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EU wants to have their own European Chip Act |
9/7/2022 |
The pathway to digital sovereignty is still long and winding, but it is worth noting the first steps taken to revive Europe’s sagging semiconductor manufacturing industry.
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China's BYD overtakes Tesla in EV sales |
9/6/2022 |
BYD Auto: For the first time, BYD Auto became the top-selling EV brand, dethroning Tesla. During Q2 2022, BYD Auto shipped more than 354,000 EV units, an increase of 266% YoY. The company officially stopped production and sales of internal combustion engine vehicles in March 2022 and has been focusing on the development of BEVs and PHEVs.
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Winbond is now certified for the ISO/SAE 21434 |
9/6/2022 |
ISO/SAE 21434 standard protects vehicle and automotive security by specifying the requirements to make automotive systems more robust against cyber-attacks. It outlines the criteria needed during the concept, development, production, usage and decommissions of automotive systems.
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Micron to add new $15 billion memory fab in Boise, Idaho, |
9/5/2022 |
The new Micron memory fab will be located adjacent to the company's main R&D center near its headquarters in the city, which is expected to enhance operational efficiency, accelerate technology deployment and improve time to market.
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Meta Platforms Inc to have Qualcomm make its VR custom chips |
9/5/2022 |
Meta Platforms Inc (META.O) signed an agreement to have chip-maker Qualcomm Inc (QCOM.O) produce custom chipsets for its Quest virtual reality (VR) devices, the companies announced at a consumer electronics conference in Berlin on Friday.
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Global Smartphone shipment to slow down |
9/5/2022 |
Shipments of smartphones will decline by 6.5% to 1.27 billion units in 2022, according to the latest International Data Corp. (IDC) Worldwide Quarterly Mobile Phone Tracker forecast. The decline is due to record-breaking inflation, geopolitical tensions, and other macroeconomic challenges.
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Arm is suing Qualcomm for breach of contract |
9/2/2022 |
Arm’s lawsuit alleges that Arm-based designs by Apple spin-off Nuvia, which was bought for $1.4 billion by Qualcomm in March, cannot be legally transferred to Qualcomm without permission from Arm.
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Renesas to acquire Steradian Semiconductors Private Ltd |
9/2/2022 |
Renesas Electronics Corp. has entered into a definitive agreement to acquire Steradian Semiconductors Private Ltd, a fabless semiconductor company based in Bengaluru, India, that provides 4D imaging radar solutions
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STMicroelectronics offer dual Op-Amp to Drive Power-hungry Industrial, Automotive Loads |
9/1/2022 |
The TSB582 operates from 4V-36V supplies and contains two operational amplifiers (op amps), each capable of sinking/sourcing up to 200mA. This enables direct connection of a load in bridge-tied mode, allowing one TSB582 to replace two single-channel power op amps or high-current drivers built from discrete components. While integrating two op amps into one package,
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Semtech's Randy Ryder explains about the developments and innovations in connectivity |
9/1/2022 |
The market is currently witnessing an increased demand for intelligent, scalable and cost-effective global asset tracking solutions. This demand is accelerated by the urgency to improve end-to-end supply chain performance, visibility and customer services. Long range, low power and easy-to-deploy IoT geolocation solutions connected to the Cloud enable ultra-low power asset management platforms to automatically locate, track and monitor physical assset.
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DRAM module shipments to grow 7% |
8/31/2022 |
Overall 2021 sales in the global DRAM module market reached $18.1 billion, with an annual growth rate of approximately 7%, according to TrendForce. Due to different business strategies employed by each module house, revenue distribution among module houses varied.
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In "AI" what's talked about less are the technologies |
8/31/2022 |
As the world continues to become more data-rich, and as infrastructure and services become more data-driven, storing and moving data is rapidly growing in importance. Behind the scenes, advancements in memory technologies like DDR and HBM, and new interconnect technologies like Compute Express Link (CXL), are paving the way for broader uses of AI in future computing systems by making it easier to use.
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