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Oculi wants to make machine vision more human by adding memory and computing to sensor pixel 12/21/2021
Machine vision is not about pretty images. It really should be about efficiency: How do we get the information in an efficient way”
MediaTek offers Dimensity 9000 5G smartphone chip 12/21/2021
MediaTek announced device maker adoption and endorsements from some of the world’s biggest smartphone brands, including OPPO, vivo, Xiaomi, and Honor. The first Dimensity 9000 powered flagship smartphones will be in the market in the first quarter of next year.
Government and military investment in 5G cellula continues to climb worldwide 12/21/2021
Contracts already leverage 5G to improve inventory management and related tasks via an “Internet of Military Things” approach. Yet, 5G is also set to advance or enable additional use cases in aerospace and defense.
NAND flash ASPs to expect slump during 2022 12/20/2021
NAND flash ASPs are expected to undergo a 10-15% sequential decline in the first quarter of 2022, after an up to 5% decrease in the prior quarter, as the market shifts to oversupply, according to TrendForce. Nevertheless, the anticipated 10-15% price fall would be the largest on-quarter drop in 2022, TrendForce believes.
Electronics production in 2021 to show strong bounce-back, says Semiconductor Intelligence 12/20/2021
Electronics production has been hurt by various production shutdowns, component shortages and logistical challenges. These issues will probably continue through most of 2022. By 2023, electronics production should be back to typical trends.
NXP forms partnership with Foxconn Industrial Internet (FII) to work on automotive technologies 12/20/2021
the joint project will focus on the development of a full-digital cockpit solution, based on the NXP i.MX 8 QuadMax. The platform will include digital clusters, and a head-up display (HUD) system, which will enable global automotive OEMs and tier-1s to deliver vivid in-vehicle experiences for their customers.
Samsung regains top spot in smartphone sales 12/20/2021
Samsung was able to increase its shipments by shifting products quickly from its manufacturing facilities in Vietnam to stakeholders further down the channel. But other OEMs found it tough to tackle the ongoing component shortages and, overall, both offline and online channels faced low supplies. All this helped Samsung recapture the top spot with a 23% share in the key Southeast Asia countries.
Siemens and LG Energy Solution signs cooperation on battery manufacturing technologies 12/17/2021
The two companies plan to take steps to promote the process of battery manufacturing intelligence at LGES production facilities worldwide.
MediaTek claimed that its supply for next year is largely in hand 12/17/2021
“In terms of supply challenges, I think MediaTek has done pretty well on this front,” MediaTek Vice Chairman and Chief Executive Rick Tsai told a news conference. “We have already nearly prepared our supply for next year.”
Samsung began volume production for automotive memory 12/17/2021
Samsung is in volume production of memories designed for automotive applications including a 256GB PCIe Gen3 NVMe ball grid array (BGA) SSD, 2GB GDDR6 DRAM and 2GB DDR4 DRAM for high-performance infotainment systems, as well as 2GB GDDR6 DRAM and 128GB Universal Flash Storage (UFS) for autonomous driving systems.
Memory and storage requirements will spur chip demand in the 5G world 12/17/2021
P>Leading semiconductor and component suppliers in areas like memory chips and storage arrays are focusing on the opportunities presented by the 5G expansion, designing and manufacturing wireless devices capable of operating at new frequencies. New devices will also be able to process and store significantly more data than previous generations of cellular technology.
SK hynix samples DDR5 memory chips 12/16/2021
SK hynix said Wednesday it has shipped samples of 24-gigabit DDR5 dynamic random access memory chips, touting its technology leadership in commercializing a single DRAM chip that has the largest density in the industry. DDR5.
2021 ends up with $103 billion in IC equipment sales 12/16/2021
IC equipment sales surged 44.7% from the previous industry record of US$71 billion in 2020, according to SEMI. The growth is expected to continue with the global total semiconductor manufacturing equipment market expanding to US$114 billion by 2022.
An open approach to FPGA development 12/16/2021
An open approach to FPGA development is emerging as promoters seek to foster an open-source ecosystem of development tools that will extend the technology.
TSMC's N4X process targets at High Performance Computing applications 12/16/2021
N4X is the first of TSMC’s HPC-focused technology offerings, representing ultimate performance and maximum clock frequencies in the 5-nanometer family. The “X” designation is reserved for TSMC technologies that are developed specifically for HPC products.
STMicro introduces next generation STPOWER silicon-carbide (SiC) for EV applications 12/15/2021
With the acceleration of the EV market many car makers and automotive suppliers are now embracing 800V drive systems to achieve much faster charging and help reduce EV weight, producing vehicles with longer driving ranges.
Flexible Ultra-Thin Memory Device for wearable applications 12/15/2021
An ultra-thin memory device materialized with a 2D nanomaterial of several nanometers (nm) can significantly increase the memory density,
Zero emissions Autonomous E-Container Ship 12/15/2021
The emission-free and safe energy supply is provided by a 6.7 MWh battery system with integrated liquid cooling to ensure optimum operating temperature.
SEMICON Southeast Asia 2022 to take place in Penang 12/15/2021
SEMICON SEA 2022 will shine a spotlight on the supply chain disruptions that have battered the semiconductor industry, as well as an increased emphasis on environmental and sustainability challenges that industry players need to grapple with.
Broadcom delivered record revenues in the third quarter 12/14/2021
Broadcom offered guidance for fourth-quarter revenue of approximately $7.35 billion. Analysts surveyed by FactSet are projecting fourth-quarter sales of $7.2 billion.
IBM and Samsung claim they’ve made a breakthrough in 1-nanometer threshold 12/14/2021
The two companies unveiled a new design for stacking transistors vertically on a chip. With current processors and SoCs, transistors lie flat on the surface of the silicon, and then electric current flows from side-to-side. By contrast, Vertical Transport Field Effect Transistors (VTFET) sit perpendicular to one another and current flows vertically.
DRAM shipment forecast on 2022 declining 12/14/2021
PC OEMs’ DRAM inventory has lowered by several weeks, TrendForce has also further reduced its forecast of DRAM price drops for 1Q22. Even so, the overall demand for DRAM will still enter a cyclical downturn in 1Q22, during which DRAM ASP will also maintain a downward trajectory with an 8-13% QoQ decline.
Magnachip Semiconductor to terminate merger agreement with Wise Road Capital 12/14/2021
This course of action resulted from the inability of the parties, despite months of effort, to obtain CFIUS’s approval for the merger. In connection with the termination of the merger agreement,
EV market drives demand for 6 in wafers 12/13/2021
Demand from the global automotive market for 6-inch silicon carbide (SiC) wafers is expected to reach 1.69 million units in 2025 thanks to the rising penetration rate of EVs and the trend towards high-voltage 800V EV architecture, according to TrendForce.
Murata teams with Michelin to develop tire management system 12/13/2021
The companies ae to co-developed a new generation of RFID modules that are embedded into tires. The robust passive RFID tags require no external power supply and will continue to operate while being driven on for extremely high mileages.
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