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STMicroelectronics' latest PFC boost converters integrate 800V startup circuitry 10/19/2022
The built-in high-voltage startup capability saves auxiliary circuitry, allowing a “no aux” design that reduces bill-of-materials costs and ensures reliable starting. These circuits also include internal logic to safely discharge input-filter X capacitors when the AC line is disconnected.
Advanced Semiconductor Packaging Technologies in Data Centers is key to cutting edge computing 10/19/2022
Advancement comes at a price—both development and production costs have risen to the point that the industry is seeking an alternate solution to manage costs while continuing to deliver advanced products.
Japanese banks to delay sale of Toshiba 10/18/2022
Some global banks have turned cautious over backing large buyouts like Toshiba amid rising borrowing costs in the US and elsewhere.
Microamp Solutions selects Keysight Open Radio Architect for mmWave radio units in private 5G networks 10/18/2022
Microamp selected KORA solutions to verify compliance with O-RAN specifications and ensure interoperability between the company’s plug-and-play O-RAN radio unit (O-RU) and other network elements. KORA offers end-to-end system testing,
NanoBridge has patented its core technology – the NanoBridge FPGA (NB-FPGA) 10/18/2022
“One of the biggest features of NB-FPGAs is the ability to retain array configurations, even without power,” explained NanoBridge CEO Tadahiko Sugibayashi.
VinFast and Infineon setting up a joint application competence center focusing on electromobility 10/18/2022
The creation of the VinFast–Infineon Competence Center (VICC) signals a new level in the relationship between both companies, who will jointly engage in the early development phase of VinFast’s next-generation smart mobility solutions and will also discuss future semiconductor requirements to achieve supply chain stability.
300mm capacity to grow 10% CAGR from 2022 to 2025 10/17/2022
Strong demand for automotive semiconductors and new government funding and incentive programs in multiple regions are driving much of the growth.
Infineon Technologies offers AC-DC controller ICs with single-stage PWM controller for flyback topologies 10/17/2022
The IC is tailored for battery charger applications offering scalable power designs of up to 130W – when optimized using CoolMOS P7 Superjunction (SJ) MOSFETs. It is also suitable for adapter, printer, PC, TV, monitor, set-top box, and audio amplifier applications.
Analog Devices Inc. and Keysight are collaborated to advance the adoption of phased array technology 10/17/2022
This technology is key to realizing ubiquitous connectivity and sensing by simplifying development stages associated with creating satellite communication, radar, and phased array systems.
TSMC reduced expansion budget 10/17/2022
TSMC) is cutting its 2022 capacity expansion budget to $36 billion from the original $40 billion announced in July, as outlook for demand from smartphone and other consumer electronics makers dims.
Stellantis has inaugurated a new software center in Bengaluru 10/14/2022
Stellantis will focus on the development of software and technological innovations crucial to the advancement of automobiles and mobility.
FCC plans to ban all sales of new Huawei and ZTE telecommunications devices in the U.S. 10/14/2022
e move, which marks the first time the FCC has banned electronics equipment on national security grounds, closes a vise on the two Chinese companies that began tightening during the Trump administration.
STMicroelectronics to build SiC substrate manufacturing facility in Italy 10/14/2022
Production is expected to start in 2023, enabling a balanced supply of SiC substrate between internal and merchant supply.
Electronics and Semiconductor Technologies to host virtual EAC 2022 10/14/2022
This year’s event, to be held from October 18–20, will focus on industries and applications including IoT, wireless technologies, automotive electronics, and the supply chain.
Japanese private equity fund, Japan Industrial Partners (JIP) joins bid on Toshiba 10/13/2022
JIP is reported to have asked over ten Japanese companies, including Chubu Electric, Orix Corp, Nippon Life Insurance Co, Toray Industries and Central Japan Railway Co to participate in a consortium.
Analog Devices offers Multiprotocol Industrial Ethernet Switch Platform 10/13/2022
Analog Devices Inc.’s ADIN2299 multiprotocol industrial ethernet switch platform addresses the connectivity needs of industrial and process automation, motion control, transportation, and energy automation.
EPC GaN ICs Simplifies and Shrinks Motor Drive Design 10/13/2022
The EPC9176 operates from an input supply voltage between 20V and 80V and can deliver up to 28Apk (20ARMS). This voltage range and power level makes the solution ideal for a variety of 3-Phase BLDC motor drive applications with 36V–80V input including eBikes, eScooters, power tools, drones, robots, DC servo, medical robots and factory automation.
Automakers Need to Reimagine Decades-Old Industry to Meet Modern Challenges 10/13/2022
By the end of this decade, the IEA projects that more than 300 million electric vehicles will be on the road and account for 60% of new vehicle purchases – up from 4.6% of new car sales today.
U.S. made exceptions to allow Korean memory companies to continue production in China 10/12/2022
The Commerce Department, which plans to release new curbs on exports of technology to China this week, will likely deny requests by U.S. suppliers to send equipment to Chinese firms like Yangtze Memory Technologies Co Ltd (YMTC) and ChangXin Memory Technologies, Inc (CXMT) if they are making advanced DRAM or flash memory chips,
IQE collaborates with SK siltron to development compound semiconductor products. 10/12/2022
IQE and SK siltron said that their focus will be on developing and delivering innovative epiwafers based upon Gallium Nitride (GaN) on Silicon Carbide (SiC) for radio frequency applications in the wireless communications market and GaN on Silicon (Si) for power electronics applications across a range of markets.
Soitec SmartSiC Wafers to Accelerate Adoption of SiC in EVs 10/12/2022
The demand for silicon carbide substrates has experienced massive growth, and SOI wafer supplier Soitec has developed SmartSiC technology to accelerate the adoption of SiC in electric vehicles.
10 major trends for 2023 10/12/2022
Market research firm TrendForce has detailed 10 major trends that are expected to take place across various segments in the tech industry in 2023.
Declines continued for the traditional PC market 10/11/2022
Cooling demand and uneven supply have contributed to a year-over-year contraction of 15%. However, shipment volumes remain well above pre-pandemic levels when PC volumes were largely driven by commercial refreshes due to the looming end of support for Windows 7.
Samsung Foundry has certified 8nm RFIC design reference flow for use with sub-6GHz to mmWave applications 10/11/2022
The flow’s advanced design methodology and unique features deliver added productivity, comprehensive electrical analysis and faster design closure to help customers implement high-quality RFIC designs with the first pass. The new flow helps joint Cadence and Samsung Foundry customers meet the growing global demand for 5G client devices, including smartphones and communications infrastructure equipment such as cellular base stations.
INDIEV Foxconn join force to develop the first INDI One prototype vehicle 10/11/2022
Partnering with Foxconn, the world’s leader in consumer electronics, during this exciting time in their entry into electric vehicles means that INDI One drivers will lead the way into the future of personal transit,” said INDIEV founder and CEO Shi Hai.
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