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SkyDrive and Suzuki Motor to develop flying cars in India 3/29/2022
Under the terms of the agreement, SkyDrive and Suzuki will start consideration to collaborate in areas of business and technology that include technology R&D, planning of manufacturing and mass-production systems, development of overseas markets with an initial focus on India, and promotion of efforts to attain carbon neutrality.
DRAM prices expected to drop up to 5% throughout Q2 2022 3/29/2022
It is due to marginally higher buyer and seller inventories coupled with the demand for products such as PCs, laptops, and smart phones being influenced in the short-term by the Russian-Ukrainian war and high inflation weakening consumer purchasing power.
ADI works with Gridspertise to improve reliability of smart grids around the world 3/29/2022
The collaboration enables the development of new hardware and software that support distribution grid self-healing and adaptation in response to the significant changes in energy supply and demand as renewable energy sources are brought online.
Showa Denko starts mass production of six-inch silicon carbide (SiC) wafers 3/29/2022
Showa Denko K.K. (SDK) has launched mass production of silicon carbide (SiC) single crystal wafers with a diameter of 6in (150mm), which are used as materials for SiC epitaxial wafers to be processed and installed into SiC-based power semiconductors.
TSMC plans to open a zero-waste manufacturing center in Taichung City in 2023 3/28/2022
Taiwan Semiconductor Manufacturing Co. (TSMC), the world's largest contract chipmaker, plans to open a zero-waste manufacturing center in Taichung City in 2023 as part of the company's efforts to assimilate green management into its business.
Nvidia to take the second position behind No.1 Qualcomm in fabless firm rankings 3/28/2022
Nvidia had growth of 64% in gaming graphics cards and 59% in data centr
U Power partners with NVIDIA to build high-performance vehicle computer 3/28/2022
Tapping the power of the NVIDIA DRIVE Orin system-on-chip, U Power plans to develop one of the industry’s first open vehicle supercomputers for scalable computing power.
ASML predicts semi shortage to last for two more years 3/28/2022
The warning is said to stem from ASML’s reliance on its suppliers, including Germany’s Carl Zeiss, which provides essential lenses. Zeiss, in turn, has also been impacted by supply chain issues.
Toshiba shareholders voted against splitting the company 3/25/2022
Toshiba shareholders voted against the management’s plan to split the company into two parts – infrastructure products and devices. Shareholders also voted against a proposal by activist shareholder 3D Investment Partners of Singapore to consider other options including a sale of the company to private equity.
Intel CEO Pat Gelsinger urged US Congress to pass Chip Bill 3/25/2022
Gelsinger made his comments alongside the CEOs of memory vendor Micron and semiconductor equipment maker LAM Research during a US Senate Committee hearing that largely focused on the pros and cons of passing subsidies for chipmakers.
IC production reports minimal damage by quakes in Japan 3/25/2022
According to TrendForce, in the main quake zone, only Kioxia’s K1 Fab (located in Kitakami) will face the possibility of a further downgrade to 1Q22 production. Some of the remaining memory or semiconductor companies in the region are conducting machine inspections but the overall impact has been muted.
Tablet shipment increased by 76% in Thailand 3/25/2022
According to the International Data Corp.’s (IDC) Quarterly Personal Computing Device Tracker, Heightened demand for online grocery and food delivery services amid the coronavirus outbreak also drove commercial usage.
Qualcomm se $100M as Snapdragon Metaverse Fund 3/24/2022
Qualcomm announced this week its Snapdragon Metaverse Fund, which boasts a total investment of $100 million meant to support both developers and companies actively producing extended reality (XR) ecosystems as well as the augmented reality (AR) and artificial intelligence (AI) technologies designed to advance the XR experience.
TMYTEK collaborates with DuPont, Chroma, and ADIVIC to supply mW solutions for 5G/B5G SATCOM. 3/24/2022
Together, they showcased the SATCOM electronic steering antenna (ESA) and the user terminal test solution at the Taiwan Space Exhibition (Booth 743) during the SATELLITE 2022 in Washington, DC.
Kioxia to build new fab within its Kitakami Plant facility 3/24/2022
This is for the possible expansion of production of its proprietary 3D Flash memory BiCS FLASH. Construction of the facility is scheduled to commence in April 2022 and is expected to be completed in 2023
In-memory computing draws attention 3/24/2022
As interest in artificial intelligence (AI) and in-memory computing significantly increases, resistive random-access memory (ReRAM) could be the key to unlocking their ability to imitate the human brain—yet challenges remain.
Alphawave IP Group plc to acquire the entire OpenFive business 3/23/2022
Alphawave IP Group plc is acquiring the entire OpenFive business unit from SiFive Inc., the founder and leader of RISC-V computing based in San Mateo, California.
Axiomtek launched Aristotle (RSC101), a compact fanless edge AI computer 3/23/2022
The RSC101 supports the Hailo-8 edge AI processor, featuring up to 26 tera-operations per second (TOPS), to optimize demanding edge workloads for AI deployments in surveillance and security, intelligent manufacturing, smart agriculture, and transportation.
Cambridge GaN Devices Ltd launched its first portfolio of GaN products 3/23/2022
Cambridge GaN Devices Ltd (CGD) has emerged from stealth mode to announce the launch of its first portfolio of products capable of reducing power losses by up to 50%. Marking the company’s debut appearance at APEC (Applied Power Electronics Conference) 2022,
Nvidia unveiled its next-generation GPU architecture — named Hopper 3/23/2022
Nvidia has not opted to go down the trendy chiplets route favored by Intel and AMD for their mammoth GPUs. While the H100 is the first GPU to use HBM3, its compute die is monolithic, 80 billion transistors in 814mm2 built on TSMC’s 4N process. Memory and compute are packaged via TSMC’s CoWoS 2.5D packaging.
Chip Act Bill introduced at house of representatives 3/22/2022
This tax credit could help cover the building costs for a semiconductor manufacturing facility or for semiconductor equipment that is used to produce chips.
Knockoff semiconductors hazardous to national security 3/22/2022
The fear is that within the planet's complex supply chains, someone under pressure from customers to fulfill orders by any means necessary accepts components that turn out to be fake, and these will end up in equipment. These parts can be readily picked up from online marketplaces, and they look convincing enough.
5G-capable smartphones reached 51% globally 3/22/2022
Sales penetration of 5G-capable smartphones reached 51% globally in January 2022, surpassing the penetration of 4G smartphones for the first time, according to Counterpoint Technology Market Research’s Global Monthly Handset Model Sales Tracker.
Magnachip Semiconductor Corp. released a synchronous boost converter for a variety of applications 3/22/2022
Magnachip Semiconductor Corp. has released a synchronous boost converter for a variety of applications, such as NAND flashes for SSDs, OLED panels and Bluetooth speakers.
TI to showcase its power-management chips for EV systems 3/21/2022
The three new products include: Two buck converters and a LDO linear regulator,
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