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AMS re-enter bid to buy Osram 8/16/2019
This is the second attempt by AMS to acquire Osram this year. It ended its first attempt to buy Osram in July saying it didn’t see "sufficient basis" to proceed with its offer. Over the weekend, however, AMS decided to revive its bid. If successful, the combined company would have a broad portfolio of sensor solutions and photonics with approximately €5 billion of revenue.
Globalfoundries to divest its photo mask facility in Burlington 8/15/2019
Over the next several months, Toppan and GLoFo will work to transition the acquired equipment and processes to Toppan facilities worldwide.
Qualcomm appoints Mark McLaughlin as its independent chairman 8/15/2019
McLaughlin is the former chairman and CEO of Palo Alto Networks. Henderson, the former chief financial officer of Cardinal Health, will remain on the Qualcomm board and continue to chair its audit committee.
Wafer level packaging in demand with 5G deployment 8/15/2019
5G-enabled phones will require wafer-level backend services. Suppliers capable of providing wafer-level backend services will find their role more important than that of module assemblers when making 5G devices, according to industry sources.
Cray secured contract to build exascale computer 8/15/2019
El Capitan will have a peak performance of more than 1.5 exaflops when it is commissioned in 2023. The estimated 30 MW system will use a combination of processors and accelerators to be chosen closer to its time of assembly.
CBS and Viacom finally strike merger deal 8/14/2019
The new company will be called ViacomCBS. Existing CBS shareholders will own about 61% of the combined company, with Viacom shareholders owning the remaining 39%.
Samsung to put 108-megapixel camera sensor to smartphones 8/14/2019
The Samsung ISOCELL Bright HMX, which was designed in collaboration with Xiaomi, is a 108-megapixel smartphone camera sensor that Samsung says is the first to surpass the 100 million pixel milestone for phones. As well as producing high resolution photographs, the sensor can also shoot in 6K video (6016 x 3384) at 30 fps.
ASE to acquire factory building in Kaohsiung, Taiwan 8/14/2019
The new building, valued at NTY$2.326 billion (US$74.67 million) and located adjacent to its major manufacturing complex in Nanzih Export Processing Zone, will help ASE optimize its capacity allocation to strengthen the firm's overall development.
5G deployment to cause up surge of memory demand 8/14/2019
Memory industry is expected to see a brighter prospect starting 2020 when 5G services kick off commercial runs driving the popularity of 5G terminal devices that will in turn generate strong growth for memory products, according to industry sources.
GlobalWafers remains conservative about sales outlook this year 8/13/2019
Some major clients have been cautious about placing orders despite the arrival of the peak season. The silicon wafer manufacturer also disclosed revenues fell 12.6% sequentially to a 17-month low of NT$4.48 billion (US$142.8 million) in July 2019.
SK hynix developed HBM2E DRAM for high bandwidth computing 8/13/2019
The latest HBM2E boasts 50 percent higher bandwidth and performance. It supports over 460 gigabytes of data per second based on 3.6 gigabits-per-second speed performance per pin with 1,024 data inputs and outputs.
Samsung found a source of photoresist through an Imec-JSR jv 8/13/2019
The Japan government has put restrictions on the export of photoresist to Korea as part of its trade war. It is thought that, because the Belgian facility has existed for sometime, it is not subject to Japan’s export restrictions.
Broadcom offers $10.7 billion in cash for Symantec 8/13/2019
he deal has all the hallmarks of Tan’s past acquisitions. A mature but troubled company is acquired. Its sales force, expenses and R&D budgets are significantly cut to focus on a few core products sold often at lower prices to undercut rivals.
Diodes to acquire Lite-On Semiconductor 8/12/2019
At the effective date of the transaction, each share of LSC stock will be converted into the right to receive NT$42.50 in cash, or US$1.37, as of June 30, 2019 without interest. The aggregate consideration will be approximately US$428 million. The price per share reflects a premium of 35% over LSC's 30-day volume-weighted average price.
Samsung cranks up high-performance SSD, high-density DRAM production 8/12/2019
Samsung Electronics on Friday announced its commercial production of the PM1733 PCIe Gen4 Solid State Drive (SSD) and high density RDIMM1 and LRDIMM2 dynamic random access memory (DRAM) for the AMD’s EPYC 7002 Gen 2 processors and new servers.
Synopsys to acquire QTronic GmbH, a software specialist for automotive electronic 8/12/2019
When completed, it said the acquisition will broaden Synopsys' automotive product portfolio for automotive Tier 1 and OEM companies and add a team of highly experienced engineers to accelerate technology development and customer deployment.
Nasdaq-style tech board opens in Shanghai 8/12/2019
Of the first 25 companies listed, computer, communications and electronic equipment manufacturers held the lion’s share. They include eight specialty equipment makers covering chip, semiconductor, optical simulation, IoT and smart manufacturing. Six in the group are chip and semiconductor-related companies.
Broadcom turns intrest to Symantec Corp’s enterprise unit 8/9/2019
The deal could be worth about $10 billion, the Wall Street Journal reported, citing sources. Shares of Symantec, which has a market value of $12.63 billion, rose 14% in extended trading,
Japan re-open photoresist shipment to Korea 8/9/2019
Korean Prime Minister Lee Nak-yon Thursday confirmed that Tokyo approved a Japanese vendor of photoresist, one of the three products subject to the export controls since July 4, to ship out the product to Korea after finding no risk of military use.
AMD use ROME to challenge Intel's server chip dominance 8/9/2019
Analysts said AMD’s Epyc 7002 series, aka Rome, likely will meet its goal of winning the company at least 10% of classic server sockets by next June, up from its low- to mid-single digit share today. To date, most of the gains AMD has made with its new Zen-based processors have been in desktops and notebooks
China showed 5G power at Mobile World Congress, Shanghai 8/9/2019
Exhibitors were showing user equipment (UEs), connectivity from the big players but also from a lot of emerging small-cell providers, lots of Internet of things (IoT) use-cases, also xR (VR/AR/MR) demonstrating immersive streaming to a group for interactive gaming — all of this 5G-based.
SMIC, the largest foundry in China, working hard to catch up on process technology 8/8/2019
The Chinese government has made semiconductors a key pillar of its so-called Made In China 2025 plan, an initiative to boost the production of higher value products. China aims to produce 70% of the semiconductors it uses by 2025, and that drive is backed by billions of dollars of investment by the government
AMD CEO Lisa Su denies departure rumor 8/8/2019
"Just for the record, zero truth to this rumor. I love AMD and the best is yet to come!" she said in the tweet.
Japan’s Toshiba Corp is working hard to rebounce 8/8/2019
The Japanese conglomerate has been consolidating factories, cutting jobs, revamping the procurement method to compensate for the loss of the prized chip business, sold last year to plug a multi-billion-dollar balance sheet hole left by the collapse of its U.S. nuclear power unit.
NAND Memory vendors are bringing out 100+ layer NAND 8/8/2019
Samsung and SK Hynix said they will ship 3D chips with more than 100 layers this year, while Toshiba debuted a low latency NAND it hopes can eat into the market for DRAM.
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