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Infineon to expand research site in Austria 4/9/2019
DICE (Danube Integrated Circuit Engineering) has broken ground in Linz for a new facility.The new building, which is due to be completed in 2020, will provide room for 400 employees. The existing site currently employs 180 people working for the development center. Its main focus is on 77 GHz radar chips for driver assistance systems.
South Korea wants to go beyond memory and into 5G networks 4/9/2019
South Korea is seeking opportunities in the emerging 5G chipset market in an effort to overcome sluggish demand for memory chips.
First data distribution platform certified for Avionics applications 4/9/2019
The Open Group FACE consortium announced on March 27. The conformance certification specifically applies to the “edge computing” vendor’s Java programing language application programming interface (API). The company’s data distribution service dubbed Vortex also supports C++.
Austin researcher disclosed design that beats a Nvidia V100 neual network 4/9/2019
A researcher from UT Austin described mini-batch serialization (MBS), a method to slash memory accesses needed to train convolutional neural networks (CNNs) so that more work fits in on-chip buffers. When implemented on its own WaveCore chip, the technique reduced DRAM traffic 75%, improved performance 53%, and saved 26% of system energy compared to conventional approaches and accelerators.
Samsung earnings plunged due to falling memory prices 4/8/2019
The tech giant expected overall sales to have fallen 14.1 percent on-year to 52 trillion won in the three-month period.
Intel's Optane DIMMs for server so far a disappointment 4/8/2019
Intel and Micron launched 3D XPoint with great fanfare in July 2015 as the first new memory architecture in decades. Nearly five years later, the chips are finally shipping in both solid-state drives (SSDs) and dual-inline memory modules (DIMMs), but their sparkle has dimmed.
802.11Ah WiFi for IoT comes into market 4/8/2019
The Wi-Fi Alliance announced HaLow at CES 2016 as the outcome of the 802.11ah process kicked off with significant help from Qualcomm engineers in 2014.The so-called 'HaLow' products promise delivery of up to Mbits/s over distances of tens of meters to a kilometer and support for thousands of nodes on an access point.
Toyota to offer licensing of hybride car technology 4/8/2019
Toyota Motor Corp. announced a plan to start granting royalty-free licenses on the company’s closely guarded hybrid electric vehicle (HEV) patents.It will also offer “fee-based” technical support to purchasers of their powertrain electrification systems, including Toyota motors, batteries, PCUs and control ECUs.
Semiconductor materials sales hit record in 2018 4/5/2019
The global semiconductor materials market grew 10.6% in 2018, propelling semiconductor materials revenues to US$51.9 billion to eclipse the previous high of US$47.1 billion set in 2011.
Samsung put 5G Exynos Modem into production 4/5/2019
The model, unveiled in August, is the world's first 5G modem to be compatible with the 3GPP's 5G New Radio (5G-NR) standard.
China is exporting its construction capability to Central America 4/5/2019
Belt and Road is building on multibillion dollar deals for loans and investments in oil and mining in South America that Beijing made beginning in the 1990s.
Cadence Design moves into system analysis with an electromagnetic field solver 4/5/2019
The tool boasts electromagnetic simulation capability that delivers up to 10 times the performance of Cadence’s previous-generation field solver. The Clarity 3D Solver also offers a distributed multiprocessing architecture that gives it “virtually unlimited capacity” along with “gold-standard accuracy,” according to Cadence.
SIA calls on the government to boost funding on chip research 4/4/2019
The Semiconductor Industry Association, which represents firms such as Intel Corp, Micron Technology Inc and Nvidia Corp, is asking U.S. officials to raise federal funding for chip research from a current $1.5 billion to $5 billion over the next five years and double funding for related fields such as materials science.
7nm order picks up at TSMC 4/4/2019
With handset chip clients stepping up their pace of advanced chip orders, TSMC is expected to see its 7nm manufacturing processes run at full utilization in the third quarter of 2019.
Huawei defended its commitment to network security 4/4/2019
Huawei Technologies Ltd., the biggest global maker of network equipment for phone and internet companies, announced last year's sales surpassed $100 billion despite U.S. pressure on American allies to shun it as a security threat.
AI automates the financial industry 4/4/2019
AI is already widespread in many areas of the financial services sector. AI and machine learning (ML) are frequently used today in credit card fraud detection, bank customer service chatbots, and robo-advisors which provide financial advice to consumers.
IoT can increase productivity substantially 4/3/2019
A 2018 PwC report, Australia’s IoT Opportunity: Driving Future Growth, stated that across five industries assessed, which represent 25 per cent of Australia’s GDP, the Internet of Things (IoT) can achieve potential annual benefits of $194-$308 billion over a period of 8-18 years. This impact translates into average productivity improvements of about 2 per cent per annum across construction, mining, manufacturing, healthcare and agriculture.
U.S. durable goods order plunge in February 4/3/2019
Big-ticket manufactured goods fell 1.6% in February, the biggest drop in four months, reflecting a plunge in the volatile commercial aircraft category. Demand in a key sector used to track business investment decisions also declined in February.
5G networks to drive more memory requirements 4/3/2019
5G will enable the ultra-low latency, ultra-fast response time needed to support online gaming, artificial reality (AR) and virtual reality (VR), autonomous vehicles, and more exotic potential use cases such as remote surgery. This means we are moving to a more distributed model of computing, including the memory.
Intel announced Xeon processors packaged with FPGA and Optane memories 4/3/2019
Strategically, Intel has tied its CPUs, FPGAs, and memories into a package deal, claiming performance benefits. It’s part of an industry trend to harness several chips into a dogsled that drives systems performance forward given the slowing rate of performance gains in individual chips.
Renesas completed the acquisition of IDT 4/2/2019
Together with IDT, Renesas says it will now deliver a broader range of technology and embedded solutions by combining IDT’s RF, high-performance timing, memory interface, real-time interconnect, optical interconnect,
Macronix chairman predicts memory demand to pick up in 2nd half 2019 4/2/2019
Wu believes that end-market demand particularly demand for consumer electronics devices will gradually pick up in the second half of 2019, when the macro conditions become favorable to the industry.
Chinese manufacturing activity rebounced some in March 4/2/2019
The government loosened lending controls and increased spending to reverse the slowdown, but authorities moved gradually to avoid igniting a rise in debt. The ruling Communist Party also has promised to give entrepreneurs who generate China's new jobs and wealth a bigger role in the economy.
Japanese carmakers announced a late entry into the autonomous vehical driving market 4/2/2019
It has been surprised at the hesitancy of many Japanese carmakers to pursue autonomous vehicle (AV) development. Along with this, they’ve done little to prepare for the onset of new transportation services using self-driving cars.
CPU shortage driving down PC global shipments 4/1/2019
CPU shortages have disrupted shipment schedules for mid-range and high-end PCs since the second half of 2018 while also starting to affect shipments of low-end models in the first quarter of 2019, causing demand for related chips to fluctuate sharply.
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