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New Technology to help Face Supply Chain Challenges 3/3/2023 Advanced digital technologies will play key roles in helping electronics and semiconductor companies mitigate the risks and vulnerabilities associated with their supply chains. Intel has now released version 1.0 of the Intel Quantum Software Development Kit (SDK) 3/2/2023 The SDK is a full quantum computer in simulation that can interface with Intel’s quantum hardware, including the Horse Ridge II control chip and Intel’s quantum spin qubit chip when it becomes available this year. Sapeon, a chip startup, aim to challenge Nvidia 3/2/2023 Ryu said that Sapeon is targeting the U.S. market which would pit it against Nvidia. When asked if Sapeon can challenge Nvidia, Ryu answered “yes.” EPC's eGaN IC-based reference design address new USB PD 3.1 stringent demands for multiport chargers 3/2/2023 EPC9177 is a digitally-controlled, single-output synchronous buck converter reference design board operating at 720kHz switching frequency converting an input voltage of 48V, 36V, 28V to a regulated 12V output voltage and delivering up to 20A continuous output current. Global smartwatch market shipments grew by 12% year-on-year (YoY) in 2022 3/2/2023 But the shipments fell by 2% YoY in the fourth quarter (Q4 2022) amid inflationary pressures and slow India growth. This was the market’s first negative growth in eight quarters since the pandemic hit the world in 2020. Tokyo Electron Ltd see the amount of data the world must deal with will grow tenfold by 2030 3/1/2023 Toshiki Kawai said long-term trends like autonomous driving and metaverse development will supercharge demand for data storage and processing capabilities. Critical Manufacturing Expands Manufacturing in Malaysia 3/1/2023 Critical Manufacturing provides solutions for the future-ready smart factory with its highly sophisticated, fully integrated, modular MES featuring strong data management and analytical capabilities. NXP application processor to use in-house developed AI accelerator IP 3/1/2023 The i.MX 95 series is developed for AI-enabled applications in automotive, industrial and IoT markets, with safety features for ISO 26262 ASIL-B and IEC 61508 SIL-2 functional safety standards, including a secure island. STMicro achieves first commercial tapeout with Synopsys cloud-based AI tool 3/1/2023 The company’s DSO was released in 2020, with its first commercial tapeout in August 2021. The tool uses reinforcement learning to tackle physical layout optimization—that is, all the physical aspects of chip design. Second-Gen Starlink Satellites Have 4 Times More Capacity 2/28/2023 “This means Starlink can provide more bandwidth with increased reliability and connect millions of more people around the world with high-speed internet,” Qualcomm Pushes to Put 5G in Cars With Second-Gen Snapdragon Auto System 2/28/2023 Qualcomm says its new Snapdragon Auto 5G Modem-RF Gen 2 module will help bring media streaming, cloud gaming, and other connected services to cars. Samsung develops tiny new substrate for connected cars 2/28/2023 Samsung Electro-Mechanics has developed an automotive semiconductor package substrate tailored to driving assistance systems, in a move that extends the usable range of chip products for cars. Repairable Mobi phone design 2/28/2023 ust ahead of Mobile World Congress, HMD Global has announced a trio of Nokia phones, including the first one it built specifically with repairability in mind. The company has teamed up with iFixit to offer official repair guides and parts to help people fix issues such as a busted display, kaput battery or wonky charging port on the G22. European Commission have banned staff from using TikTok on government-issued devices 2/27/2023 Citing growing concerns about the Chinese-owned video sharing app, the policy-making institutions told a combined workforce of about 35,100 workers this week to remove TikTok from official handsets, as well as personal phones with access to EU Council services. NTT's prototype chip could boost internet speeds to 2 terabytes per second 2/27/2023 The company said its extremely compact new baseband amplifier integrated circuit module boasts an ultra-broadband performance of 100 gigahertz and is designed to be used with future all-photonics network technologies, Infineon Technologies introduced a design tool that can handle power factor correction for LED drivers 2/27/2023 The PFC plus LCC topology is said to be 5 to 6 percent more efficient than other commonly used two-stage topologies, but the design of LED drivers with this topology is highly time-consuming. Infineon’s new LCC tool, which is said to be a first in the market. Intel's Green-PC is 90% recyclable 2/27/2023 Intel announced the development of a "Green PC," featuring about 90% recyclable components. The chipmaker collaborated with Acer and Tsinghua Tongfang to design and produce the PC. AMD's Xilinx division launched new adaptive radio computing chips for the 5G telecom market 2/24/2023 AMD has also created a new Telco Solutions Testing Lab with VIAVI, enabling telco operators and telco solution providers to test scale computing resources to deliver on the increasing demands from RAN and edge-to-core computing. Nvidia stock rises after upbeat driven by A.I. chips 2/24/2023 Nvidia stock rose more than 8% in extended trading Wednesday after the company reported slightly higher revenue and net income for its fiscal fourth quarter than Wall Street expected, despite a year-over-year decrease in both categories. Gridspertise and STMicroelectronics sign MOU to expand on smart Meter technologiy 2/24/2023 The two companies’ collaboration started in the early 2000’s with one of Gridspertise’s shareholders Enel; today more than 65 million Gridspertise smart meters deployed in Spain, Eastern Europe, and Latin America leverage the power-line communication (PLC) technologies provided by ST. Keysight and SUTD Ink MoU on Open RAN, 6G Technology Collaboration 2/24/2023 Keysight and SUTD will conduct research in the areas of O-RAN security, sustainability, and standards, and 6G technologies. Server memory products are likely to overtake mobile memory in share of the overall DRAM bit output 2/23/2023 DRAM suppliers will instead keep growing the share of server memory in their portfolio, to the point where it will make up about 37.6 percent of the bit output this year, compared with about 36.8 percent for mobile DRAM. Ambarella Selects Samsung’s 5nm Technology for Automotive AI Controller 2/23/2023 This collaboration will help transform the next generation of autonomous driving vehicle safety systems by bringing new levels of AI processing performance, power and reliability. Chipletz selected Siemens packaging technologies for the design of their unique Smart advanced packages 2/23/2023 The company’s Smart Substrate products facilitate multiple ICs in a single package for critical AI workloads, immersive consumer experiences, and high-performance computing. Wireless SoC enhance IoT device designs 2/23/2023 These devices are comprised of a number of key components, including the processors, radios, power management, memory, interfaces and peripherals.  92  |  93  |  94  |  95  |  96  |  97  |  98  |  99  |  100  |  101

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