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| National Instruments has a new CEO |
11/4/2019 |
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Over the years, Starkloff has given many a presentation at NIWeek. He's always had a talent for dazzling the crowd when introducing new products or features to existing products. He'd describe a problem and pulling then pull the proverbial "rabbit out of the hat" trick showing how a new product could solve the problem.
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| AI startup Groq explains its no-show at AI Hardware Summit |
11/4/2019 |
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“For the AI Hardware Summit we were working on a demo but we had to divert our resources to our customer, so we weren't going to be able to demo. We had the option of going up and talking about something that we weren't going to be able to demo in that time period, or withdraw. And so we decided to withdraw.”
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| Samsung profit is 55.7% down |
11/1/2019 |
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It is a sharp 55.7% decline in operating profits from last year's record profit due to a continued downturn in the memory chip market that started late last year. Revenue for the quarter also fell 5.3% compared to last year.
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| Global SSD shipment on upswing |
10/31/2019 |
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Worldwide SSD unit shipments rose to 57.9 million units in the second quarter, up 9.7% from 52.8 million in the first.
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| Sony to build sensor fab. in Nagasaki |
10/31/2019 |
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The plant is to be built in Nagasaki Prefecture and is scheduled to come on-line in April 2021. The fab should increase Sony’s image sensor capacity from 100k 300mm wpm to 130k wpm.
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| AMD 3rd quarter revenue hits $1.8 billion |
10/31/2019 |
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AMD's third-quarter revenues were up 9% on year and 18% on quarter due to higher revenues in the Computing and Graphics segment, partially offset by lower revenues in the Enterprise, Embedded and Semi-Custom segment.
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| Google is engaged in quantum computing |
10/31/2019 |
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A new Google computing experiment published in Nature has ushered in a new era of computing. The publication is an experiment in theoretical computer science. Google scientists would demonstrate the ability of a quantum processor to solve a calculation that a traditional computer would perform in years and years.
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| Renesas adopts Microsoft Azure to deliver a 'chip-to-cloud' IoT solutions |
10/30/2019 |
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Renesas’ extensive secure embedded design experience will be combined with easy and seamless out-of-the-box support for Microsoft Azure RTOS across Renesas’ microcontroller (MCU) and microprocessor (MPU) portfolio. The company explains that this should simplify the device-to-cloud experience for IoT developers.
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| TSMC and Globalfoundries settle litigation through cross license |
10/30/2019 |
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The companies said they have agreed to a broad life-of-patents cross-license to each other's worldwide existing semiconductor patents as well as those patents that will be filed during the next 10 years as both companies continue to invest significantly in semiconductor research and development.
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| U.K. allows Huawei to supply 5G components |
10/29/2019 |
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A decision to give 5G infrastructure contracts to Huawei will be announced before Christmas, The decision will be that Huawei switchgear can be used in “non-contentious” areas of the network.
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| Changing lanes at voice command |
10/29/2019 |
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Hi Auto has devised an “audio-visual” solution. It employs a driver-facing camera and a single microphone. By applying a deep learning algorithm that tracks lip movement, the combined audio-visual solution zooms in on the driver while clearing all other speakers and noise.
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| Micron Technology acquired Fwdnxt |
10/28/2019 |
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The acquisition will enable Micron to explore deep learning solutions required for data analytics, particularly with internet of things and edge computing.
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| ST gains production control on SIC by acquiring Norstel |
10/28/2019 |
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ST will complete the acquisition of the remaining 45% stake in Norstel in Q4 for around $60 million. Silicon carbide continues to be a key strategic part of ST’s business, with design wins for SiC MOSFETs and diodes in applications like on-board charging and DC-DC conversion; the company will supply high-efficiency SiC devices to Renault-Nissan-Mitsubishi for advanced on-board chargers.
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| Low cost silicon III-V devices needed to enable 5G |
10/28/2019 |
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Some low-power IoT sensors will be combined with wireless RF, yet they must be cheap. That suggests combining silicon CMOS with III-V devices on the same chip. Easier said than done - though it IS being done.
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| Smart cities in India to take on LPWAN |
10/28/2019 |
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There would be at least eight billion connected devices in India by 2026, and highlighted the many different low power wide area networks (LPWAN) available in India to implement smart city projects. 2 MHz of spectrum was already available (865-867 MHz) and another 6 MHz has been approved (920-925 MHz).
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| Samsung brings out new 7nm Exynos 990 processor |
10/25/2019 |
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Built on Samsung’s 7nm process, and includes a Mali-G77 GPU that increases graphical performance or power efficiency compared to Samsung’s previous chip by up to 20 percent as well as an octa-core CPU that should be 20 percent faster.
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