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| A truce is possible in the trade war but a true solution is long way away |
7/8/2019 |
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Last week at an event held by CEA-Leti in Grenoble, France, Handel Jones, the founder and CEO of International Business Strategies, Inc., warned the audience, “If the U.S. and China do not find a way to ease the current trade tension, we are expecting the global semiconductor market in 2019 to shrink by 18 percent — roughly $100 billion — compared to 2018.”
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| Hard Drives ae still striving |
7/8/2019 |
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. “There's still a very good place for hard drives in what they call ‘cheap and deep’ storage.” And as much as flash has come down in price to be less of a premium media, there’s still a 10-to-1 gap between NAND flash and hard disk drive prices, he noted. “That is not going to go away.”
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| Walmart consider to sell its online unit |
7/4/2019 |
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Walmart is frustrated with Jet— an online shopping site it purchased for $3.3 billion back in 2016. The mounting losses have put CEO Marc Lore on the hotseat with the company’s leadership.
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| Imec leading EU program on low-power AI chips based on emerging memory technologies |
7/4/2019 |
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The three-year program, is a cross-border collaboration between 19 research and industrial partners, including CEA-Leti of France and the Fraunhofer Group of Germany. The joint effort aims to develop process technology and hardware platforms leveraging emerging memory technologies for neuromorphic computing. The goal is to develop a new way to support applications in mobile devices that need complex machine-learning algorithms.
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| 56 Taiwan companies to form AI on Chip Taiwan Alliance (AITA) |
7/4/2019 |
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The goal of the alliance is to enable related semiconductor companies to reduce the development cost of AI chips by 10 times, shorten the development time by more than six months, and catapult Taiwan to become a leading supplier of AI chips in the global market.
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| Broadcom to acquire Software infrustructure through M&E |
7/4/2019 |
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Broadcom says it’s no longer interested in buying independent semiconductor companies like Qualcomm because they’re overpriced relative to their value. Instead, it plans to look for acquisitions in the infrastructure software space, similar to its $19 billion buyout of CA Technologies last July.
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| China's Tsinghua Unigroup forms new DRAM business unit |
7/3/2019 |
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DRAM, or dynamic random access memory, has proven especially difficult for Chinese companies to produce at scale. U.S.-based Micron Technology Inc and South Korea’s Samsung Electronics Co Ltd and SK Hynix Inc together account for over 95% of global DRAM market share.
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| Microchip offers controllers for automotive touchscreens |
7/2/2019 |
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The TD family of touch controllers features a new differential mutual signal acquisition method that significantly increases the Signal-to-Noise Ratio (SNR). This allows the use of very thick glass or plastic cover lenses and multi-finger thick gloved touch support up to the equivalent of 4.5 mm polymethyl methacrylate (PMMA).
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| Amazon Prime replaces others as the largest shiping carrier for Amazon |
7/1/2019 |
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Amazon was delivering nearly half of its own packages by the end of May, according to Rakutan Intelligence, by way of a report in Axios. The e-commerce leader was responsible for 48% of its shipments, while the U.S. Postal Service delivered 33%, and United Parcel Service (NYSE:UPS) carried 17%. FedEx rounded out the list with less than 2%.
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| China's ZTE to ship 5G chips this year after Huawei |
7/1/2019 |
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At the 5G Summit held alongside MWC Shanghai 2019, Xu cited company statistics as saying that ZTE's patent applications had amounted to 73,000 cases as of the end of 2018, including over 35,000 globally-licensed patents and more than 3,000 strategic patents for 5G technologies.
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| UK move to reduce eWaste |
7/1/2019 |
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Globally, according to the committee, 44.7 million tonnes of e-waste was produced in 2017, 90% of which landfilled, incinerated, illegally traded or treated in a sub-standard way. Europe and the US account for almost half of all e-waste globally, with the EU predicted to produce 12 million tonnes by 2020.
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| ARM Lead CPU Architect joins Apple 5G developement |
6/28/2019 |
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Former ARM Lead CPU Architect Mike Filippo joined up with Apple last month, following a 10 year stint with the semiconductor company. The move notably follows the exit of Apple chip design lead Gerard Williams III, back in March. Filippo appears perfectly suited for the role, having played a key part in a many of ARM’s virtually ubiquitous designs.
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| Toshiba Machinery appointed outsiders to new board |
6/28/2019 |
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The board reached a proportion of outsiders unheard of among Japanese peers with the new lineup, which Toshiba proposed last month in response to shareholder pressure. The 10 outside directors are up from seven on the previous board, while four of the 10 hail from outside Japan.
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| U.S. first quarter GDP grew 3.1% |
6/27/2019 |
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But signs are mounting that growth has slowed sharply in the current quarter amid slower global growth and a confidence-shaking trade battle between the United States and China.
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| EU warns Broadcom of possible antitrust on TV and modem chips |
6/27/2019 |
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The European Commission said the so-called interim measures, the first in 18 years, were warranted because of Broadcom’s likely dominance in the TV and modem chipset markets and deals between the company and seven major customers that resulted in the latter buying chips only from Broadcom.
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