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| 3D NAND manufacturers agreesively extended to 128 layers |
6/5/2019 |
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Continued falls in NAND flash prices coupled with rising uncertainty on the demand side have prompted the players to accelerate their technology advancements for cost reasons.. Some major NAND flash chipmakers have delivered samples of their 128-layer chips targeting the first half of 2020 for volume production..
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| Samsung taps on AMD GPU to create a gaming phone |
6/4/2019 |
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Today, Samsung has announced that it will be entering into a “multi-year strategic partnership” with computing giant AMD to develop and manufacture mobile graphics chipsets for Samsung smartphones.
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| A pay raise at this time may not be good for the economy |
6/4/2019 |
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Pay raises are starting to narrow corporate profit margins, posing a threat to earnings and stocks, and to business hiring and investment plans. The trend eventually could temper economic growth, trigger layoffs and even contribute to the next recession,
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| Memory module makers to push niche products for profit |
6/4/2019 |
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Apacer disclosed previously the company will be pursuing profit growth this year by enhancing further its high-margin offerings. Adata Technology will rely on the three niche segments of gaming, industry control, and electric motors to raise its gross margins.
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| Infineon to pickup Cypress for $10 billion |
6/3/2019 |
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Infineon is paying $23.85 per share in cash ($10 billion enterprise value, counting debt) in addition to continuing its dividend through closing. That’s 55% higher than the stock price last week before the news started to leak.
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| Toshiba's XG6-P SSD will be for servers and gamers |
6/3/2019 |
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With over 30% higher sequential and random write speeds and over 15% higher random read speeds than its predecessor, the XG6-P series enables enhanced application performance and data access for high-end workstation PCs and gaming systems, as well as cost-optimized data center and composable infrastructures.
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| NAND sales reportly down 23.8 percent |
6/3/2019 |
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Disappointing demand for smartphones and servers during the fourth quarter of 2018 has prompted OEMs to start adjusting their inventory levels since 2019, DRAMeXchange said.
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| TI,s Templeton said there are opportunities in China |
6/3/2019 |
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“We still think that there’s opportunity to grow in China – grow with our customers in China; we’ll invest accordingly,” Templeton said at the investor conference. “We think it’s more opportunity than risk. Is it different today than it was five years ago".
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| Next Samsung phone may drop all buttons and connectors |
5/31/2019 |
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Samsung's upcoming Galaxy Note 10 may finally ditch the headphone jack that it's held onto for so long. Additionally, the report states that Samsung may also drop all physical buttons from the Galaxy Note 10, including volume and power keys, opting instead to use "capacitive or pressure-sensitive areas".
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| Rapid expansions propels China to No. 2 PCB maker |
5/31/2019 |
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Most Taiwan makers are wary of their Chinese rivals' rapid expansions. DSBJ, for instance, has managed to score annual revenues of over US$1 billion within two years by acquiring US-based FPCB maker Mflex and Hong Kong's PCB assembler Multek.
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| AMD goes into 7nm laptop CPU with hlep from TSMC |
5/30/2019 |
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The company used to rely on GlobalFoundries Inc for chips. However, the US firm in August last year said that it would indefinitely put on hold its development of 7-nanometer technology and technologies beyond that, making TSMC the sole foundry for AMD’s processors.
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| Trump send $16 billion to farmers affected by trade war |
5/29/2019 |
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U.S. Agriculture Secretary Sonny Perdue said the first of three payments is likely to be made in July or August and suggested that U.S. negotiators may be weeks away from settling a bitter trade dispute with China. The latest bailout comes atop $11 billion in aid Trump provided farmers last year.
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| 3D NAND is becoming a challenged market |
5/28/2019 |
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Currently, Intel is evaluating its 3D NAND business amid losses in this market, and is mulling over the idea of finding a new NAND partner or exiting the market, analysts said. No decision has been reached. Meanwhile, it’s unclear if YMTC will ship its initial 3D NAND products this year, as previously planned.
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| 6 Space Initiatives suuported by NASA |
5/28/2019 |
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>NIAC funds cutting-edge concepts with the potential to transform future aerospace missions, enable new capabilities, or significantly alter current approaches to launching, building and operating aerospace systems. NIAC Phase II awards are worth as much as $500,000 for two-year studies to further develop Phase I concepts.
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| USB flash demand continue to grow |
5/28/2019 |
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“There are also people who would rather keep their information not on their computer but on something that they control more.” One scenario might be to archive a large amount of data on a drive and then place it in a safety deposit box.
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| TSMC will continue supply to Hwawei |
5/28/2019 |
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TSMC said that after careful consideration, it will maintain its shipments to Huawei's chip arm HiSilicon throughout this year. The world’s biggest foundry noted that any impact to one client could result in gains for another client.
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