Home News Products Corporate Contact

Wednesday, February 26, 2025

News Industry News Publications CST News Help/Support Software Tester FAQs

Delta Electronics to acquire Universal Instruments Corp. in a $88.9 million transection 12/30/2021 The transaction is expected to generate substantial synergies by leveraging both companies’ R&D and global customer base and to strengthen Delta’s smart manufacturing capabilities for the electronics industry. SK hynix Inc completed first phase to acquire Intel Corp.’s NAND and SSD business 12/30/2021 Following the recent merger clearance from China’s State Administration for Market Regulation on December 22, SK hynix closed the first phase of the transaction by acquiring Intel’s SSD business and the Dalian NAND flash manufacturing facility in China. In exchange, SK hynix will pay $7 billion in consideration. Semiconductor market is red hot during the third quarter (3Q21) 12/29/2021 total revenue of the global top 10 IC design (fabless) companies reaching $33.7 billion—up by 45% year-on-year (YoY), according to TrendForce. Global cellular IoT module shipments grew by 70% year-on-year 12/29/2021 The market crossed the $1.5-billion mark during the quarter. China continued to dominate in terms of volume, followed by North America and Europe. 5G was the fastest growing technology (+700% YoY) due to a lower base. Siemens Software’s mPower solution now certified for TSMC’s N7 and N5 process 12/29/2021 The significant power and performance advancements of TSMC’s N7 and N5 processes make them ideal for next-generation mobile, artificial intelligence, high-performance computing, and network connectivity designs, as well as other high-performance digital and mixed-signal applications. Applied Materials to invest $210 million to advance hybrid bonding 12/29/2021 Die-to-wafer hybrid bonding can increase I/O density and shorten wiring lengths between chiplets with direct, copper-to-copper interconnect, thereby improving performance, power and cost. Silicon Labs offers Z-Wave 800 system-on-chips (SoCs) and modules 12/28/2021 EFR32ZG23 (ZG23) SoCs and ZGM230S modules provide developers with sub-GHz connectivity for Z-Wave Mesh and Z-Wave Long Range, and are ideal for smart home, multi-dwelling units (MDU), hospitality, and lighting applications, supporting both end devices and gateways. PC monitor market register first decline in shipments since global lockdowns began 12/28/2021 While many countries, especially in the emerging economies of Asia/Pacific, continued to show solid demand and fulfilled backorders, key markets in North America and Western Europe saw sizable contractions mainly due to a degree of softening in consumer demand. Rare matel supply is becoming critical 12/28/2021 These complex compounds can impact the production of a whole range of goods ranging from batteries, mobile phones, laptops, hard drives, displays, lasers, electric vehicles, defense equipment, and medical diagnostic devices. Holography to one day replace your car dashboard 12/28/2021 Ceres Holographics has showcased a full-scale replication system for producing 1500mm width holographic films in high volume, enabling holographic transparent displays and augmented reality-HUDs (AR-HUD) for windshields. Hailo partners with NXP to offer joint AI solutions for automotive electronic control units (ECUs) 12/27/2021 NXP and Hailo’s joint solutions enable scalable AI compute while maintaining top safety standards and keeping the entire power envelope low—solving major pain points for automotive OEMs and Tier-1 suppliers. Navitas Semiconductor samples (GaN) power ICs for datacenter, solar, and electric vehicle (EV) applications 12/27/2021 Navitas GaNFast ICs were first introduced to mobile customers three years ago and have become a mainstream, disruptive force in those markets, enabling unprecedented high-efficiency and ultra-fast charging of mobile devices with ultra-lightweight and miniaturized form factors. Taiwan Tech Arena (TTA) to showcase 100 high-potential Taiwanese start-ups at CES 2022 12/27/2021 The 100 start-ups showcased at CES 2022 represent Taiwan’s innovative prowess in these sectors, as well as our capability to nurture high-potential businesses with international development possibility in the future. More data centers are latching onto ARM processor 12/27/2021 Five percent of servers shipped to cloud providers during the July-September period contained an Arm CPU, according to market tracker Omdia. Amazon Web Service’s Arm-based Graviton processor contributed to the surge. Ampere Computing, another vendor offering Arm processors, also saw strong demand from cloud customers such as Equinix and Oracle. Mynaric to design optical communications terminal reconfigured to link different satellite constellations 12/24/2021 The adaptable architecture design for a next-generation optical communications terminal is part of an early development effort overseen by the Defense Advanced Research Projects Agency (DARPA). Hitachi provides Inspection system for-small geometry EUV 12/24/2021 Hitachi High-Tech is responding to this increased demand for high-speed, sensitive inspection and measurements over a wide area and is launching GS1000 system to fulfil the needs of semiconductor device mass-production market. Report of Intel 's Alder Lake Core i5-12400F processor is being sold at a Peruvian retailer 12/23/2021 The CPU has yet to be officially announced by Intel, XanxoGaming confirmed it purchased a retail version of the Core i5-12400F, which is a processor that was initially mentioned in rumors last month. Korean manufacturers should follow TSMC's example in dealing with harmful gas byproducts 12/23/2021 Samsung Electronics and SK hynix, do not disclose official data on how they remove those toxic gases, TSMC, as a market leader, offers full transparency. Japan Approves $6.8 Billion Boost for Domestic Chip Industry 12/23/2021 Prime Minister Kishida reportedly said more than 1.4 trillion yen of public-private investment will be made available for domestic semiconductor production. China finally approved SK hynix’s acquisition of Intel’s NAND and SSD business 12/23/2021 Though SK hynix and Intel signed the $9 billion deal in October last year, it has been waiting for approval from China for more than a year due to tensions with the US. Taiwan's Investment Commission approved TSMC's investment plan in Japan fab 12/22/2021 The commission said it had approved the investment project to allow TSMC to help secure a stable supply of wafers for Japanese customers. Samsung Electronics trumps Intel on Q3 sales 12/22/2021 Industry tracker Omdia said Intel, which had been the top chipmaker for 11 straight quarters, slipped to number two behind Samsung "as the memory segment, where Samsung is the number one DRAM and NAND supplier, was the largest growth area for semiconductor" in the three months ending in September. Siemens Software collaborates with PDF Solutions to boost IC manufacturing yields 12/22/2021 For mutual customers, this intelligence can dramatically boost manufacturing yields and accelerate time to market for new products. Renesas completes acquisition of Israeli Wi-Fi chipset developer Celeno 12/22/2021 Celeno, founded in 2005 by Gilad Rozen, offers a range of advanced Wi-Fi chipsets and software for Wi-Fi 6 and 6E, targeting high-performance home networks, smart buildings, enterprise and industrial markets. An affordable, voice-enabled AI Assistant that continually learns 12/21/2021 “Our initial lab provided proof that the use of an AI Assistant can greatly reduce documentation burden and family physician burnout, and Phase 2 of the lab series determined whether an AI Assistant is essential to and readily adoptable by family physicians.”  122  |  123  |  124  |  125  |  126  |  127  |  128  |  129  |  130  |  131

Copyright © 1994 - 2023 CST, Inc. All Rights Reserved