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| Massively scalable qubit technologies are a must for Quantum computing |
7/26/2022 |
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For several sectors looking to drastically increase their procedures and capacities, quantum computing opens the next frontier of computing power. To achieve this, massively scalable qubit technologies must be created. Additionally, rising quantities of qubits must be controlled, and error levels must be kept as low as possible to prevent measurement from being impacted.
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| eMMC interface shines over UFS for low–power, low–capacity applications |
7/25/2022 |
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UFS was trumpeted as widely replacing eMMC when it debuted, it’s overkill for some applications. Eric Spanneut, vice president of flash global product management for Western Digital’s flash business unit, said eMMC works best for mid–range mobile devices and thin–and–light entry–level compute devices, as well as wide range of emerging applications. “eMMC is here to stay for a very long time,”
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| Toshiba favors 4 firms as potential acquirers |
7/22/2022 |
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Toshiba announced on Tuesday it has settled on a shortlist of potential buyers, with local reports suggesting its list of suitors includes Bain, Japan Industrial Partners, Brookfield Asset Management and CVC Capital Partners.
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| Overstock situations drive NAND prices down 10 to 13% |
7/21/2022 |
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According to TrendForce. The market consensus is a disappointing 2H22 peak season for consumer electronics including notebooks, TVs, and smartphones. Material inventory levels continue to rise and has become a risk to the supply chain.
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| ASML cuts outlook |
7/21/2022 |
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Due to supply chain constraints, ASML has increased fast shipments to its customers and revised its sales growth forecast, from 20% to 10%, for fiscal year 2022.
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| First Power 'ChiP' Fab Supports Automotive Electrification and Data Centers |
7/21/2022 |
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Vicor Corp., the industry leader in innovative power–module design and manufacturing, has recently celebrated the opening of a new 90,000-square-foot, state-of-the-art manufacturing facility in Andover, Massachusetts. The power–module–manufacturing facility, created to support the demand coming from the fast-growing automotive electrification and data center/AI industries, is the world’s first converter-housed-in-package (CHiP) fabrication facility.
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| Key Republicans put weight behind Chip Bill |
7/20/2022 |
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Sen. John Cornyn, R-Texas, who endorsed McConnell’s approach, said on the Senate floor Monday that Manchin’s announcement on taxes means “we’re in a posture where we can go forward with the chips funding and other related provisions.”
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| ARTERY Tech offers two new MCU series |
7/19/2022 |
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the AT32F435 and the AT32F437—featuring high performance and up to 288MHz operating frequency. The introduction of both new products will further add to the diversity of AT32 MCU Family on the top of the existing mainstream and ultra-value product lines.
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| Senate to vote on "Chip Bill" next week |
7/18/2022 |
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Voting in the Senate on a bill to boost the U.S. semiconductor industry and improve competitiveness with China could begin as early as Tuesday, Senate Majority Leader Chuck Schumer has been telling lawmakers, a source familiar with the issue said on Thursday.
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| EVG has breakthrough in die-to-wafer (D2W) fusion and hybrid bondin |
7/18/2022 |
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EV Group (EVG) has achieved a major breakthrough in die-to-wafer (D2W) fusion and hybrid bonding by successfully demonstrating 100-percent void-free bonding yield of multiple die of different sizes from a complete 3D system-on-a-chip (SoC) in a single transfer process using its GEMINI FB automated hybrid bonding system.
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