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Applied Materials signs MOU to create training courses for Singapore employees 7/29/2022
The initiative underscores the importance of building and maintaining a future-ready talent pipeline in Singapore to serve the global semiconductor industry.
Kioxia Holdings and Western Digital Corp (WDC.O) to get $680 million from the Japanese government 7/28/2022
The subsidy is part of a broader effort to revive chip production in Japan, as tensions between China and the United States and COVID-19 pandemic disruptions spur concern that Japanese companies such as automaker Toyota Motor Corp (7203.T) could be hobbled by semiconductor shortages.
India’s power demand set to surge 6% 7/28/2022
India’s power demand is seen growing over 6% for the second straight fiscal year, and above the pre-pandemic levels and the long-period average growth of 5%. This trend of above-average growth could continue for two more fiscals.
Cadence Design Systems help Samsung Achieve 2X Productivity on Large-scale Analog IP 7/28/2022
Samsung Foundry has deployed Cadence Design Systems Inc.’s Spectre FX Simulator for FastSPICE-based verification of their large-scale analog and mixed-signal IP on 3nm, 4nm and 5nm processes.
An international research team created a 2.8nm transistor 7/28/2022
WPI-MANA has used a transmission electron microscope (TEM) to create a 2.8nm transistor consisting of nanochannels embedded in metallic carbon nanotubes (CNTs), which exhibits quantum transport at room temperature.
President Joe Biden praises SK Group to put new investments in the United States semiconductors 7/27/2022
They will come in addition to its $7 billion investment to build two new gigafactories in Tennessee and Kentucky as part of a joint venture with Ford Motor (F.N).
STMicroelectronics has introduced the market’s first Serial Page EEPROM 7/27/2022
This brand-new class of EEPROM is a high-density, page-erasable SPI memory that delivers unique and unprecedented flexibility and performance with ultra-low power consumption. Starting with the 32Mb M95P32, ST will grow the new Serial Page EEPROM family by adding 16Mbit and 8Mbit density options in due course.
Samsung SDI to build a second battery production facility in Seremban, Malaysia 7/27/2022
Samsung SDI’s decision to construct the second factory in Malaysia comes as a strategy to meet the rising demand for cylindrical batteries recently. The batteries from the Plant 2 will be used in various applications ranging from electrical tools, micro-mobility to electric vehicles.
Intel Corp.to foundry for MediaTek Inc. 7/27/2022
Intel Corp. and MediaTek Inc. have announced a strategic partnership to manufacture chips using Intel Foundry Services’ (IFS) advanced process technologies. The agreement is designed to help MediaTek build a more balanced, resilient supply chain through the addition of a new foundry partner with significant capacity in the United States and Europe.
Semiconductor Chip Bill is not without opposition in Washington 7/26/2022
Sanders, I-Vt., said he doesn’t hear from people about the need to help the semiconductor industry. Voters talk to him about climate change, gun safety, preserving a woman’s right to an abortion and boosting Social Security benefits, to name just a few.
Smartphone market sales declined by 4% month-on-month (MoM) and 10% year-on-year (YoY) in May 2022 7/26/2022
Even after a “V” shaped recovery following the first COVID-19 wave in 2020, the smartphone market has still not reached the pre-pandemic levels. In 2021, the smartphone market was impacted by supply constraints and persistent COVID waves.
Wide bandgap SiC semiconductors are finding a home in industrial applications 7/26/2022
Silicon carbide (SiC) has been used in a variety of applications for well over 100 years. Today, however, the semiconductor material is gaining more popularity than ever before, largely driven by its usage in industrial applications.
Massively scalable qubit technologies are a must for Quantum computing 7/26/2022
For several sectors looking to drastically increase their procedures and capacities, quantum computing opens the next frontier of computing power. To achieve this, massively scalable qubit technologies must be created. Additionally, rising quantities of qubits must be controlled, and error levels must be kept as low as possible to prevent measurement from being impacted.
Market for vehicle SiC power components is forecast to reach $1.07 billion in 2022 7/25/2022
The automotive SiC power component market is currently dominated by major European and American IDMs. The key suppliers STMicroelectronics, onsemi, Wolfspeed, Infineon Technologies, and ROHM have long been deeply involved in this field and have close interactions with major automakers and Tier 1 manufacturers.
$52 billions U.S. CHIPS Act is close to approval 7/25/2022
On July 19, the Senate voted 64–34, demonstrating bipartisan support for the bill designed to provide more than $52 billion to boost U.S. semiconductor competition with Chi
eMMC interface shines over UFS for low–power, low–capacity applications 7/25/2022
UFS was trumpeted as widely replacing eMMC when it debuted, it’s overkill for some applications. Eric Spanneut, vice president of flash global product management for Western Digital’s flash business unit, said eMMC works best for mid–range mobile devices and thin–and–light entry–level compute devices, as well as wide range of emerging applications. “eMMC is here to stay for a very long time,”
STMicroelectronics is on track to reach its goal of over $20 billion in revenues in 2025 7/25/2022
STMicroelectronics is on track to reach its goal of over $20 billion in revenues between 2025 and 2027, underpinned by its strategy for three long-term enablers: smart mobility; power and energy; and Internet of Things (IoT) and connectivity.
Qualcomm offers ultra-low-power chip tor smartwatch and wearables 7/22/2022
The new chips promise up to 2X faster with up to 50% longer battery life for smartwatches using Google’s Wear OS.Dubbed the Snapdragon W5 and W5+ Gen 1, the chips represent a huge generational leap for Qualcomm, which built them on the 4-nm node.
Huawei’s Carrier Business Group argued operators’ efforts to improve energy efficiency 7/22/2022
Huawei warned energy efficiency improvements were required to help offset rapid rises in carbon emissions over the next five to ten years resulting from soaring global mobile data traffic.
Toshiba favors 4 firms as potential acquirers 7/22/2022
Toshiba announced on Tuesday it has settled on a shortlist of potential buyers, with local reports suggesting its list of suitors includes Bain, Japan Industrial Partners, Brookfield Asset Management and CVC Capital Partners.
SkyWater Foundry to invest $1.8 billion for an IC R&D research facility in Indiana 7/22/2022
SkyWater expects the ground breaking for the new facilities to happen in 2023, according to its spokesperson, but the timing would depend on whether the chip legislation is passed.
Overstock situations drive NAND prices down 10 to 13% 7/21/2022
According to TrendForce. The market consensus is a disappointing 2H22 peak season for consumer electronics including notebooks, TVs, and smartphones. Material inventory levels continue to rise and has become a risk to the supply chain.
Cadence Design Systems and Tower Semiconductor collaborate to advance automotive and mobile IC development 7/21/2022
Through the collaboration, the companies are developing a new, comprehensive automotive reference design flow using the Cadence Virtuoso Design Platform and Spectre Simulation Platform to provide customers with a faster design cycle, maintaining comprehensive design verification for advanced automotive IC product development.
ASML cuts outlook 7/21/2022
Due to supply chain constraints, ASML has increased fast shipments to its customers and revised its sales growth forecast, from 20% to 10%, for fiscal year 2022.
First Power 'ChiP' Fab Supports Automotive Electrification and Data Centers 7/21/2022
Vicor Corp., the industry leader in innovative power–module design and manufacturing, has recently celebrated the opening of a new 90,000-square-foot, state-of-the-art manufacturing facility in Andover, Massachusetts. The power–module–manufacturing facility, created to support the demand coming from the fast-growing automotive electrification and data center/AI industries, is the world’s first converter-housed-in-package (CHiP) fabrication facility.
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