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Yangtze Memory Technologies license Xperi’s DBI hybrid bonding technology to package NAND devices 10/14/2021
“Xperi’s DBI hybrid bonding is a key enabling technology for current and future generations of high performance, high-capacity 3D NAND flash memory,” said Craig Mitchell, president of Invensas, a wholly owned subsidiary of Xperi.
Samsung mass producing 14nm DDR5 DRAM using 5 layer EUV technology 10/14/2021
Following the company’s shipment of its first EUV DRAM in March of last year, Samsung has increased the number of EUV layers to five to deliver today’s DDR5 devices.
MediaTek posted record highs 10/14/2021
MediaTek recorded NT$47.91 billion (US$1.7 billion) for its September sales, which represents an 11.9% increase from August figures, and a 26.51% year-on-year change. Third-quarter 2021 revenue came in at NT$131.07 billion, a 4.31% bump compared to Q2 results.
Senator Elizabeth Warren called for breaking up Amazon.com 10/14/2021
Investigation showed the e-commerce giant had copied products and rigged search results in India. Meanwhile, a bipartisan group of U.S. lawmakers plans to introduce a bill that would bar Big Tech platforms from favoring their products and services.
Semiconductor merger and acquisition to reach $22 Billion this year 10/13/2021
Pace of semiconductor acquisition agreements fell back over the next five months of 2021, putting this year’s total M&A value at $22 billion for the January-August period, according to IC Insights’ September Update of the 2021 McClean Report.
Foxconn to work with Lordstown Motors on developing light duty EV fleet trucks 10/13/2021
they have reached an agreement in principle to work jointly on Lordstown Motors’ electric vehicle programs in Lordstown Motors’ 6.2 million square foot production and assembly plant in Lordstown, Ohio.
Samsung Foundry to offer 3nm and 2nm based Gate-All-Around (GAA) process 10/13/2021
At this year’s event, Samsung shared its vision to bolster its leadership in the rapidly evolving foundry market by taking each respective part of foundry business to the next level: process technology, manufacturing operations, and foundry services.
Rain Neuromorphic taped out its analog AI chip 10/13/2021
Rain Neuromorphics has taped out a demonstration chip for its brain-inspired analog architecture that employs a 3D array of randomly-connected memristors to compute neural network training and inference at extremely low power.
Intel certifies Kingston DDR5 modules for Alder Lake CPU 10/12/2021
Kingston is ready for the new era, with at least two kits that it claims are the very first to pass muster from the Intel Platform Validation program.
TSMC and Sony Group are considering joint construction of a semiconductor factory in western Japan 10/12/2021
The total investment in the project is estimated at 800 billion yen ($7 billion), with the Japanese government expected to provide up to half the amount.
End of AMD Play Station 5 shortage may finally be in sight 10/12/2021
Lisa Su, the CEO of AMD, said this week (via Spieltimes): “I expect it to be from June-September of next year 2022 when, perhaps, it will be possible to go down to a video game store or a department store to buy a PlayStation 5 or an Xbox Series X without it being an impossible task.”
Intel is contesting the uncontested Nvidia 10/12/2021
Intel is contesting the uncontested Nvidia on graphics and networking.
Gaming PCs expected continue to be strong through 2025 10/11/2021
For gaming PCs, which includes both desktop and notebook PCs, unit shipments are expected to grow from 41.3 million in 2020 and to 52.3 million in 2025. Similarly, the gaming monitor market is expected to jump from 14.2 million units shipped to 26.4 million during the same time frame. This equates to the two product categories having five-year compound annual growth rates (CAGRs) of 4.8% and 13.2%, respectively.
Siemens Digital 's mPower software delivers power integrity analysis for all versions of 2D designs 10/11/2021
Using mPower, IC designers can more quickly and thoroughly verify that their designs meet power-related design goals—capabilities that can help IC customers dramatically boost quality, enhance reliability and speed time to market.
"Compute-in-memory" startup, has secured $83 million to market its data analytics accelerator memory chip 10/11/2021
The Israel-based startup has developed a data analytics architecture that eliminates major data movement bottlenecks by integrating data processing functions in-memory. While its focus so far has been on developing the architecture enabling the chip, the company also will deliver a data analytics tool dubbed Xiphos, billed as a system-level appliance.
Navitas Semiconductor opened a new office in Shenzhen, China 10/11/2021
This investment supports the rapid growth of GaN mobile fast chargers, as well as the company’s recently-announced expansion plans to enable GaN-based data centers, solar installations and electric vehicles, which represent a multi-$B market opportunity for the company.
Brexit could have stopped Intel from building new fabs in UK 10/8/2021
"Post-Brexit... we're looking at EU countries and getting support from the EU". said Intel's Pat Gelsinger.
Texas Instruments' GaN and MPU technology creates an enterprise server power supply unit for data centers 10/8/2021
According to TI, the combination can offer up to 99.2 percent efficiency and overall power cost reductions. Steve Tom, TI’s product line manager for GaN technology, said the coupling of its GaN power technology with C2000 MCUs boosts time-critical processing, precision control as well as software and peripheral scalability.
Deep EUV to carry Moore's Law for 10 more years 10/8/2021
Starting in the first half of 2023 ASML plans to offer customers equipment that takes EUV numerical aperture (NA) higher to 0.55 NA from the existing 0.33 NA. The company believes that the new equipment will help chip makers reach process nodes well beyond the current threshold (2nm) for at least another 10 years,
Cadence Design offers comprehensive 3D-IC platform to integrates 3D design analysis in one cockpit 10/8/2021
The platform underpins Cadence’s third-generation 3D-IC solution, providing customers with system-driven power, performance and area (PPA) for individual chiplets through integrated thermal, power and static timing analysis capabilities.
Stanford researchers lowers PCM (phase-change memory) switch power 10/7/2021
Researchers at Stanford University who came together working in separate areas have been able to demonstrate a lower switching current density of ~0.1 mega-ampere per square centimeter in flexible superlattice PCM, which is one to two orders of magnitude lower than in conventional PCM on flexible or silicon substrates.
Semiconductor shortage is becoming a Global norm 10/7/2021
Taiwan Semiconductor Manufacturing Co (TSMC), the world’s biggest foundry service provider, said that it expects its revenue to expand more than 20 percent this year from last year. TSMC has reportedly raised prices by 10 to 20 percent for new orders.
Taiwan government is ready to backup TSMC should the U.S. government push to disclose sensitive investor data 10/7/2021
The company told her it would adhere to basic business principles, providing information where it could, but without harming the interests of shareholders and clients, CNA reported.
Nvidia offers early concessions to EU on the Arm merger deal 10/7/2021
The European Commission has extended the deadline for its decision on the deal till October 27 and did not reveal what concessions Nvidia Corp offered, as per policy.
Intel' tested Alder Lake processor platform to embrace DDR5 memory 10/6/2021
The chipmaker (via momomo_us) has released a new document that lists the different DDR5-4800 memory modules that have been validated for its next-generation platform. Perhaps one of these models will land the first DDR5 spot on our best RAM list.
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