directors, effective immediately. He succeeds Simon Segars, who has stepped down as CEO and member of the board of directors after 30 years with the company. Intel innvested another billion on foundry business development 2/9/2022 “Foundry customers are rapidly embracing a modular design approach to differentiate their products and accelerate time to market. Intel Foundry Services is well-positioned to lead this major industry inflection. With our new investment fund and open chiplet platform, we can help drive the ecosystem to develop disruptive technologies across the full spectrum of chip architectures,” said Pat Gelsinger, Intel CEO. Singapore-based data center company to build largest Data Center in Manila 2/9/2022 It will be situated in Cainta, part of Greater Manila, in the Philippines. The green data center will be fully powered with renewable energy—wind, geothermal—and is slated to open in 2022. AMD’s acquisition of Xilinx enhanced capability to compete on CPU level 2/9/2022 AMD said its combination with Xilinx will create the industry’s leading high-performance computing company, expanding product offerings and customers in growth markets where Xilinx is an established leader. Xilinx, Intel and Lattice announced releases of their largest field-programmable gate array (FPGA) 2/8/2022 With higher I/O count, memory bandwidth and transceiver bandwidth are sure to follow. Terabit bandwidths used to be unheard of, but today’s data center grade FPGAs can comfortably reach these bandwidths to support extremely high compute applications. Texas Instrument plans to invest $3.5 billion annually in its U.S. semiconductor chip manufacturing 2/8/2022 The near-term investment figure marks a considerable uptick from the company's capital expenditures in recent years. And from 2026 to 2030, the company said, it will continue investing in its manufacturing to the tune of 10% of annual revenue. NSCore Inc. introduced its Automotive Grade-1 qualified memory 2/8/2022 The NSCore NVM IP does not require any additional masks or process steps, thereby reducing the overall cost to manufacture chips by up to 30%. SEMICON Korea 2022 Hybrid to open 2/8/2022 The hybrid event will feature 2,000 booths; business matching to help domestic organizations expand their international reach. House passes Semiconductor Bill 2/7/2022 The bill passed by a vote of 222-210. It marks an important step for a top Biden administration priority, but the legislation is likely to be extensively revised as negotiators reconcile differences with what the Senate passed about eight months ago. Semiconductor companies spent $146 billion globally on research and production last year 2/7/2022 Semiconductor companies around the world are preparing to make major investments in their research and development facilities, in an effort to meet growing demand as the global chip shortage rages on. Weebit Nano and institute CEA-Leti report advances in resistive-RAM (ReRAM) technology 2/7/2022 Under a transfer and qualification agreement, Weebit’s embedded ReRAM technology will be transferred to SkyWater’s fab for volume production by the end of 2022. Samsung provides Samsung tahat leads to higher transistor density 2/7/2022 The emerging process is likely to provide transistor density advantages over the current FinFET technology used at the 5-nm node, where Taiwan Semiconductor Manufacturing Co. (TSMC) rules the roost. Intrinsic Semiconductor and its partner iMac have scaled RRAM technology to 50nm 2/4/2022 Using Intrinsic’s technology, any chip designer will be able to embed a non-volatile memory that is as fast to read as SRAM but at a fraction of the cost and power consumption. Qualcomm reported 30% increase in Q1 sales 2/4/2022 EPS: $3.23, adjusted, vs. $3.01 expected, up 49% year-over-year. Revenue: $10.7 billion, adjusted, vs. $10.42 billion expected, up 30% year-over-year. Synapse Design joined the Design Center Alliance (DCA) program of TSMC Open Innovation Platform 2/4/2022 Synapse Design, a QuEST Global company, has design centers in the US, India, China, Japan, Malaysia, and Vietnam, and employs more than 1,000 engineers. The company has worked with TSMC closely and completed over 150 designs on TSMC’s process technologies over the past five years, including more than 20 designs on TSMC’s latest N7, N6, and N5 processes. Sony Semiconductor succeeded in developing first stacked CMOS image sensor 2/4/2022 Sony’s new technology separates photodiodes and pixel transistors on different substrate layers. This new architecture approximately doubles saturation signal level relative to conventional image sensors, widens dynamic range, and reduces noise, thereby substantially improving imaging properties. Republican senators are urging the Biden administration to tighten export controls to China SMIC 2/3/2022 Tightening the controls "would close an important loophole and prevent the (Chinese Communist Party) and (the People's Liberation Army) from using U.S. technology to advance its military modernization programs," NAND flash are to go over 200 layers 2/3/2022 Among the vendors, Samsung Electronics and Micron Technology could be the first racing to kick off volume production of 200-plus-layer 3D NAND flash chips.  117  |  118  |  119  |  120  |  121  |  122  |  123  |  124  |  125  |  126

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