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TSMC Japan could be in production 2023 7/23/2021 The Japanese fab is expected to use TSMC’s 28 nm process and will have a production capacity of 40,000 wafers per month. Industy urge congress to pass the chip bill 7/23/2021 “The need is urgent and now is the time to act. We look forward to working with you on this national priority.” Winbond has delivered a complete NAND flash memory solution for automotive, mobile and IoT SoCs 7/22/2021 The solution enables faster adoption of octal non-volatile memories (NVM) with high-speed read bandwidth in densities up to 4Gb. Infineon takes number one spot on automobile chip supplies 7/22/2021 Infineon Technologies AG displaced NXP Semiconductors from the number one spot as the leading supplier of automotive semiconductors. GlobalFoundries declares that they are for IPO instead of being acquired by Intel 7/22/2021 Caulfield reaffirmed the company’s plan for an initial public offering next year, but he declined to say whether recent reports about takeover interest from Intel were true. Ferrari hires new CEO to expand EV business 7/22/2021 Ferrari announced its new chief executive officer (CEO) as Benedetto Vigna, who is currently president of STMicroelectronics’ analog MEMS and sensors group. Realtek has licensed Imagination Technologies' latest digital TV chip 7/21/2021 BXE-4-32 was selected, said Imagination, for area efficiency while processing four pixels per clock, plus its multi-core capability and cache configurability. Infineon offers radiation hardened NOR for Xilinx FPGA 7/21/2021 Both the 256 Mb and 512 Mb RadTol NOR Flash non-volatile memories are a low-pin count, single-chip solution for applications such as FPGA configuration, image storage, microcontroller data and boot code storage. SK Hynix set goal to be carbon free by 2050 7/21/2021 SK Innovation Co. will be sourced entirely by renewable by 2030 and become carbon-zero by 2050, according to its roadmap. Samsung is scouting Arizona for new fab site 7/21/2021 The South Korean company stated it is evaluating sites in Arizona, New York and Texas, where an existing fabrication plant is located. TSMC to develop new expansion at Hsinchu Science Park 7/20/2021 TSMC, the world's largest contract chipmaker, announced plans in 2019 to develop the 89.84-hectare property, which is located in Hsinchu's Baoshan Township on the southern end of the science park. Memory module houses and channel distributors are less optimistic on outlook for China 7/20/2021 DRAM and NAND flash contract prices are set to continue their rally but at a slower pace in the third quarter, coupled with continued correction in spot market prices. EDA and semiconductor IP revenue soared 7/20/2021 EDA and semiconductor IP revenue soared to a new high, up 17% worldwide in Q1 compared to the same period in 2020, with revenue in China surging 73%. Morris Chang said that building local semiconductor fabs does not solve global supply chain problem 7/20/2021 "What may happen is that, after hundreds of billions and many years have been spent, the result will still be a not-quite-self-sufficient, and high-cost, supply chain." TSMC evaluating to build a new feb in Japan 7/19/2021 The company has established a 3D IC research center in Japan, where it has gathered more than 20 Japanese partners, TSMC said at its latest announcement of quarterly results. TSMC will be in charge of the center’s technology development for advanced packaging. SK hynix to post Q2 sales of $8.6 billion 7/19/2021 SK hynix was estimated to log 9.92 trillion won (US$8.6 billion) in sales in the April-June period, up 15.3 percent from a year earlier, while its operating profit was projected to reach 2.76 trillion won, up 41.8 percent from a year ago. PCB manufacturing material in short supply 7/19/2021 PCB manufacturers continue to see their supply constrained by the ongoing shortage of related upstream materials, such as copper foils and epoxy resin. Samsung won $13.3 million grant for R&D 7/19/2021 Samsung Electronics Co. won ($13.3 million) in grant funding to 12 research and development projects in six emerging fields this year. Those fields for Samsung’s research support are advanced artificial intelligence, next-generation encryption system, network communication beyond 5G and 6G, future display, and semiconductor device and process. SK Siltron to invest $300 million in Bay County, Michigan 7/16/2021 The new factory will more than double its employee base. Over the next three years, SK Siltron says its investment will provide manufacturing and R&D capabilities of advanced materials for electric vehicles. COVID-19 outbreak to affect HDD shipment from Thailand 7/16/2021 With Seagate and Western Digital (WD) now mainly producing HDDs in Thailand, their supply in the second half may be seriously impacted by the pandemic. Samsung to supply Exynos Auto chip to Volkswagen 7/16/2021 Samsung Electronics’ Samsung System LSI business has been supplying its latest system chip Exynos Auto for Volkswagen models for in-vehicle information and entertainment systems since early this year. Exynos Auto is Samsung Electronics’ standalone System-on-Chip component and automotive infotainment application. Semiconductor equipment market to reach US$100 billion next year 7/16/2021 That would represent annual growth of 4.93 percent from US$95.3 billion estimated this year after 34 percent year-on-year expansion, the global semiconductor trade association said in a report. TE Connectivity to acquire the ERNI Group for factory automation in the automotive sector 7/15/2021 The acquisition of ERNI is seen as complementing TE’s broad connectivity product portfolio, particularly in high-speed and fine-pitch connectors for factory automation, automotive, medical and other industrial applications. ASP on DRAM continue to rise 7/15/2021 Looking ahead to 4Q21, TrendForce believes that DRAM supply will continue to rise, thereby leading to either a further narrowing of price hikes or pressure constraining the potential price hike of DRAM products. 40% of global wafer capacity is in Korea and Taiwan 7/15/2021 As of December 2020, Taiwan led the world with 21.4% of global wafer capacity installed in that country. In second place was South Korea, which accounted for 20.4% of global wafer capacity.  140  |  141  |  142  |  143  |  144  |  145  |  146  |  147  |  148  |  149

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