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| India Government Offers Free Use of Indigenous 5G Test Bed |
8/11/2022 |
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Indian Government has decided to offer the use of indigenous 5G test bed free of cost to the government-recognized start-ups and MSMEs for the next six months, up to January 2023. It is available at a very nominal rate to all other stakeholders.
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| DRAM prices decline |
8/11/2022 |
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3Q consumer DRAM price drop from the original estimate of 8~13% to a quarterly decline of 13-18%.
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| China is expanding EV charging points |
8/10/2022 |
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China’s electric vehicle (EV) charging points increased by 56% year-on-year (YoY) in 2021, according to Counterpoint Technology Market Research’s latest China Electric Vehicle and Charging Points Tracker.
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| Keysight collaborated with Nokia to demonstrate the first public 800GE test |
8/9/2022 |
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With the move to the 800GE pluggable optics on front panel ports, interconnect and link reliability requires a new round of validation cycles to support carrier-class environments. These high-speed interfaces create a unique challenge as new 800GE capable silicon devices, optical transceivers and high bandwidth Ethernet speeds must be accurately tested.
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| Qualcomm extends foundry contract with GlobalFoundries |
8/9/2022 |
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The announcement, following the passage of the U.S. CHIPS and Science Act last week, secures wafer supply and commitments to support U.S.-based manufacturing through capacity expansion at GF’s most advanced semiconductor manufacturing facility in Malta, New York.
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| Microchip offers Portfolio of MPU-based System on Modules |
8/8/2022 |
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The SOM, based on the SAM9X60D1G System in Package (SiP), is a small 28-by-28 mm hand-solderable module that includes the MPU and DDR in a single package, along with power supplies, clocks and memory storage. The SAM9X60D1G-SOM is Microchip’s first SOM equipped with 4GB SLC NAND Flash to maximize memory storage of data in application devices, while the on-board DDR reduces the supply and price risks associated with memory chips.
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| AMD reported revenue growth by 70% |
8/5/2022 |
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Non-GAAP net income for the quarter was $1.707 billion, or $1.05 a share, beating expectations of $1.05 a share on revenues of $6.5 billion on a non-GAAP basis. AMD’s shares are down 3.7% to $95.55 a share in after-hours trading.
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| Pelosi to meet chairman of TSMC face-to-face |
8/5/2022 |
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House Speaker Nancy Pelosi (D-Calif.) will meet with the chairman of Taiwan’s biggest semiconductor manufacturer during her visit to the island, in a sign of how vital computer chips are to the U.S. economy and national security.
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| Intel's mass production of the tGPU chipset in Meteor Lake to be postponed |
8/5/2022 |
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Intel Corp. plans to outsource the tGPU (tiled GPU) chipset in Meteor Lake to Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) for manufacture, according to TrendForce research. Mass production of this product was initially planned for the second half of the year (2H22) but was later postponed to 1H23 due to product design and process verification issues.
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| IC market recorded its first-ever June sequential sales decline |
8/4/2022 |
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Based on data from WEMA, SIA, and WSTS dating back to 1976. Typically, high single-digit or double-digit sales gains have been the pattern for June IC sales. Even in its previously weakest year (1985), June IC sales increased 1%. Never, until this year, have June IC sales declined.
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| Infineon has reported another robust quarter |
8/4/2022 |
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Despite the challenging macroeconomic and geopolitical situation, Infineon has reported another robust quarter with revenue of €3.6 billion, up 10% sequentially and 33% year over year, in the third quarter of its fiscal year 2022. The Munich, Germany-based chipmaker has raised its revenue forecast for the full year 2022.
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| SK hynix discloses 238-layer 4D NAND Flash product |
8/3/2022 |
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According to the company, the latest achievement follows development of the 176-layer NAND product in December 2020. The latest 238-layer product is most layered and smallest in area at the same time.
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| Avery Design Systems offers Chiplet Verification IP |
8/3/2022 |
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Avery Design Systems, known for its functional verification solutions for key semiconductor technologies, including PCI Express (PCIe), Compute Express Link (CXL), and HMB3, now offers comprehensive support for the new Universal Chiplet Interconnect Express (UCIe) with high–quality models and test suites that support pre–silicon verification of systems using UCIe
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