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Samsung plans onn 1.4nm node 10/11/2022
Samsung highlighted its commitment to bringing its most advanced process technology, 1.4-nanometer (nm), for mass production in 2027.
Infineon to open new factory to assembly and testing of high-power modules for EV's 10/10/2022
The new manufacturing capacities will help Infineon accommodate the growing demand for electromobility applications.
Renesas partnering with Jariet Technologies to bolster its wireless transceiver solutions 10/10/2022
As part of the partnership, Renesas is investing $7 million into Jariet’s new round of funding.
U.S. added limits on exports of chips to China 10/10/2022
The U.S. Department of Commerce (DoC) added limits on exports of chips and related production tools to China, citing national security concerns.
Many industries are looking at 5G private networks to boost productivity, efficiency 10/10/2022
There is growing excitement over the rise of 5G private networks, and with good reason. With 5G’s promise of abundant speed, ultra-high reliability, and superior bandwidth.
Samsung to go for 1,000 layers NAND 10/7/2022
Samsung Electronics plans to defend memory supremacy by initiating commercial production of flash memory on ninth-generation processing technology in 2024 and raise the height in NAND architect to 1,000-layers by 2030 through persistent investment regardless of the up and down cycle in chip industry,
Connected car penetration surpassed that of non-connected cars for the first time ever 10/7/2022
Non-connected cars have been steadily declining as automakers prefer to upgrade their portfolio with factory-fitted embedded connectivity even in base model variants.
Synopsys Inc.’s EDA verifies Samsung 3nm designs 10/7/2022
Synopsys Inc.’s longstanding collaboration with Samsung Foundry has produced multiple successful test chip tapeouts on Synopsys digital and custom design tools and flows, certified for Samsung Foundry’s most advanced process.
Chip Act prompts Micron to build $100 billion fab in NY State 10/7/2022
The announcement follows the company’s $40 billion fab project in Boise, Idaho, that coincided with passage of the U.S. CHIPS Act this year. The New York site could include four 600,000-square-foot cleanrooms in a space equivalent to 40 U.S. football fields.
SoftBank Group CEO Masayoshi Son leaves little room for Samsung to go into Arm 10/6/2022
Korean press has been speculating that SoftBank Group may try to unload the asset in a sale to Samsung Electronics despite a deal of that nature being almost impossible for antitrust reasons.
Silicon carbide is a popular choice for design engineers 10/6/2022
Silicon carbide is becoming an increasingly popular choice for design engineers looking for more robust semiconductor material options.
Infineon has a load of IOT applications for the Smart and Sustainable Homes 10/6/2022
The Connectivity Standards Alliance’s (CSA) newly released Matter 1.0 specification helps alleviate these challenges by offering one unified standard for device makers to follow for many smart home applications including smart locks, lighting, thermostats, security systems, sensors and media devices.
Molex expands manufacturing in Vietnam 10/6/2022
Molex is strengthening its presence in Vietnam by expanding its existing manufacturing operations in Hanoi to include a new 16,000 square meter facility. The company expects the expansion will support over 200 new jobs in advanced high-tech manufacturing.
Apple lost its bid to cancel two Qualcomm patents and the case is now settled 10/5/2022
Apple previously sourced modem chips from Qualcomm, but switched to Intel for a short period when business negotiations reached an impasse. Fast forward to 2019 and both companies reached a settlement, stopped litigation, and resumed business as usual.
Semicon Taiwan 2022 gives industry something to hope for 10/5/2022
Semicon Taiwan 2022, held this month, was an excellent gauge of where the Taiwanese industry is and where it is going. Thousands of engineers, technologists, technicians, and suppliers crowded the halls at the Nangang Exhibition Center in Taipei.?
South Korea joins Chip 4 talks 10/5/2022
South Korea, which has been reluctant to discuss the formation of a “Chip 4” alliance with the United States, Japan, and Taiwan because of concerns about a possible trade war with China, is joining the talks,
ASE show plans of Smart Factory 10/5/2022
ASE has unveiled plans for the the world's first 5G mmWave NR-DC SA smart factory.
NTT Docomo and NEC have conducted tests on Arm-based processors consume 72 percent less power 10/4/2022
The two companies said they have completed a trial to test the energy efficiency and performance of AWS Graviton2 processors used across key elements of the 5G core network operated by the Japanese telco.
Kioxia to cut 3D NAND production 10/4/2022
Kioxia said it would cut down production of 3D NAND memory at its fabs located at its Yokkaichi and Kitakami sites. Demand for PCs and many other devices is slowing due to high inflation rates, geopolitical tensions, and macroeconomic factors,
Advanced packaging industry is expected to have a 9.6% CAGR between 2021 and 2027 10/4/2022
The advanced packaging segment as compared with traditional packaging market continues to increase, with more than 50% of the market by 2027.
Intel's Mobileye Unit setting up for IPO 10/4/2022
Mobileye, an Intel-owned company that makes chips, maps, and software for self-driving cars, has filed for an IPO, according to a prospectus filed with the SEC on Friday.
South Korea earmarked $837 million for the development of AI semiconductor technology 10/3/2022
The Korean government has set a goal to elevate the county to the world’s No. 3 digital innovation powerhouse and cement the country’s leadership among OECD countries in digital infrastructure and digital government index.
Global fab equipment spending to be $100 Billion worth 10/3/2022
Global fab equipment spending for front-end facilities is expected to increase approximately by 9% year-over-year (YOY) to a new all-time high of $99 billion in 2022, according to SEMI’s quarterly World Fab Forecast report. The report also shows the global fab equipment industry increasing capacity this year and again in 2023.
Intel Foundry Service targets DOD as number 1 customer 10/3/2022
Intel Foundry Service plans to be part of the DoD state-of-the-art heterogeneous integrated packaging (SHIP) program. That program will necessitate deep knowledge of gate-all-around (GAA) technology facilitating high-transistor–density 3D chips.
EV charging infrastructure to be a challenge 10/3/2022
Annual sales surpassed 10 million for the first time this year, and they are forecast to grow to more than 65 million by 2031. But the rollout of EV charging infrastructure in most countries is way behind the level required to serve the rapidly growing installed base of EVs.
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