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An outline of NVMe 2.0 specifications and new features 7/2/2021
While maintaining backward compatibility with previous generations, NVMe 2.0 allows for faster and simpler development in what has become an increasingly diverse device environment that has expanded to include hard disk drives (HDDs). NVM Express president Amber Huffman said rearchitecting NVMe is all about meeting the evolving demands of the future of storage.
Analysts predict strong profit at Samsung 7/2/2021
The South Korean tech giant was projected to log 11.2 trillion-won (US$9.9) billion in operating profit for the April-June period, up 37.6 percent from a year earlier, while its sales were estimated to increase 15.8 percent on-year to 61.3 trillion won over the period.
Texas Instruments Inc.to acquire Micron Utah fab 7/2/2021
The factory, in Lehi, Utah, will be the fourth 300-millimeter wafer facility for the semiconductor company. It will also be used for 65-nanometer and 45-nm production for analog and embedded processing products.
SK hynix Inc. created an integrated DRAM database, called DAM 7/2/2021
It is to store and share information from design to quality control on volatile memory chips used to power from computers to digital electronics.
Micron said it is doing great on memory business 7/1/2021
Micron Technology Inc. expects memory-chip demand to remain high even as the supply of other types of computer chips meets customer needs, the company said late Wednesday as its earnings and an outlook surpassed Wall Street expectations.
Intel has delayed production of its next-generation Xeon CPUs, code-named Sapphire Rapids, 7/1/2021
Intel is delaying Sapphire Rapids, the 10-nanometer successor to the recently launched Ice Lake server processors, because of extra time needed to validate the CPU.
Disco Corp., an eight years old Japanese company, to redefine thickness of semiconductor wafers 7/1/2021
Disco Corp.’s machines can grind a silicon wafer down to a near-transparent thinness and cut the tip of a hair into 35 sections. That knowhow will allow chipmakers to stack integrated circuits on top of each other in a process called 3D packaging, promising smaller chip footprints, reduced power consumption and higher bandwidth between various parts.
Compound semiconductors to reach a national strategic level in importance 7/1/2021
They will be badly needed to power many critical technological applications including low-orbit satellites, 5G communications, green energy, smart power grids, EVs and high-voltage components.
Samsung Foundry successfully taped out SOC for Synopsys with yield 7/1/2021
This tapeout is the culmination of an extensive collaboration between Synopsys and Samsung Foundry to accelerate the delivery of a highly optimized reference methodology that realizes the maximum power and performance opportunities inherent to the latest 3D transistor architecture.
IC Insight predicts IC market to hit $500 billion in 2021 6/30/2021
IC market this year is projected to lift sales for the total IC market by 24% and break through the $500 billion plateau for the first time in history.
NXP offers 5G multichip module based on Gallium Nitride (GaN) technology 6/30/2021
By using GaN in multi-chip modules it is possible to significantly reduce energy consumption and NXP has said that it has been able to increase lineup efficiency to 52% at 2.6 GHz - 8 percentage points higher than the company’s previous module generation.
Universities across mainland China are putting emphasis on chip technologies 6/30/2021
The new Shenzhen Technology University school will enrol 60 students this fall, training them to become highly skilled talent for IC design and manufacturing,
DRAM revenue surged by 30% 6/30/2021
Distance education and work from home (WFH) continued propelling a substantial demand for smartphone and laptop DRAM, resulting in a 6% growth in bit shipment and a 3% rise in ASP over the previous quarter.
Taiwan component product makes up 18.5% of latest iPad Pro cost base 6/29/2021
Breakdown does not include the M1 chip, which is categorized as an American component, even though it is made by Taiwan Semiconductor Manufacturing Co. Ltd (TSMC).
Qualcomm shows Snapdragon 888 Plus 5G Mobile platform 6/29/2021
The Snapdragon 888 Plus 5G Mobile platform is a follow-on to the Snapdragon 888, and it will serve as the brains of smartphones coming in the second half of the year from customers including Asus, Honor, Motorola, Vivo, and Xiaomi.
Renault teams with STMicroelectronics on EV 6/29/2021
Both companies said that they will work together with the objective of improving the power performance of Renault’s Group’s applications for electric and hybrid vehicles, based on ST’s wide bandgap semiconductor technologies and products.
Industry is generally OK with the Nvidia/ARM take over 6/29/2021
Broadcom Corp., MediaTek Inc. and Marvell Technology Group Ltd. are the first customers of the Cambridge, U.K.-based Arm to publicly support the takeover, which has raised concerns on national security grounds.
29 fabs are coming online to plug IC shortage 6/28/2021
19 fabs along with another ten expected to be built in 2022 respond to insatiable demand for semiconductors, fueling an equally vibrant chip equipment sector expected to surpass $140 billion over the next several years, according to a SEMI forecast.
Nexperia has enabled its new 8-inch wafer line in Manchester, UK 6/28/2021
The new production line will expand Nexperia’s capacity with immediate effect, and the new PSMN3R9-100YSF (100 V) and PSMN3R5-80YSF (80 V) devices will feature the industry’s lowest Qrr Figure of Merit (RDS(on) x Qrr).
Brazil' government approved SK hynix Inc.'s deal to acquire Intel Corp.'s NAND business 6/28/2021
Last October, SK hynix, South Korea's No. 2 chipmaker, signed a deal to buy Intel's non-volatile business for US$9 billion, which includes the U.S. firm's solid state drive business and a NAND flash chip plant in Dalian, China. Following the deal, the South Korean firm had to obtain approval from antitrust regulators in major countries.
Toshiba Corporation, votes out its short-running board chairman 6/28/2021
Toshiba former chairman Osamu Nagayama was under fire for his extra-curricular activities with the government -- the Toshiba government collusion.
Memory manufacturers seen unexpected seasonal gain 6/25/2021
Market forecaster Omdia reported this week that semiconductor revenues rose a modest but unexpected 0.5 percent over the previous quarter during the three months ending March 31. The gains mark only the third time chip makers have logged first quarter revenue growth since 2002.
Siemens confident on delivery admit shortage 6/25/2021
“We believe we can secure supplies and will be able to deliver,”
Kioxia, formerly known as Toshiba Memory, plans an initial September IPO 6/25/2021
The Tokyo bourse is expected to give its approval in July, the report said, citing sources.
Foxconn gets deeper into semiconductor 6/25/2021
Foxconn (Hon Hai) Technology Group has recently acquired a 5.03% stake or 120 million shares in Malaysia-based Dagang NeXchange (DNeX) for around NT$720 million (US$25.78 million) from existing DNeX shareholders, which will help further deepen its deployments in the semiconductor and electric vehicle (EV) sectors.
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