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Toshiba name two activist to board 6/29/2022
Toshiba has appointed two directors from activist hedge funds to its board possibly paving the way to a sale of the company to private equity.
Analog Devices offers high resolution 3D depth sensor module 6/29/2022
Analog Devices Inc. has launched the industry’s first high-resolution, industrial quality, indirect Time-of-Flight (iToF) module for 3D depth sensing and vision systems. Enabling cameras and sensors to perceive 3D space in one megapixel resolution.
Automated testing remains a challenge 6/29/2022
Survey found that only 11% of the respondents have a fully automated strategy. With growing complexity, the number of tests is increasing (77%) and without automation, product development slows.
TSMC launch clean room facility in Japan 6/28/2022
TSMC, the world's largest contract chipmaker, said the clean room at its Japanese subsidiary -- the TSMC Japan 3DIC R&D Center -- is located in the Tsukuba Center of the National Institute of Advanced Industrial Science and Technology (AIST).
2022 concentrates on 300mm wafer expansion 6/28/2022
Global wafer foundry capacity is forecast to increase by approximately 14% annually in 2022, according to TrendForce.
TF-AMD to build additional manufacturing facility in Penang 6/28/2022
The new manufacturing facility is expected to create more than 3,000 new jobs in advanced semiconductor engineering, design, and process technologies for high-performance computing solutions.
ITRI collaborates with industry and academic partners on advancements in magnetic memory technology 6/28/2022
it is to develop magnetic memory technology that can perform across a wide operating temperature range of nearly 400°C. Both developments are pivotal for industries to move towards next-generation memory technology.
China's Yangtze Memory Technologies plans to bring online a second plant 6/24/2022
The Chinese memory chip producer Yangtze Memory Technologies plans to bring online a second plant in its home city of Wuhan as early as the end of this year, sources familiar with the matter say, in a move that could further close the company's technology and output gap with global leaders like Samsung of South Korea and Micron Technology of the U.S.
imec discloses Direct-digitization Readout Design to Enables Small, Low-noise, Low-power Neural Interfaces 6/24/2022
The chip is based on a novel AC-coupled first order delta-delta-sigma (?-?S) architecture that enables the conversion to the digital domain very close to the weak analog signal source.
GlobalFoundries’ celebrates the arrival f first tool to equip its new Singapore fab 6/24/2022
It brings GF closer to increasing manufacturing capacity at its Singapore site and fulfilling additional global demand for GF-made chips used in automobiles, smartphones, wireless connectivity, Internet of Things (IoT) devices, and other applications.
SiC is not only for the automotive industry 6/24/2022
Despite SiC's wide use in the automotive industry, the technology is primed for use in other industries, including aerospace and power supply.Despite SiC's wide use in the automotive industry, the technology is primed for use in other industries, including aerospace and power supply.
NOR unit shipments increased 33% last year while the ASP jumped 23% 6/23/2022
Three companies accounted for 91% of NOR flash memory sales in 2021. Winbond was the largest NOR flash supplier with sales that topped $1.0 billion, which amounted to 35% of NOR marketshare.
Samsung to start mass production of 3-nanometer semiconductors 6/23/2022
The next-generation 3nm chips will be built on the Gate-All-Around (GAA) technology, which Samsung said will allow up to 45 percent area reduction while providing 30 percent higher performance and 50 percent lower power consumption, compared with the existing FinFET process.
Brewer Science to make keynote on EUV at the China Semiconductor Technology International Conference 6/23/2022
One of the biggest challenges facing EUV lithography is material requirements, recognizing the critical role underlayers play in the patterning of EUV lithography. Unlike bottom anti-reflective coatings (BARC), thickness is not limited by wavelength, but rather related to resist and process requirements.
TSMC offer options for its 3nm processes 6/23/2022
TSMC's 3nm technology, starting production later in 2022, will feature the company's FinFlex architecture offering choices of standard cells with a 3-2 fin configuration for performance, a 2-1 fin configuration for power efficiency and transistor density, or 2-2 fin configuration for efficient performance.
DRAM pricing forecast to drop around three to eight percent across markets 6/22/2022
TrendForce said Monday that DRAM pricing for commercial buyers is forecast to drop around three to eight percent across those markets in the third quarter compared to the previous three months. Even prices for DDR5 modules in the PC market could drop as much as five percent from July to September.
Foundry Output Value Up 8% in 1Q22 6/22/2022
Although demand for consumer electronics remains weak, structural growth demand in the semiconductor industry including for servers, high-performance computing, automotive, and industrial equipment has not flagged, becoming a key driver for medium and long term foundry growth.
Synopsys offers RF Design Flow for TSMC N6RF Process 6/22/2022
Synopsys Inc. has launched a new RF design flow developed with Ansys and Keysight for the TSMC N6RF process, the most advanced RF CMOS technology that offers significant performance and power efficiency boosts.
Micron Readies LPDDR5 DRAM for Level 5 Autonomy 6/22/2022
Today, Micron announced that its LPDDR5 memory is now Automotive Safety Integrity Level (ASIL) D certified, under ISO 26262, which is considered one of the most stringent safety integrity levels for automotive safety.
The commercialization of Graphene has been spotty so far 6/21/2022
There is a lot of potential for graphene in solar cells, and it is an area where many of its properties can be utilized to favorable effect. Over the last few years, there have been several commercial offerings hitting the market, with the latest one this year targeting the marine sector.
Global server market’s revenue to grow 17% year-on-year (YoY) in 2022 6/21/2022
The global server market’s revenue will grow by 17% year-on-year (YoY) in 2022 to reach $111.7 billion, according to Counterpoint Technology Market Research’s Global Server Sales Tracker.
Test innovation AEM to expand its operations in Singapore and Malaysia 6/21/2022
Apart from its new sites in Penang and the US, AEM will also expand its R&D centers in both countries as well as in Singapore, with the new facilities scheduled to start operating by the end of the third quarter (Q3 2022).
Soitec to build extension to its 300-mm SOI wafer fab in Pasir Ris, Singapore 6/21/2022
The ambition is to double the capacity to meet the strong and continuous demand for semiconductors.
TSMC sets 2nm goal on 2025 6/20/2022
The 2nm process will be 10-15 percent faster at the same power or save 25-30 percent power at the same speed compared to its 3nm process.
Applied Materials has bought Picosun 6/20/2022
Applied Materials has bought Picosun, a privately held semiconductor equipment company based in Espoo, Finland, which specialises in atomic layer deposition (ALD) technology, primarily for specialty semiconductors.
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