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| Q4 wafer shipment will be flat |
11/12/2019 |
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Affected by the US-China trade war, many clients have failed to honor procurement contracts inked with silicon wafer suppliers since the second quarter of 2019. Shipments of 12-inch wafers picked up slightly in the third quarter thanks to strong demand from TSMC to support its 7nm and 5nm production,
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| There is room for Phase Change Memory (PCRAM) |
11/11/2019 |
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Jim Handy, principal with Object Analysis, said the reason the technology continues to hold such promise is its really small crosspoint cell and its ability to be stacked. Intel, for example, is stacking two decks right now, he said, but recently revealed it can go up to four decks. “They intend on reducing costs by increasing the number of decks.”
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| Little Polish company has big idea on password security |
11/8/2019 |
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The name of the product is ELIotPro. It stands for Easy Lightweight Internet of Things Protection, at least the acronym is easy to say if not to type. The technology includes a lightweight encryption algorithm that solves another problem of IoT security as most encryption is to much of a memory hog to be used in small devices. It’s small size is the key to how it works.
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| Nvidia offers smallest size supercomputer board |
11/8/2019 |
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The Xavier NX board can achieve 14 to 21 TOPS INT8 performance at power budgets between 10W and 15W, respectively. This amount of processing power would enable running multiple neural networks in parallel, and processing data from multiple high-resolution image sensors simultaneously.
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| Intel now samples Stratix 10 FPGA |
11/7/2019 |
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The FPGA uses Intel’s Embedded Multi-die Interconnect Bridge (EMIB) technology. EMIB technology stitches two Stratix 10 GX FPGA core fabric die (with a capacity of 5.1 million logic elements per die) along with appropriate I/O tiles.
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| Backend manufacturers rush to add 5G testing capability |
11/7/2019 |
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Testing demand for high-end 5G mobile SoCs, RF chips, and diverse 5G base station chipsets including AAU (active antenna unit) has been mounting significantly from Huawei/HiSilicon, Qualcomm, Broadcom, Apple and MediaTek along with the arrival of 5G commercialization. This is expected to help boost capacity utilization rates at the backend partners in 2020.
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| With 50 cents SOC, Bluetooth devices are now disposable |
11/7/2019 |
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Its new DA14531 chip, which it also calls SmartBond Tiny, makes it possible to extend wireless connectivity to applications where it would have previously been prohibitive in terms of size, power or cost, especially those within the growing connected medical field. SmartBond Tiny is expected to help facilitate connectivity for inhalers, medicine dispensers, weight scales, thermometers, glucose meters and more.
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| Sony and Samsungin head-to-head competition on CMOS image sensors |
11/6/2019 |
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Sony currently accounts for over 50% of the global CIS market, buoyed by the launch of an array of 40-megapixel CIS products that have been adopted by a number of handset makers for flagship models. Sony is integrating CIS and edge AI processing technology utilizing stack architecture as it seeks to further expand its market share by exploring the applications for CIS products,
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| Wi-Fi 6 chip solutions to support sub-6-GHz 5G smartphones |
11/6/2019 |
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Qualcomm, MediaTek and Realtek Semiconductor have ramped up their orders for testing and certifying Wi-Fi 6 core chips with IC certification labs including Sporton International, and other IC designers such as RichWave are also showing testing demand for Wi-Fi 6 RF front-end modules.
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| We are entering the age of autonomous |
11/6/2019 |
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Many analysts agree—the next industrial revolution is already upon us, driven by growth in Industry 4.0 and autonomous systems. The push to more efficient use of materials and labor in this next age of industrial discovery requires that the underlying technology continue to evolve at a rapid pace
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| Sony, NTT, and Intel teams to develope 6G |
11/4/2019 |
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Fifth-generation networks are only just being switched on, but the trio wants to establish an organization for the sixth generation in the U.S. by next spring. The three partners intend to invite other major global companies to participate, including players from China.
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| Silicon Mitus has targets USB-Type market |
11/4/2019 |
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Energy consumption is one of the biggest challenges for the mobile technology sector. USB-C was supposed to be primarily a connectivity option, but it is increasingly finding favor because it is also a useful means of managing power in portable devices.
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