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| Efficient Power Conversion Corp.'s GaN transistors is now Rad-Hard |
7/4/2022 |
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With higher breakdown strength, lower gate charge, lower switching losses, better thermal conductivity, and very low on-resistance, power devices based on GaN significantly outperform silicon-based devices and enable higher switching frequencies resulting in higher power densities, higher efficiencies, and more compact and lighter weight circuitry for critical spaceborne missions.
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| Siemens and NVIDIA strengthen partnership to enable the industrial metaverse |
7/4/2022 |
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As a first step in this collaboration, the companies plan to connect Siemens Xcelerator, the open digital business platform, and NVIDIA Omniverse, a platform for 3D-design and collaboration. This will enable an industrial metaverse with physics-based digital models from Siemens and real-time AI from NVIDIA in which companies make decisions faster and with increased confidence.
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| Samsung leads industry with 3nm chips using a new nanosheet transistor |
7/4/2022 |
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Nanosheet technology promises to exceed performance limitations of FinFET, the current 3D-chip process used by Samsung and TSMC at the 7nm and 5nm nodes. Nanosheet is expected to improve power efficiency by reducing chip supply voltage levels, while also enhancing performance by increasing drive-current capability.
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| IC shipment to Russia down 90% |
7/1/2022 |
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Since the controls were put in place, global exports of semiconductors to Russia from all sources have declined by almost 90 percent,” said Raimondo, “leaving Russian companies without the chips they need for a wide variety of goods, including weapons like precision guided missiles and tanks.”
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| TSMC completes clean room Constuction in Japan |
7/1/2022 |
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The TSMC Japan 3DIC R&D Center, with its brand-new clean room facility, will pursue research into the next generations of three-dimensional silicon stacking and advanced packaging technologies in materials science.
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| Taiwan government urge U.S. to pass "Chip Bill" |
6/30/2022 |
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Aiming to incentivize that and other construction projects, the Senate last summer passed a bipartisan measure, known as the Chips Act, to spend $52 billion on manufacturer subsidies. But that legislation is still held up in congressional wrangling.
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| AMD investigating a potential data breach |
6/30/2022 |
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An AMD spokesperson told TechCrunch that the company “is aware of a bad actor claiming to be in possession of stolen data,” adding that “an investigation is currently underway.”
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| Tachyum offers a universal processor |
6/30/2022 |
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Rather than deciding to implement a CPU or GPU, a monolithic device may now be an option in the form of Prodigy, a universal processor developed by Tachyum. Prodigy combines the functionality of a CPU and GPU into a single architecture.
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| Details leaked on the upcoming AMD Dragon Range and AMD Phoenix CPUs |
6/29/2022 |
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Red Gaming Tech (RGT) on YouTube talked about the capabilities and specifications of some of the Ryzen 7000 processors for the mobile sector. AMD Dragon Range and Phoenix will each power laptops for gamers, but while Dragon Range will focus on delivering the best possible CPU performance, Phoenix will be competitive thanks to its built-in RDNA 3 iGPU.
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| Toshiba name two activist to board |
6/29/2022 |
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Toshiba has appointed two directors from activist hedge funds to its board possibly paving the way to a sale of the company to private equity.
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| Analog Devices offers high resolution 3D depth sensor module |
6/29/2022 |
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Analog Devices Inc. has launched the industry’s first high-resolution, industrial quality, indirect Time-of-Flight (iToF) module for 3D depth sensing and vision systems. Enabling cameras and sensors to perceive 3D space in one megapixel resolution.
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| Automated testing remains a challenge |
6/29/2022 |
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Survey found that only 11% of the respondents have a fully automated strategy. With growing complexity, the number of tests is increasing (77%) and without automation, product development slows.
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| TSMC launch clean room facility in Japan |
6/28/2022 |
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TSMC, the world's largest contract chipmaker, said the clean room at its Japanese subsidiary -- the TSMC Japan 3DIC R&D Center -- is located in the Tsukuba Center of the National Institute of Advanced Industrial Science and Technology (AIST).
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| China's Yangtze Memory Technologies plans to bring online a second plant |
6/24/2022 |
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The Chinese memory chip producer Yangtze Memory Technologies plans to bring online a second plant in its home city of Wuhan as early as the end of this year, sources familiar with the matter say, in a move that could further close the company's technology and output gap with global leaders like Samsung of South Korea and Micron Technology of the U.S.
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| SiC is not only for the automotive industry |
6/24/2022 |
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Despite SiC's wide use in the automotive industry, the technology is primed for use in other industries, including aerospace and power supply.Despite SiC's wide use in the automotive industry, the technology is primed for use in other industries, including aerospace and power supply.
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| Samsung to start mass production of 3-nanometer semiconductors |
6/23/2022 |
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The next-generation 3nm chips will be built on the Gate-All-Around (GAA) technology, which Samsung said will allow up to 45 percent area reduction while providing 30 percent higher performance and 50 percent lower power consumption, compared with the existing FinFET process.
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