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Denso Corp. may consider spinning off its chip business for $3.1 billion 6/13/2022
Well known as the world’s second-biggest auto-parts maker, Denso has also quietly built up a presence in automotive chips. Now, with semiconductor-related capital expenditures totaling around 160 billion yen over the past three years, Denso ranks as the world’s fifth-largest supplier of automotive chips by sales.
Purdue University offers specialized semiconductor engineering degree 6/13/2022
“In order to satisfy the increased demands that we see with perhaps 13 new fabs being built in the U.S. over the next five years or so, we see a demand for something like 50,000 new semiconductor engineers,” Mark Lundstrom, a professor of Electrical and Computer Engineering at Purdue University, told EE Times. “That’s more than double the number of semiconductor engineers that U.S. universities are currently producing.”
IDC predicts Semiconductor equipment market to pull back in 2022 6/13/2022
IDC warns that chip manufacturers building new capacity could lead to a glut of chips.
Renesas Electronics offers MPU geared for motor drives 6/13/2022
The RZ/T2M combines fast and highly precise real-time motor control capabilities and the latest industrial Ethernet on a single-chip, while also supporting functional safety operation. By providing all essential peripheral functions for motor control, the RZ/T2M enables customers to reduce the number of external components, thereby decreasing BOM costs and product size.
Powertech Technology (PTI) to see memory backend assembly and test business to increase 6/10/2022
Despite some noises on the market suggesting slowdowns in handsets and other consumer devices are dragging down both DRAM and NAND flash prices, PTI has been busy fulfilling orders from its Japan-based client in the second quarter.
Senator Maria Cantwell convene a classified briefing with Pentagon officials and Intel 6/10/2022
Lawmakers will negotiate a compromise measure to provide $52 billion in subsidies for U.S. semiconductor manufacturing.
Chip shortage puts further stress on Engineering resources 6/10/2022
Many believe the worldwide chip shortage issue will not ease until 2023, and it is set to get worse over the next 18 months as longer lead times and higher prices kick in due to major disruption of supply lines and production capability. This has triggered the need for new strategies from Governments and companies to counter the situation.
6G will offer download speeds approaching one terabit per second, and unlimited bandwidth 6/10/2022
6G technology will make huge improvements in bandwidth utilization, data delivery, and application enablement. It is expected 6G will offer download speeds approaching one terabit per second, one micro-second latency, and unlimited bandwidth.
Western Digital Corp reviewing strategic alternatives, for splitting off its storage units 6/9/2022
The announcement comes a month after prominent activist investor Elliott Management disclosed a stake of nearly $1 billion in the company and pushed it to separate its flash and hard-drive business. Elliott owns roughly 6% in the California-based company.
Marvell joins the Universal Chiplet Interconnect Express (UCIe) Consortium 6/9/2022
Marvell’s contributions to the UCIe standard will leverage the company’s advanced chiplet interconnect and packaging experience to help further the consortium’s objective of developing open standards that create a more robust ecosystem for inter-operable chiplets.
TI processors help expand edge artificial intelligence (AI) processing into next-generation applications 6/9/2022
The low-power design of the new processors enables support for dual-screen displays and small-size human-machine interface (HMI) applications.
Siemens Sofware Secures Embedded RISC-V Development 6/9/2022
Siemens’ Nucleus ReadyStart embedded development solution includes a host of new features that help customers enhance the security, flexibility, and cloud connectivity of their next-generation embedded products based on the RISC-V architecture.
NEC Corp to collaborate with NTT Docomo Inc. And Nippon Telegraph on 6G experimental trials. 6/8/2022
6G will require dramatic advances in communications technology to achieve 10 to 100 times higher speeds and capacities than 5G, with ultra-low power consumption of 1/100 and coverage that reaches from the depths of the ocean to the heights of outer space.
99% of EV buyers want wireless charging 6/8/2022
It is clear that wireless charging is set to transform the EV ownership experience, reducing barriers for adoption and improving the public charging landscape with interoperability.
Siemens Software’s now enables designers to leverage the newest GlobalFoundries silicon photonics platform 6/8/2022
GF Fotonix is the first in the industry to combine its differentiated 300mm photonics and RF-CMOS features on a silicon wafer, delivering best-in-class performance at scale.
TSMC commits to 2 nm node through Nanosheet Technology 6/8/2022
TSMC has chosen nanosheet technology for production of its next 2 nm node starting in 2025 to help cut energy consumption in high–performance computing (HPC) systems.
China's lock-down to affect smartphone IC supplies 6/7/2022
Taiwanese smartphone IC designer MediaTek Inc (???) and US rival Qualcomm Inc felt the sting of China’s COVID-19 lockdowns as their smartphone IC shipments from the country fell in April, market advisory firm CINNO Research said.
IBM warns: "the Chips Act is no sure thing." 6/7/2022
There's clearly a global recognition that we need to build up semiconductor supply chain capabilities, particularly in the U.S., Europe and Japan. There's a recognition that over-reliance on Taiwan is neither economically wise nor prudent from a national security standpoint. The reality is the war in Ukraine, while it has nothing to do with chips in Taiwan, has reminded everybody — as COVID did — that supply chains need to be robust.
Synopsys offers Big Data Analytics Technology 6/7/2022
The Synopsys DesignDash solution delivers a real-time, unified, 360-degree view of all design activities for faster decision making, a deeper understanding of run-to-run, design-to-design and project-to-project trends, and enhanced collaboration in the SoC development process.
NTU Singapore Selects Keysight Test Solutions for Advance 6G 6/7/2022
The Centre chose Keysight’s solutions to validate on-chip terahertz electronic-photonic devices such as transceivers.
Samsung's internal reshuffle shakes up semiconductor R & D team 6/6/2022
Samsung Electronics has reshuffled its semiconductor research center while its chief is heading out to Europe amid intensifying competition and challenge to its chip leadership.
Toshiba executives said Friday that privatization remains an option 6/6/2022
Tokyo-based Toshiba has been trying to win over shareholders to a restructuring plan. The company has not given the nationalities or other details of the potential investor partners, including eight that have recommended that Toshiba Corp. go private.
EPC provides power GaN FET for eBike and Drone applications 6/6/2022
Efficient Power Conversion Corp. (EPC) has launched the EPC9173, a 3-phase BLDC motor drive inverter using the EPC23101 eGaN IC with embedded gate driver function and a floating power GaN FET with 3.3 m? RDS(on).
India wants to become the next major global semiconductor hub 6/6/2022
Make in India: an initiative to attract foreign investments to start looking at India as a viable manufacturing hub by easing trade barriers in foreign policies. This initiative opens up the possibility of creating more jobs for a very heavily populated country like India, developing economic areas meant to serve for the development of these industries and hopefully strengthen the Rupee against the US dollar.
Winbond's secure flash is now SESIP Level 2 6/3/2022
The W77Q family has also been certified with the Common Criteria EAL2+, Functional safety ISO26262 ASIL-C level and FIPS 140-3 CAVP.
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