Home News Products Corporate Contact

Tuesday, February 25, 2025

News Industry News Publications CST News Help/Support Software Tester FAQs

Electronics supply chain show signs of stabilizing 8/24/2022 Electronic component availability is improving, and prices are stabilizing across many categories, it concluded that global supply chain issues, extended lead times, geopolitical uncertainty, elevated logistics and labor costs would remain problematic for the electronics ecosystem and specific end markets into the first half of 2023. Semiconductor capital spending on track to $185.5B this year 8/24/2022 IC Insights forecasts that semiconductor capex will only grow by 21% to $185.5 billion this year, down from the projected $190.4 billion and 24% growth at the beginning of this year. Sony Semiconductor Solutions Corp.’s picks Efinix FPGA for HDR Camera Board 8/24/2022 The small form factor development kit leverages the tiny 3.6-by-4.5mm wafer level chip scale package available for the Trion T20, whose embedded MIPI, integrated DDR3, high I/O to logic ratio, and small physical size make it ideal for edge and IoT applications. Intel Graphics (AXG) Group Lags behind competitors AMD and Nvidia 8/24/2022 While the scars of Intel’s disastrous second-quarter results and closure of the Optane memory business are still fresh, a new report from John Peddie Research calls its GPU business results embarrassing. South Korea's semiconductor shipment to China continue to expand 8/23/2022 The research by the Korea Chamber of Commerce and Industry (KCCI) showed that semiconductors took up only 3.2 percent of South Korea's total exports to China in 2000 but jumped 12.4 times to 39.7 percent 20 years later. U.S. Chip 4 alliance could hold back China's momentum 8/23/2022 Chip 4 alliance is a proposed alliance of semiconductor powerhouses in the U.S., Taiwan, Japan, and South Korea to enhance cooperation on the design and production of sophisticated semiconductors. JEDEC advanced UFSHCI 4.0 standard 8/23/2022 UFS 4.0 introduces significant bandwidth and data protection improvements over the earlier version of the standard. Kyocera to construct a new production facility at its Kokubu Plant Campus in Kagoshima, Japan 8/23/2022 This will increase its production capacity of multilayer ceramic capacitors (MLCCs), strengthen engineering development capabilities, and ensure ample manufacturing space as Kyocera’s business expands. Applied Materials generated revenue of $6.52 billion for the quarter 8/22/2022 The company generated $1.47 billion in cash from operations and returned $1.23 billion to shareholders including $1.00 billion in share repurchases and $225 million in dividends. US EDA Software Ban May Affect China's Advanced IC Design 8/22/2022 Even if China purchased a large amount of authorized EDA software before the current sanction takes effect, the software must connect to the developer for license updates before it can be used. Cadence has collaborated with GlobalFoundries (GF) to accelerate 5G and mobile design innovation 8/22/2022 As a proof point, the Cadence full-flow RF solution was used to design and tape out a 28GHz 5G mmWave IC on the GF 22FDX platform and design an integrated antenna as a complete system-in-package (SiP) solution. EAC to highlight EV semiconductor contents 8/22/2022 The EV market is gradually taking off, driven by a combination of legislation, government tax breaks, and popularity with consumers. A recent Gartner forecast estimates 6 million electric cars will be shipped in 2022, up from 4.5 million in 2021, and this figure will reach 36 million cars by 2030. KIOXIA Europe is sampling new industrial-grade 3D NAND devices 8/19/2022 Densities range from 512 gigabits (64 gigabytes) to 4 terabits (512 gigabytes) to support the requirements of industrial applications - including telecommunication, networking, and embedded computing. Digi-Key to celebrate ribbon cutting of expansions at headquarters 8/19/2022 The new facility allows Digi-Key to pick, pack and ship nearly three times the previous daily average of 27,000 packages to customers in more than 180 countries around the world. Micron’ cuts Capex after announcing $40 billion expansion in the U.S. 8/19/2022 “We’re responding to a market condition where supply needs to be adjusted. We need to work through this and figure out a way to right-size the capacity.” Electronic Asia to show latest trends and technology developments in the electronics and semiconductor industry 8/19/2022 This year’s conference will focus on Internet of Things (IoT), automotive electronics, wireless technologies, and the supply chain. Samsung SDI forms battery R & D unit in Germany 8/18/2022 It will work with universities, research institutes and startups in various regions to improve the performance of batteries and develop a new generation as demand for electric vehicles grows. Teledyne LeCroy offers test equipment ready for USB4 8/18/2022 The merging of USB with Thunderbolt 3 into USB4 should eventually mean that users will have one I/O cable for everything. While consumers will have to wait until at least 2020 for the first USB4 products, engineers must first design and test those products. Silicon Motion offers NAND Memory Solutions for Autonomous and Electric Automotive Applications 8/18/2022 Any NAND flash storage device must keep pace with capacity requirements, low latency, and performance by delivering fast read and write speeds and high data throughput. Despite this consolidation, there will be a variety of different NAND storage types to support the required data storage demands in autonomous and electric vehicles. It is important to have softwaae defined cars 8/18/2022 The concept of the software–defined car contrasts with this vision and aims at the introduction of software distributed on a limited number of processors, which share sensors and the communication network to enable advanced features like autonomous driving, powertrain, body control and infotainment. Nordic Semiconductor offers it's first Wi-Fi chip 8/17/2022 The launch makes Nordic Semiconductor one of the few companies in the world to offer all three of the world’s most popular wireless IoT technologies: Bluetooth, Wi-Fi, and cellular IoT. Ventana raised $55 million for C-V Chiplets in Data Centers 8/17/2022 Ever since Ventana Micro Systems came out of stealth last year, the company has been busily developing relationships with partners and potential customers to create traction for its RISC-V–based chiplets, which it believes will address the high-performance computing demands in data centers and at the edge. Dozens of Hot Chips will soon be upon us. 8/17/2022 Look out for dozens of interesting AI chips, Intel, and Tesla keynotes and tutorials on CXL and MLIR at Hot Chips this year. Photonics computing industry is at the begining line 8/17/2022 The dreams of smart cities, smart autonomous mobility, smart personalized medicine, and beyond are truly unlimited. What’s more, despite the huge data processing involved, it can all be done in real-time, along with predictive and auto-improving cybersecurity capabilities Imec has a roadmap for the next 20 years 8/16/2022 Dennard scaling is no longer enough. “This one-dimensional version of the roadmap may not be sufficient anymore for the future,” said Van den hove (pictured) “we will have to tune our devices for specific applications. Luc Van den hove - Imec President and CEO  95  |  96  |  97  |  98  |  99  |  100  |  101  |  102  |  103  |  104

Copyright © 1994 - 2023 CST, Inc. All Rights Reserved