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Brewer Science to make keynote on EUV at the China Semiconductor Technology International Conference 6/23/2022
One of the biggest challenges facing EUV lithography is material requirements, recognizing the critical role underlayers play in the patterning of EUV lithography. Unlike bottom anti-reflective coatings (BARC), thickness is not limited by wavelength, but rather related to resist and process requirements.
TSMC offer options for its 3nm processes 6/23/2022
TSMC's 3nm technology, starting production later in 2022, will feature the company's FinFlex architecture offering choices of standard cells with a 3-2 fin configuration for performance, a 2-1 fin configuration for power efficiency and transistor density, or 2-2 fin configuration for efficient performance.
DRAM pricing forecast to drop around three to eight percent across markets 6/22/2022
TrendForce said Monday that DRAM pricing for commercial buyers is forecast to drop around three to eight percent across those markets in the third quarter compared to the previous three months. Even prices for DDR5 modules in the PC market could drop as much as five percent from July to September.
Foundry Output Value Up 8% in 1Q22 6/22/2022
Although demand for consumer electronics remains weak, structural growth demand in the semiconductor industry including for servers, high-performance computing, automotive, and industrial equipment has not flagged, becoming a key driver for medium and long term foundry growth.
Synopsys offers RF Design Flow for TSMC N6RF Process 6/22/2022
Synopsys Inc. has launched a new RF design flow developed with Ansys and Keysight for the TSMC N6RF process, the most advanced RF CMOS technology that offers significant performance and power efficiency boosts.
Micron Readies LPDDR5 DRAM for Level 5 Autonomy 6/22/2022
Today, Micron announced that its LPDDR5 memory is now Automotive Safety Integrity Level (ASIL) D certified, under ISO 26262, which is considered one of the most stringent safety integrity levels for automotive safety.
The commercialization of Graphene has been spotty so far 6/21/2022
There is a lot of potential for graphene in solar cells, and it is an area where many of its properties can be utilized to favorable effect. Over the last few years, there have been several commercial offerings hitting the market, with the latest one this year targeting the marine sector.
Global server market’s revenue to grow 17% year-on-year (YoY) in 2022 6/21/2022
The global server market’s revenue will grow by 17% year-on-year (YoY) in 2022 to reach $111.7 billion, according to Counterpoint Technology Market Research’s Global Server Sales Tracker.
Test innovation AEM to expand its operations in Singapore and Malaysia 6/21/2022
Apart from its new sites in Penang and the US, AEM will also expand its R&D centers in both countries as well as in Singapore, with the new facilities scheduled to start operating by the end of the third quarter (Q3 2022).
Soitec to build extension to its 300-mm SOI wafer fab in Pasir Ris, Singapore 6/21/2022
The ambition is to double the capacity to meet the strong and continuous demand for semiconductors.
TSMC sets 2nm goal on 2025 6/20/2022
The 2nm process will be 10-15 percent faster at the same power or save 25-30 percent power at the same speed compared to its 3nm process.
Applied Materials has bought Picosun 6/20/2022
Applied Materials has bought Picosun, a privately held semiconductor equipment company based in Espoo, Finland, which specialises in atomic layer deposition (ALD) technology, primarily for specialty semiconductors.
EPC offers family of radiation-hardened (rad-hard) gallium nitride (GaN) products for power conversion solutions 6/20/2022
IT'S for high-reliability environments with a 100V device that has the lowest on-resistance currently available on the market.
Infineon Puts ferroelectric RAM (FRAM) in Space 6/20/2022
Ferroelectric RAM (FRAM) an ideal memory for off–planet applications. It’s not just the energy consumption during operations that matters, but also when a device is programed— which is a key feature of Infineon Technologies’ latest serial interface (FRAM) for extreme environments.
Foundries should allocate more capacity to EV chips 6/17/2022
Car chip suppliers have managed to win a bit more capacity support from foundry houses in the second quarter of the year amid slackened chip demand for handsets and other consumer devices.
Toshiba , Sony and Samsung Electronics lost their court fight against an EU cartel fine levied seven years ago 6/17/2022
The European Commission in 2015 fined five companies 116 million euros ($120.5 million), with the biggest fine of 41.3 million euros going to Toshiba Samsung Storage Technology, a joint venture of Toshiba and Samsung Electronics.
Head of Samsung Electronics to visit ASML in Netherlands 6/17/2022
Lee headed to ASML in Veldhoven, the Netherlands for meetings with ASML’s CEO Peter Wennink, CTO Martin van den Brink and other key executives on Tuesday (local time) after earlier tete-a-tete with the Dutch prime minister.
UTAC) and AEM jointly developed next-generation test system solution for CMOS image sensors. 6/17/2022
CMOS image sensor products are expected to significantly grow during the decade and beyond. Assembly and test of CMOS image sensors is the primary focus area of growth for UTAC, who is already in high-volume assembly production for image sensor for the automotive and industrial markets.
GlobalFoundries and STMicroelectronics are considering a joint fab in France 6/16/2022
The proposed fab in question – reported by Bloomberg – would help Europe fight future chip shortages and support the European Union's goal of producing 20 percent of the world's semiconductors by 2030.
Lam Research offers dry resist EUV to SK hynix for advanced DRAM processing 6/16/2022
A breakthrough technology introduced by Lam in 2020, dry resist extends the resolution, productivity, and yield of Extreme Ultraviolet (EUV) lithography, a pivotal technology used in the production of next-generation semiconductors.
Kaohsiung, Taiwan highly likely to attract a cluster of high value semiconductor companies 6/16/2022
The Kaohsiung City Government predicts that TSMC’s arrival will bring more job opportunities for R&D as well as design talents, and the semiconductor industry chain will gradually take shape within five years.
Major fab expansion are likely concentrated in Taiwan and Korea 6/16/2022
Taiwan and South Korea will account for more than half of the $109 billion in expenditures on fab equipment this year.
Korea's unionized truckers strike might affect semiconductor Supply Chain 6/15/2022
The eight-day strike has delayed cargo shipments for industries from autos to petrochemicals and spirits in the export-heavy nation, and cost South Korea's industry more than $1.2 billion in lost output and unfilled deliveries, according to the industry ministry.
IC gear spending to exceed $109 billion this year 6/15/2022
Front-end fab equipment spending is expected to increase 20% y-o-y to an all-time high of $109 billion in 2022, marking a third consecutive year of growth following a 42% surge in 2021, reports SEMI.
SK hynix supplied the first HBM3 DRAM module to Nvidia 6/15/2022
The announcement comes just seven months after the company became the first in the industry to develop HBM3 in October, and is expected to solidify the company’s leadership in the premium DRAM market.
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