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| Cadence expanda its collaboration with TSMC |
6/1/2021 |
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Cadence Design Systems Inc. is expanding its collaboration with Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) to accelerate mobile, AI and hyperscale computing application design using the integrated Cadence digital flow and custom/analog tool suite on TSMC’s N3 and N4 process technologi
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| Marvell offers new NVMe SSD controllers to support PCIe 5.0 |
5/31/2021 |
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The new SSD controllers are the first under the umbrella of Marvell's Bravera brand, which will also encompass HDD controllers and other storage accelerator products. The Bravera SC5 family of PCIe 5.0 SSD controllers will consist of two controller models: the 8-channel MV-SS1331 and the 16-channel MV-SS1333.
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| PC market continue to grow |
5/31/2021 |
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Worldwide Quarterly Personal Computing Device Tracker, shipments of PCs are expected to grow by 18.1% in 2021 with shipments of just over 357 million units. While IDC still expects PC growth to drop slightly in 2022 (-2.9%), the overall five-year compound annual growth rate (CAGR) remains positive at 3%.
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| Panasonic offers Bluetooth 5 Low Energy consumption module |
5/28/2021 |
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Bluetooth 5 features a higher symbol rate of 2 Mbps using the high speed LE 2M PHY or a significantly longer range using the LE coded PHY at 500 kb/s or 125 kb/s. The new channel selection algorithm (CSA#2) also helps to improve the module's performance in high interference environments. Furthermore, the new Low Energy advertising extensions allow for much larger amounts of data to be broadcasted in connectionless scenarios.
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| Oversupply of NAND flash start to settle down |
5/28/2021 |
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The NAND flash market will be undersupplied in the second quarter, with prices for mainstream parts being driven up, TrendForce noted. The worsening shortage of NAND flash device controllers has had a further negative impact on the available storage devices.
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| ARM is watching out spending as closing with Nvidia draws near |
5/28/2021 |
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Nvidia has frozen hiring including a ban on backfilling jobs left vacant by departures, has put a stop on new engagements of contractors and has cancelled its FlexPlot scheme which gave US employees $8,500 a year and UK employees $4,500 to spend on certain defined areas.
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| Arm offers latest CPU and GPU designs with its new Armv9 architecture |
5/27/2021 |
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Arm’s designs — and particularly, its big.LITTLE configuration of combining powerful high-performance cores and battery-saving high-efficiency cores — are common to virtually every Android phone. That means the designs introduced here are effectively a preview of what the best Android phones of 2022 will look like.
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| 200mm fab equipment spending to reach $4 billions |
5/27/2021 |
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"Wafer manufacturers will add 22 new 200mm fabs to help meet growing demand for 5G, automotive and Internet of Things (IoT) devices that rely on analog, power management and display driver integrated circuits (ICs), MOSFETs, microcontroller units (MCUs) and sensors,"
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| Intel regained top chip vendor title in Q1 |
5/27/2021 |
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In total, the top-15 semiconductor companies’ sales surged by 21% in 1Q21 compared to 1Q20, three points greater than the total worldwide semiconductor industry 1Q21/1Q20 increase of 18%.
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| Analyzing magnetic fields in digital domain |
5/26/2021 |
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When magnetic matter creates signals, analyzing them with digital receiver systems (DRS) lets scientists study the magnetic fields. Analyzing the properties of the signals, for example, how they vary with time, scientists can measure the fields and study their small fluctuations.
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| HiSilicon offers RISC-V development board without an ARM processor |
5/26/2021 |
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The release is significant as it is the result of the US trade blockade that delivered a dramatic blow to Chinese manufacturers such as Huawei. Thanks to the trade war between the countries, Huawei’s HiSilicon subsidiary lost access to its semiconductor manufacturing, which centered around Arm.
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| Samsung's new processing-in-memory architecture places AI computing capabilities inside HBM |
5/25/2021 |
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First presented at the International Solid-State Circuits Virtual Conference (ISSCC) earlier this year, Samsung’s new processing-in-memory (PIM) architecture places AI computing capabilities inside an HBM. This is a different approach from the commonly used von Neumann architecture for computing systems, which uses separate processor and memory units to carry out millions of intricate data processing tasks. Because the von Neumann architecture employs sequential processing that requires data to constantly move back and forth, it results in a system-slowing bottleneck especially when handling ever-increasing volumes of data found in large-scale processing in data centers, high performance computing (HPC) systems, and AI-enabled mobile applications.
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| Chinese are making move to control Newport Wafer Fab |
5/25/2021 |
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Nexperia, the NXP standard products unit which, in 2016, was sold to Chinese financial companies – Jianguang Asset Management and Wise Road Capital – has appointed two directors to the Newport Wafer Fab board after a contract dispute.
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| EU approved SK hynix to acquire Intel Corp's NAND business |
5/25/2021 |
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Last October, SK hynix signed a deal to buy Intel's NAND business for US$9 billion, which includes the U.S. firm's solid state drive business and a NAND flash chip plant in Dalian, China. Following the deal, the South Korean firm had to obtain approval from antitrust regulators in major countries.
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| TSMC boosted auto chip production by 60% in a year |
5/24/2021 |
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TSMC, the world’s largest contract chipmaker, said it had taken “unprecedented actions” to help automakers. That includes reallocating capacity to other industries that are also experiencing “stressfully high demand due to the acceleration of digital transformation”.
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