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ITRI and Oxford Instruments Achieved improvement on GaN HEMT Performance 9/26/2022
The new gallium nitride (GaN) high-electron-mobility transistor (HEMT) device architecture—referred to as GaN MISHEMT—is defined by a recessed and insulated gate junction into the aluminum gallium nitride (AlGaN) layer.
Rohde & Schwarz offers spectrum analyzer to cover 5G spectrums 9/26/2022
Rohde & Schwarz has extended the frequency range of its R&S FSV3050 and R&S FSVA3050 signal and spectrum analyzer families to 50GHz. An additional option empowers the extension of signal analysis even up to 54GHz.
What's Next in Energy Storage Systems? 9/26/2022
Pay-as-you-go solar systems are growing in popularity in Africa and some parts of Asia, where people can access electricity for about $6 to $8 a month.
Microchip introduces FPGAs for functional safety certification 9/23/2022
Package deliverables include certification of Microchip’s Libero SoC design suite v11.8 service pack 4, associated development tools, and 28 of the company’s IP (intellectual property) cores, as well as safety manuals, documentation and device data sheets. Certification was through TÜV Rhineland, and a safety certificate from TÜV Rhineland is provided.
Lisa Su heads for Taiwan to negotiate with TSMC 9/23/2022
Lisa Su plan to visit Taiwan in late September – early November to discuss collaboration with local partners. Among the companies, AMD's management intends to meet are Taiwan Semiconductor Manufacturing Co., chip packaging specialists, and big PC makers.
Infineon keeps HyperRAM alive 9/23/2022
Its HyperRAM expansion memory can trace its roots back to Spansion, which merged with Cypress Semiconductor in late 2014. First announced in early 2015 as a companion RAM device, HyperRAM was designed for use in systems-on-chip (SoCs) and microcontrollers (MCUs), where both RAM and flash are connected to the same HyperBus interface; development of the initial HyperRAM technology was informed by the prior work on HyperBus and HyperFlash technologies.
A new kind of computer and is ear-worn 9/23/2022
With it comes a multitude of electronics engineering needs and opportunities. The headphones coming down the pike are better defined as “ear-worn computing” than audio players.
DRAM market hit cyclical collapse 9/22/2022
Given the current outlook, IC Insights estimates the DRAM market will be 38% smaller in 3Q22 than when it last peaked in 3Q21. Moreover, IC Insights also anticipates more downside for the DRAM market through 4Q22 and into early next year.
Startup ElFys has raised €3 million to ramp up Black Silicon Induced Junction Photodiode 9/22/2022
ElFys was founded in 2017 to commercialize a patented photodetector technology invented by a group of researchers at Aalto University in Espoo, Finland. It provides black silicon induced-junction photodiodes that are claimed to provide superior sensitivity over wide spectral range, especially in the ultraviolet as well as ultra-wide viewing angle.
Renesas offers industry’s first RISC-V MCU specifically optimized for advanced motor control systems 9/22/2022
The new solution enables customers to benefit from a ready-to-use, turnkey solution for motor control applications, with no development cost. Customers benefit from reduced time to market and cost reductions with the delivery of a pre-programmed ASSP that eliminates RISC-V related tools and software investment.
Gridtential, Partners Chasing Li-ion Battery with new material 9/22/2022
Recent progress made in the use of new materials for the manufacture of batteries paves the way for alternative solutions able to unlock the known limits.
Calumet Electronics to be one of the first IC substrate suppliers in the United States 9/21/2022
“We have been developing this capability for about three years. We are nearly completed with our first substrate demo-builds in cooperation with a few defense and commercial OEMs. We are not even in production yet, and potential demand for our substrates is already over 1.5 million units a year.”
Wearables market faced another challenging quarter 9/21/2022
The wearables market faced another challenging period in the second quarter of 2022 (2Q22) as global shipments declined by 6.9% year over year to 107.4 million units, according to new data from the International Data Corp. (IDC) Worldwide Quarterly Wearable Device Tracker.
