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| Overstock situations drive NAND prices down 10 to 13% |
7/21/2022 |
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According to TrendForce. The market consensus is a disappointing 2H22 peak season for consumer electronics including notebooks, TVs, and smartphones. Material inventory levels continue to rise and has become a risk to the supply chain.
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| ASML cuts outlook |
7/21/2022 |
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Due to supply chain constraints, ASML has increased fast shipments to its customers and revised its sales growth forecast, from 20% to 10%, for fiscal year 2022.
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| First Power 'ChiP' Fab Supports Automotive Electrification and Data Centers |
7/21/2022 |
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Vicor Corp., the industry leader in innovative power–module design and manufacturing, has recently celebrated the opening of a new 90,000-square-foot, state-of-the-art manufacturing facility in Andover, Massachusetts. The power–module–manufacturing facility, created to support the demand coming from the fast-growing automotive electrification and data center/AI industries, is the world’s first converter-housed-in-package (CHiP) fabrication facility.
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| Key Republicans put weight behind Chip Bill |
7/20/2022 |
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Sen. John Cornyn, R-Texas, who endorsed McConnell’s approach, said on the Senate floor Monday that Manchin’s announcement on taxes means “we’re in a posture where we can go forward with the chips funding and other related provisions.”
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| ARTERY Tech offers two new MCU series |
7/19/2022 |
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the AT32F435 and the AT32F437—featuring high performance and up to 288MHz operating frequency. The introduction of both new products will further add to the diversity of AT32 MCU Family on the top of the existing mainstream and ultra-value product lines.
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| Senate to vote on "Chip Bill" next week |
7/18/2022 |
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Voting in the Senate on a bill to boost the U.S. semiconductor industry and improve competitiveness with China could begin as early as Tuesday, Senate Majority Leader Chuck Schumer has been telling lawmakers, a source familiar with the issue said on Thursday.
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| EVG has breakthrough in die-to-wafer (D2W) fusion and hybrid bondin |
7/18/2022 |
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EV Group (EVG) has achieved a major breakthrough in die-to-wafer (D2W) fusion and hybrid bonding by successfully demonstrating 100-percent void-free bonding yield of multiple die of different sizes from a complete 3D system-on-a-chip (SoC) in a single transfer process using its GEMINI FB automated hybrid bonding system.
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| Removable memory devices still the favorite |
7/18/2022 |
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The ability to swap out a memory device easily is certainly a time and cost saver for automotive applications when it fails, especially when the memory is causing an otherwise functional system to fail.
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| EV Group achieved breakthrough in die-to-wafer (D2W) fusion and hybrid bonding |
7/15/2022 |
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EV Group (EVG) has achieved a major breakthrough in die-to-wafer (D2W) fusion and hybrid bonding by successfully demonstrating 100-percent void-free bonding yield of multiple die of different sizes from a complete 3D system-on-a-chip (SoC) in a single transfer process using its GEMINI FB automated hybrid bonding system.
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| Power outage at Micron’s Japanese plant has limited effect on production |
7/14/2022 |
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Although machinery initiated the uninterruptible power supply system when the outage occurred, due to the voltage drop, plant machinery required initialization and inspection. The power outage persisted for approximately 5~10 minutes and the effect on production capacity was limited.
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