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| Intel CFO predicts CPU shortage starting at Q3 |
7/27/2021 |
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In fact, Intel’s chief financial officer, George Davis, has said there will be ‘acute’ supply problems in Q3 (from now through to September), following CEO Pat Gelsinger’s recent observation that the global chip shortage is likely to continue for one or two years, so perhaps until 2023.
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| Tsinghua Unigroup advertised for bail out partners |
7/27/2021 |
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It says: “The strategic investors should have operational capability and managerial experience in semiconductor and cloud businesses. They must be able to promote the development of our core businesses.”
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| Magna acquisition of Veoneer makes sense for the auto industry |
7/27/2021 |
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The rationale behind the deal seems obvious: Magna seeks ownership of technology that Veoneer calls “Collaborative Driving.” While everyone else was focused on self-driving, Veoneer quietly built a technology stack in partnership with Qualcomm.
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| Qualcomm and Foxconn launched the Gloria AI Edge Box |
7/27/2021 |
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“We anticipate broad areas of adoption of Foxconn Industrial Internet’s Gloria platform using our leading performance per watt AI solution, the Qualcomm Cloud AI 100. We expect customer adoption of Gloria to include a variety of environments such as retail centers, warehouses, datacenters, and factories.”
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| Emerging memory to occupy significant market |
7/26/2021 |
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Emerging memory types could become a $44 billion market by 2031 displacing NOR flash, SRAM and DRAM, forecasts a report from Coughlin Associates and Objective Analysis.
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| Fuel cost and pollution driven India towards EV |
7/26/2021 |
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The country expected to aggressively push toward electrification. Frost & Sullivan’s recent analysis, Indian Electric Vehicle Growth Opportunities, finds that mega trends such as rapid urbanization, rising fuel costs, traffic congestion, pollution, emerging economic growth, and energy security will drive EV adoption in the country in the next few years.
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| Modern NAND controller continue on their development |
7/26/2021 |
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Everyone’s used to the flash’s density-doubling every couple of years or so, but they don’t consider the fact that the controller gets increasingly complex at a similar rate,” said Jim Handy, principal analyst at Objective Analysis. This has allowed them to go from SLC, to MLC, to TLC, to QLC while getting faster, wearing better, and adding features.
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| Global PC market up 13% |
7/23/2021 |
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shipments of desktops and notebooks, including workstations, rose by 13% year on year to hit 82.3 million units, according to the latest Canalys data. Demand remains high, particularly due to a strong commercial segment, as the pandemic-driven urgency for consumers to get their hands on PCs is starting to wane.
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| TI meets quarterly estimate |
7/23/2021 |
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For the current quarter, the company sees revenue of $4.4 billion to $4.76 billion, and EPS in a range of $1.87 to $2.13 per share. That compares to consensus for $4.6 billion and $1.97 per share.
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| Infineon offers radiation hardened NOR for Xilinx FPGA |
7/21/2021 |
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Both the 256 Mb and 512 Mb RadTol NOR Flash non-volatile memories are a low-pin count, single-chip solution for applications such as FPGA configuration, image storage, microcontroller data and boot code storage.
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| EDA and semiconductor IP revenue soared |
7/20/2021 |
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EDA and semiconductor IP revenue soared to a new high, up 17% worldwide in Q1 compared to the same period in 2020, with revenue in China surging 73%.
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| TSMC evaluating to build a new feb in Japan |
7/19/2021 |
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The company has established a 3D IC research center in Japan, where it has gathered more than 20 Japanese partners, TSMC said at its latest announcement of quarterly results. TSMC will be in charge of the center’s technology development for advanced packaging.
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