5G might not be as rosy as we thought 9/21/2022
When reading about 5G in news and technical articles, white papers, and blog posts, it can appear to be the cure to all of our problems, but 5G may not live up to the hype surrounding it.
New digital technology enhanced health care applications 9/21/2022
The healthcare sector is experiencing a digital renaissance that is improving the experience of both patients and practitioners. The remote care facilitated by the IoMT results in better patient outcomes and improves the experience of healthcare workers.
Samsung expanded its market share of the global semiconductor industry in Q2 9/20/2022
Samsung's chip revenue for the April-June period came in at a record quarterly high of $20.3 billion on the back of solid server demand, taking up 12.8 percent of the global total of $158.1 billion, according to research firm Omdia.
China's EV sales doubled in Q2 9/20/2022
Pure battery electric vehicles (BEVs) accounted for almost 78% of total EV sales, while the remaining were plug-in hybrid electric vehicles (PHEVs). BYD remained the market leader, followed by Wuling and Tesla. Emerging brands, such as Xpeng Motor, Neta (Hozon Auto), Leapmotor, Li Auto, NIO and AITO (Seres), proved to be strong competition for the top players.
Major breakthrough in UV-C LED technology from Silanna UV offers huge advantages for sensing applications 9/20/2022
A major breakthrough in UV-C LED technology from Silanna UV offers huge advantages for applications as diverse as disinfection, water quality monitoring, gas sensing, liquid chromatography, and chemical and biological analysis. The new manufacturing approach promises to make deep ultraviolet and far ultraviolet LEDs easier to make, more efficient at shorter wavelengths, and more reliable.
Nvidia debuts benchmarks for latest flagship GPU, first chip to be built on the company’s Hopper architecture 9/20/2022
The company’s Hopper architecture with its specially designed transformer engine. H100 outperformed Nvidia’s current flagship, the A100, by 1.5-2× across the board, except for the BERT scores where the advantage was more pronounced with up to 4.5× uplift.
Wolfspeed to invest $5 billion on silicon-carbide (SiC) materials plant 9/19/2022
The company said the new facility will be located on the outskirts of Raleigh, N.C., close to its corporate headquarters in Research Triangle Park.
Silanna UV offers major breakthrough in UV-C LED technology 9/19/2022
The new manufacturing approach promises to make deep ultraviolet and far ultraviolet LEDs easier to make, more efficient at shorter wavelengths, and more reliable.
Ancora Semiconductor raise first round capital of NT$456 million 9/19/2022
Ancora Semiconductor Inc., a Delta Electronics affiliate focusing on gallium nitride (GaN) technology, has raised NT$456 million in its first capital raising round from strategic investors ROHM Co. Ltd, Sino-American Silicon (SAS), uPI Semiconductors, and Delta Electronics Inc.
Intel put emphasis on RISC-V cores 9/19/2022
The premise behind the new Intel Pathfinder platform is that system-on-chip (SoC) architects and system software developers can create their own products using a variety of RISC-V cores and intellectual property (IP) from the partner ecosystem, instantiate on FPGA and simulator platforms, and then run industry leading operating systems and tool chains within a unified IDE.
Arm has beefed up its Arm Neoverse product roadmap 9/16/2022
The roadmap features the addition of Arm Neoverse V2, code named Demeter, for years into the future. Neoverse V2 is the latest Arm core targeted at providing leadership in per-thread performance for the cloud, hyperscale, and high-performance computing workloads,
Brewer Science to show advanced packaging at SEMICON Taiwan 2022 9/16/2022
Dr. Alvin Lee will address cost-effective solutions and innovative material technologies that enable advanced wafer-level packaging applications. Materials will be discussed that address the growing challenges in applications requiring thin wafer handling, die attach, high-temperature processing, permanent adhesives, dielectrics, and wafer cleaning.
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