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| Samsung SDI forms battery R & D unit in Germany |
8/18/2022 |
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It will work with universities, research institutes and startups in various regions to improve the performance of batteries and develop a new generation as demand for electric vehicles grows.
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| Teledyne LeCroy offers test equipment ready for USB4 |
8/18/2022 |
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The merging of USB with Thunderbolt 3 into USB4 should eventually mean that users will have one I/O cable for everything. While consumers will have to wait until at least 2020 for the first USB4 products, engineers must first design and test those products.
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| It is important to have softwaae defined cars |
8/18/2022 |
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The concept of the software–defined car contrasts with this vision and aims at the introduction of software distributed on a limited number of processors, which share sensors and the communication network to enable advanced features like autonomous driving, powertrain, body control and infotainment.
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| Nordic Semiconductor offers it's first Wi-Fi chip |
8/17/2022 |
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The launch makes Nordic Semiconductor one of the few companies in the world to offer all three of the world’s most popular wireless IoT technologies: Bluetooth, Wi-Fi, and cellular IoT.
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| Ventana raised $55 million for C-V Chiplets in Data Centers |
8/17/2022 |
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Ever since Ventana Micro Systems came out of stealth last year, the company has been busily developing relationships with partners and potential customers to create traction for its RISC-V–based chiplets, which it believes will address the high-performance computing demands in data centers and at the edge.
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| Photonics computing industry is at the begining line |
8/17/2022 |
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The dreams of smart cities, smart autonomous mobility, smart personalized medicine, and beyond are truly unlimited. What’s more, despite the huge data processing involved, it can all be done in real-time, along with predictive and auto-improving cybersecurity capabilities
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| Imec has a roadmap for the next 20 years |
8/16/2022 |
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Dennard scaling is no longer enough. “This one-dimensional version of the roadmap may not be sufficient anymore for the future,” said Van den hove (pictured) “we will have to tune our devices for specific applications. Luc Van den hove - Imec President and CEO
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| Nextspace teams with Nvidia to develop digital twin tech |
8/16/2022 |
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The company’s partnership with Nextspace, a self-described metaverse “plumbing” firm providing cloud-based platform-as-a-service solutions to support federation of realistic, industrial digital twins in Nvidia’s Omniverse environment, and greater interoperability between digital twins.
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| Lip-Bu Tan joins Intel as Board member |
8/16/2022 |
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Lip-Bu Tan, executive chairman of Cadence Design Systems Inc., chairman of Walden International, and founding managing partner of Celesta Capital and Walden Catalyst Ventures, was elected to Intel Corp.’s board of directors, effective September 1, 2022. Tan will join the M&A Committee of Intel’s board of directors.
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| Neuromorphic has $1 million in pre–orders for its GrAI VIP chip. |
8/16/2022 |
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As with previous generations of the company’s Neuron Flow core, the company’s approach for its GrAI VIP chip uses concepts from event–based sensing and sparsity to process image data efficiently. This means using a stateful neuron design (one that remembers the past) to process only information that has changed between one frame of a video and the next,
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| SMART Modular Technologies offers uptime maximized memories |
8/15/2022 |
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SMART Zefr Memory has been tested under real-world conditions to identify and filter out marginal components that may undermine memory reliability. It uses proprietary screening process developed by SMART that when performed on memory modules ensures the industry’s highest levels of uptime and reliability.
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| Recovering Life for Retired Batteries |
8/15/2022 |
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At first glance, using these batteries in a so–called “second life” mode for ESS makes a lot of sense for many reasons. These batteries are widely available, don’t require major construction and siting efforts to user, are transportable and can be containerized, are quiet, have no moving parts, and are modular and scalable in capacity.
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| Ex-Arm Boss Quits SMIC’s Board |
8/12/2022 |
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Brown, a celebrated engineer who was part of Arm’s founding, is leaving SMIC after nine years on its board. He disclosed the move on his LinkedIn page. SMIC also confirmed the departure in an exchange filing.
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| China criticized the passing of U.S. Chip Act |
8/12/2022 |
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A Foreign Ministry spokesperson, said the US legislation would "disrupt international trade and distort global semiconductor supply chains," adding, "China firmly opposes that."
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| Share EV components market in India is likely to rev up |
8/12/2022 |
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Revenue of the electric vehicle (EV) components market in India is likely to rev up at a compound annual growth rate of around 76% to Rs72,500 crore in fiscal 2027 from Rs4,300 crore last fiscal. That will take the share of EVs in the overall automotive components market to around 9-11%—up from a negligible 1% currently
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| NEXCOM offers Arm System Ready Certified Product Selection |
8/12/2022 |
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DTA 1376 is a desktop uCPE appliance with NXP Semiconductor’s Layerscape LS1046A SoC processor containing quad 64-bit Arm Cortex-A72 cores inside, and has recently obtained the Arm SystemReady ES (Embedded Server) certification. DTA 1376 is a ready-to-deploy solution and its highlights include cost-effectiveness, power efficiency, flexibility, and software-friendliness. Other notable value-added features are Wi-Fi and 5G connectivity, which are essential in the IoT world.
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