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STMicroelectronics to build SiC substrate manufacturing facility in Italy 10/14/2022
Production is expected to start in 2023, enabling a balanced supply of SiC substrate between internal and merchant supply.
Electronics and Semiconductor Technologies to host virtual EAC 2022 10/14/2022
This year’s event, to be held from October 18–20, will focus on industries and applications including IoT, wireless technologies, automotive electronics, and the supply chain.
Japanese private equity fund, Japan Industrial Partners (JIP) joins bid on Toshiba 10/13/2022
JIP is reported to have asked over ten Japanese companies, including Chubu Electric, Orix Corp, Nippon Life Insurance Co, Toray Industries and Central Japan Railway Co to participate in a consortium.
Analog Devices offers Multiprotocol Industrial Ethernet Switch Platform 10/13/2022
Analog Devices Inc.’s ADIN2299 multiprotocol industrial ethernet switch platform addresses the connectivity needs of industrial and process automation, motion control, transportation, and energy automation.
EPC GaN ICs Simplifies and Shrinks Motor Drive Design 10/13/2022
The EPC9176 operates from an input supply voltage between 20V and 80V and can deliver up to 28Apk (20ARMS). This voltage range and power level makes the solution ideal for a variety of 3-Phase BLDC motor drive applications with 36V–80V input including eBikes, eScooters, power tools, drones, robots, DC servo, medical robots and factory automation.
Automakers Need to Reimagine Decades-Old Industry to Meet Modern Challenges 10/13/2022
By the end of this decade, the IEA projects that more than 300 million electric vehicles will be on the road and account for 60% of new vehicle purchases – up from 4.6% of new car sales today.
U.S. made exceptions to allow Korean memory companies to continue production in China 10/12/2022
The Commerce Department, which plans to release new curbs on exports of technology to China this week, will likely deny requests by U.S. suppliers to send equipment to Chinese firms like Yangtze Memory Technologies Co Ltd (YMTC) and ChangXin Memory Technologies, Inc (CXMT) if they are making advanced DRAM or flash memory chips,
IQE collaborates with SK siltron to development compound semiconductor products. 10/12/2022
IQE and SK siltron said that their focus will be on developing and delivering innovative epiwafers based upon Gallium Nitride (GaN) on Silicon Carbide (SiC) for radio frequency applications in the wireless communications market and GaN on Silicon (Si) for power electronics applications across a range of markets.
Soitec SmartSiC Wafers to Accelerate Adoption of SiC in EVs 10/12/2022
The demand for silicon carbide substrates has experienced massive growth, and SOI wafer supplier Soitec has developed SmartSiC technology to accelerate the adoption of SiC in electric vehicles.
10 major trends for 2023 10/12/2022
Market research firm TrendForce has detailed 10 major trends that are expected to take place across various segments in the tech industry in 2023.
Declines continued for the traditional PC market 10/11/2022
Cooling demand and uneven supply have contributed to a year-over-year contraction of 15%. However, shipment volumes remain well above pre-pandemic levels when PC volumes were largely driven by commercial refreshes due to the looming end of support for Windows 7.
Samsung Foundry has certified 8nm RFIC design reference flow for use with sub-6GHz to mmWave applications 10/11/2022
The flow’s advanced design methodology and unique features deliver added productivity, comprehensive electrical analysis and faster design closure to help customers implement high-quality RFIC designs with the first pass. The new flow helps joint Cadence and Samsung Foundry customers meet the growing global demand for 5G client devices, including smartphones and communications infrastructure equipment such as cellular base stations.
INDIEV Foxconn join force to develop the first INDI One prototype vehicle 10/11/2022
Partnering with Foxconn, the world’s leader in consumer electronics, during this exciting time in their entry into electric vehicles means that INDI One drivers will lead the way into the future of personal transit,” said INDIEV founder and CEO Shi Hai.
Samsung plans onn 1.4nm node 10/11/2022
Samsung highlighted its commitment to bringing its most advanced process technology, 1.4-nanometer (nm), for mass production in 2027.
Infineon to open new factory to assembly and testing of high-power modules for EV's 10/10/2022
The new manufacturing capacities will help Infineon accommodate the growing demand for electromobility applications.
Renesas partnering with Jariet Technologies to bolster its wireless transceiver solutions 10/10/2022
As part of the partnership, Renesas is investing $7 million into Jariet’s new round of funding.
U.S. added limits on exports of chips to China 10/10/2022
The U.S. Department of Commerce (DoC) added limits on exports of chips and related production tools to China, citing national security concerns.
Many industries are looking at 5G private networks to boost productivity, efficiency 10/10/2022
There is growing excitement over the rise of 5G private networks, and with good reason. With 5G’s promise of abundant speed, ultra-high reliability, and superior bandwidth.
Samsung to go for 1,000 layers NAND 10/7/2022
Samsung Electronics plans to defend memory supremacy by initiating commercial production of flash memory on ninth-generation processing technology in 2024 and raise the height in NAND architect to 1,000-layers by 2030 through persistent investment regardless of the up and down cycle in chip industry,
Connected car penetration surpassed that of non-connected cars for the first time ever 10/7/2022
Non-connected cars have been steadily declining as automakers prefer to upgrade their portfolio with factory-fitted embedded connectivity even in base model variants.
Synopsys Inc.’s EDA verifies Samsung 3nm designs 10/7/2022
Synopsys Inc.’s longstanding collaboration with Samsung Foundry has produced multiple successful test chip tapeouts on Synopsys digital and custom design tools and flows, certified for Samsung Foundry’s most advanced process.
Chip Act prompts Micron to build $100 billion fab in NY State 10/7/2022
The announcement follows the company’s $40 billion fab project in Boise, Idaho, that coincided with passage of the U.S. CHIPS Act this year. The New York site could include four 600,000-square-foot cleanrooms in a space equivalent to 40 U.S. football fields.
SoftBank Group CEO Masayoshi Son leaves little room for Samsung to go into Arm 10/6/2022
Korean press has been speculating that SoftBank Group may try to unload the asset in a sale to Samsung Electronics despite a deal of that nature being almost impossible for antitrust reasons.
Silicon carbide is a popular choice for design engineers 10/6/2022
Silicon carbide is becoming an increasingly popular choice for design engineers looking for more robust semiconductor material options.
Infineon has a load of IOT applications for the Smart and Sustainable Homes 10/6/2022
The Connectivity Standards Alliance’s (CSA) newly released Matter 1.0 specification helps alleviate these challenges by offering one unified standard for device makers to follow for many smart home applications including smart locks, lighting, thermostats, security systems, sensors and media devices.
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