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| We are heading into monster chip of complex SoC design |
9/23/2019 |
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It’s not only big datacenter artificial intelligence (AI) chips, but also autonomous vehicles such as cars, trucks and drones; they are self-landing, reusable rockets; they are medical devices carrying out remote diagnostics; and they are connected machine tool controllers supporting smart manufacturing.
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| Semiconductor industry heading for a rebounce |
9/23/2019 |
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Future Horizons, assured that industry fundamentals were sound, and after a fall of around 15% in 2019, the industry will rebound with around 4% revenue growth to $414 billion in 2020.
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| Foxconn wants to become a full-solution provider |
9/20/2019 |
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Foxconn's goal is to become a full-solution provider that covers segments ranging from IC to software design. The group is also set to vertical integrate all its existing resources and deployments in fields such as semiconductor equipment, packaging and testing, foundry, IC design, system integration and channel, and to push for a modularized or even systemized platform.
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| Merger and Acquisition trend re-ignited |
9/20/2019 |
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Semiconductor M&A activity strengthened in the first eight months of 2019 with the combined value of about 20 M&A agreement announcements reaching $28.0 billion for the purchase of chip companies, business units, product lines, intellectual property (IP), and wafer fabs between January and the end of August.
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| High Definition Mapping is an important element to autonomous driving |
9/20/2019 |
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HD maps have many more details than traditional varieties do. They’re typically shown at the centimeter scale. Instead of merely indicating things like the locations of particular places or the distance between two destinations, HD maps feature information about lane placement, road boundaries, the severity of curves, the gradient of the road surface, and more.
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| Synopsys offers next generation of embedded vision processor design |
9/19/2019 |
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Based on the ARCv2 RISC instruction set architecture, the new DesignWare ARC EV7x vision processors feature a 1, 2 or 4-core heterogeneous architecture which integrates vector DSP, vector FPU, and neural network accelerator to enable a variety of intelligent automotive and consumer applications with integrated AES encryption.
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| Carriers are hurdling to join the deployment of 5G |
9/19/2019 |
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As a reality check, the August “report card on 5G” from the Global Mobile Suppliers Association (GSA) noted that despite “continued progress,” so far just 39 global operators have announced 3GPP-compatible commercial 5G services. The most recent ones include three operators in Kuwait, one in Bahrain, T-Mobile and Vodafone in Germany, Vodafone in the UK – and the prominent operator in the Maldives
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| IoT devices to dominate the Bluetooth market by 2024 |
9/18/2019 |
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According to the research firm, by 2024, IoT devices will represent 31% of total Bluetooth device shipments and 27% of total WiFi device shipments, up from 13% and 10%, respectively, in 2018. Key markets for Bluetooth are expected to be in beacons, asset management and personal trackers.
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| Sony Corp. rejects proposal to split its IC unit |
9/18/2019 |
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Sony's semiconductor business "is expected to create even more value going forward through its close collaboration with the other businesses and personnel within the Sony group," Sony President and CEO Kenichiro Yoshida said in a letter.
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| Qualcomm pay TDK $3.1 billion to buy out RF development JV |
9/18/2019 |
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Qualcomm and TDK worked together to expand the former’s expertise in developing RFFE parts that connect cellular modems to antennas, which have historically been separate components inside smartphones and other cellular devices.
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| Winbond launched LPDDR4X Mobile DRAM |
9/17/2019 |
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Winbond Electronics has been devoted to the development of the niche memory product market for many years. Winbond pays great attention to their customers’ needs and the development trend of new technologies, and has successfully developed a new generation of Mobile DDR products LPDDR4X to fulfill the needs.
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| Hauwei is open to licensing its 5G technology to U.S.-based manufacturers |
9/17/2019 |
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New York Times columnist Thomas Friedman wrote that he had met with reclusive Huawei founder Ren Zhengfei, and reported that Ren had made a startling offer: if the U.S. is concerned about potential security problems associated with Huawei equipment, then Hauwei would be open to licensing its technology to U.S.-based manufacturers.
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| China trade war affects IC design industry |
9/16/2019 |
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All top five global IC design companies fell in Q2 2019. Reasons cited are the US-China trade war, mounting inventory levels along the supply chain, and less-than-satisfactory global demand for consumer electronics, including smartphones, tablets, notebooks, LCDs, TVs and servers.
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| Researchers at MIT forsee carbon nanotube to take over Silicon one day |
9/16/2019 |
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With silicon no longer following historical scaling trends, there’s been considerable research in beyond-silicon nanotechnologies. Carbon nanotube field-effect transistor (CNFET)-based digital circuits offer one approach that promises substantial energy-efficiency benefits, but the inability to perfectly control intrinsic nanoscale defects and variability in carbon nanotubes has precluded the realization of very-large-scale integrated systems.
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| India has opportunity to expand on analog and mixed-signal design services |
9/16/2019 |
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Indian analog and mixed-signal design services firm Sankalp Semiconductor was acquired in an all-cash deal by HCL Technologies, one of the country’s leading IT outsourcing firms, for just over US$25 million. The acquisition is part of the latter’s strategic plans to expand into newer market domains and offer a wider range of services to its customers in the analog and mixed signal space.
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