|
 |
|
| Hailo offer new class of AI accelerator |
9/2/2019 |
|
Hailo-8 boasts performance of 26 TOPS with notable power efficiency of 2.8 TOPS/W. The power consumption was measured running ResNet-50 on low resolution video (224 x 224 at 672 fps) at 8-bit precision with a batch size of 1. This is an order of magnitude better than the current market-leading solution for automotive vision inference at the edge.
|
|
|
| China's Tsinghua Unigroup to build memory fab in Chongqing |
8/30/2019 |
|
Under the deal, Tsinghua Unigroup will set up a 12-inch DRAM manufacturing fab in Chongqing's Liangjiang New Area, with construction to kick off by the end of 2019 and official production set for 2021. The group will develop relevant process technology and carry out trial production at its other memory chip plans in China before transferring mature technology to the Chongqing plant after becoming operational.
|
|
|
| Homomorphic encryption now ready for commercial applications |
8/30/2019 |
|
Homomorphic encryption was first discovered in 2009, and ten years on, it is finally ready for initial commercial adoption. Up to now, while processing encrypted data was theoretically possible, it was so computationally intense that it was deemed out of reach for real-world applications. Recent advances have brought it within the realms of usability for the first time.
|
|
|
| Micron gets green light from Taiwan government to build $2 billion fab. |
8/29/2019 |
|
During the 1179th meeting of the Investment Commission of the Ministry of Economic Affairs' today, seven major investment cases were filed and approved. Among the cases approved was the equivalent of NT$66 billion in foreign currency to be remitted from Micron Technology to increase investment in Taiwan-based enterprises such as its subsidiary Micron Memory Taiwan Co., and to engage in electronic component manufacturing,
|
|
|
| Qualcomm to pair WiFi 6 chips with 5G |
8/29/2019 |
|
Both Wi-Fi 6, a new standard expected to fully roll out by 2022, and 5G technology differ from their predecessors in that they are designed to work more closely together, allowing Wi-Fi routers to more seamlessly hand off connections with mobile phones and other devices that use both kinds of networks.
|
|
|
| GlobalFoundries sued TSMC for patent infringement |
8/28/2019 |
|
The complaints alleged that chip manufacturing technologies used by TSMC infringed GlobalFoundries’ 16 patents, and sought to prevent imports of customers’ products containing chips produced with the infringing technologies.
|
|
|
| Chinese are engaging in RISC-V to replace ARM processor |
8/28/2019 |
|
Chinese electronics companies sharpened their collective focus on open-source RISC-V months ago, when President Donald Trump started placing export controls on western technology, including Arm intellectual property (IP). RISC-V is an open source technology, however, and not subject to similar restrictions; it represents a readily accessible alternative for Chinese manufacturers to control their own technological destiny.
|
|
|
| Xilinx offers 16nm Virtex UltraScale FPGA |
8/27/2019 |
|
Xilinx said the VU19P features nine million system logic cells, up to 1.5 terabits per-second of DDR4 memory bandwidth and up to 4.5 terabits per-second of transceiver bandwidth, and over 2,000 user I/Os.
|
|
|
| Digitimes Research see foundry market growth in the second half |
8/27/2019 |
|
Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics Corporation (UMC) and Vanguard International Semiconductor Corporation (VIS) together generated total revenues of US$9.13 billion in the second quarter, up 8.9% on quarter but down 2.5% on year.
|
|
|
| NIST drafted guideline for IoT security |
8/27/2019 |
|
National Institute of Standards and Technology (NIST) released draft security feature recommendations for Internet of things (IoT) device manufacturers, to ensure customers deploying IoT devices can expect a minimal baseline of features to enable security within their connected devices.
|
|
|
| CEO of HP Inc. resigned |
8/26/2019 |
|
The company said Weisler, 52, is leaving the role to attend to a family health matter. Enrique Lores, a 30-year veteran with the company and currently president of HP’s imaging, printing and solutions business, will take over the CEO position on Nov. 1.
|
|
|
| 5G application chips drive emand on ABF substrates |
8/26/2019 |
|
Taiwan-based IC substrates suppliers Unimicron and Na Ya PCB as well as Japan's Ibiden and Shinko are now the world's only four makers of high-end ABF substrates. As none of them are able to ready new capacity in the short term, their production lines have been running at full capacity to meet strong demand from clients queuing up to take delivery of shipments.
|
|
|
| Carriers and regulators joint force to fight robocalls |
8/23/2019 |
|
Under this agreement, the 12 carriers have agreed to implement call blocking technology, make better tools available to customers, and implement a new system to label incoming calls as real or spam. The agreement was reached with attorneys general from all 50 states, as well as the District of Columbia.
|
|
|
| Chinese company to roll out 5G chips on 7nm geometry |
8/23/2019 |
|
Unisoc also plans to roll out its 5G SoC chip in early 2020, the sources continued. In order to step up its 5G chip market deployments, Unisoc has recently hired a number of senior staff from Huawei's HiSilicon to enhance its product development and marketing strategy aiming to be among the leading China-based chipmakers.
|
|
|
|
