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Thursday, March 6, 2025

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3D NAND manufacturers agreesively extended to 128 layers 6/5/2019
Continued falls in NAND flash prices coupled with rising uncertainty on the demand side have prompted the players to accelerate their technology advancements for cost reasons.. Some major NAND flash chipmakers have delivered samples of their 128-layer chips targeting the first half of 2020 for volume production..
Samsung taps on AMD GPU to create a gaming phone 6/4/2019
Today, Samsung has announced that it will be entering into a “multi-year strategic partnership” with computing giant AMD to develop and manufacture mobile graphics chipsets for Samsung smartphones.
A pay raise at this time may not be good for the economy 6/4/2019
Pay raises are starting to narrow corporate profit margins, posing a threat to earnings and stocks, and to business hiring and investment plans. The trend eventually could temper economic growth, trigger layoffs and even contribute to the next recession,
Samsung want to froster innovation through new technologies 6/4/2019
The de-facto leader of the world's largest memory chip and handset maker vowed to spur innovation in key technologies and foster new growth engines to maintain a leading position in the rapidly changing technology industry.
Memory module makers to push niche products for profit 6/4/2019
Apacer disclosed previously the company will be pursuing profit growth this year by enhancing further its high-margin offerings. Adata Technology will rely on the three niche segments of gaming, industry control, and electric motors to raise its gross margins.
Infineon to pickup Cypress for $10 billion 6/3/2019
Infineon is paying $23.85 per share in cash ($10 billion enterprise value, counting debt) in addition to continuing its dividend through closing. That’s 55% higher than the stock price last week before the news started to leak.
Toshiba's XG6-P SSD will be for servers and gamers 6/3/2019
With over 30% higher sequential and random write speeds and over 15% higher random read speeds than its predecessor, the XG6-P series enables enhanced application performance and data access for high-end workstation PCs and gaming systems, as well as cost-optimized data center and composable infrastructures.
NAND sales reportly down 23.8 percent 6/3/2019
Disappointing demand for smartphones and servers during the fourth quarter of 2018 has prompted OEMs to start adjusting their inventory levels since 2019, DRAMeXchange said.
TI,s Templeton said there are opportunities in China 6/3/2019
“We still think that there’s opportunity to grow in China – grow with our customers in China; we’ll invest accordingly,” Templeton said at the investor conference. “We think it’s more opportunity than risk. Is it different today than it was five years ago".
Next Samsung phone may drop all buttons and connectors 5/31/2019
Samsung's upcoming Galaxy Note 10 may finally ditch the headphone jack that it's held onto for so long. Additionally, the report states that Samsung may also drop all physical buttons from the Galaxy Note 10, including volume and power keys, opting instead to use "capacitive or pressure-sensitive areas".
Rapid expansions propels China to No. 2 PCB maker 5/31/2019
Most Taiwan makers are wary of their Chinese rivals' rapid expansions. DSBJ, for instance, has managed to score annual revenues of over US$1 billion within two years by acquiring US-based FPCB maker Mflex and Hong Kong's PCB assembler Multek.
NXP to buy Marvell’s WiFi and Bluetooth unit 5/31/2019
The unit brought in $300 million in revenue for Marvell in fiscal 2019 and NXP expects that to double by 2022.
Cypress hired advisers to put itself up for sale 5/31/2019
In Q1 the company reported a 5.5% drop in revenues but forecast a 4.4% rise for Q2.
Lenovo announced laptop computer based on Snapdragon powered 5G chips 5/30/2019
The laptop runs on Qualcomm’s Snapdragon 8cx Compute Platform, which is designed to support both 5G and 4G connections.
Taiwan’s Pegatron to set plant in Indonesia for Apple processor packaging 5/30/2019
Pegatron plans to assemble the phone chips in partnership with Indonesian electronics company PT Sat Nusapersada at a factory on the island of Batam,
AMD goes into 7nm laptop CPU with hlep from TSMC 5/30/2019
The company used to rely on GlobalFoundries Inc for chips. However, the US firm in August last year said that it would indefinitely put on hold its development of 7-nanometer technology and technologies beyond that, making TSMC the sole foundry for AMD’s processors.
China accused U.S. as seeking to "colonize global business" 5/30/2019
At a daily briefing Friday, foreign ministry spokesman Lu Kang accused American politicians he didn't name of "fabricating various lies based on subjective presumptions and trying to mislead the American people."
Western Digital to invest in new Toshiba 3D NAND fab 5/29/2019
The companies disclosed their joint capital investments in equipment for the K1 facility will enable initial production output of 96-layer 3D flash memory beginning in calendar 2020
Achronix's Speedster7t FPGA marks challenge to Xilinx's Versal on AI 5/29/2019
The Speedster7t marks the company's return to FPGA chips, targeting the hot market for AI acceleration. Achronix claims that its mid-range 1500 chip can use ResNet-50 and Yolov2 neural-network models to process 8,600 and 1,600 images/second, respectively.
Trump send $16 billion to farmers affected by trade war 5/29/2019
U.S. Agriculture Secretary Sonny Perdue said the first of three payments is likely to be made in July or August and suggested that U.S. negotiators may be weeks away from settling a bitter trade dispute with China. The latest bailout comes atop $11 billion in aid Trump provided farmers last year.
China cut taxes to spur chip manufacturing in the midst of trade war 5/29/2019
The Finance Ministry's announcement Wednesday comes amid a spiraling tariff war with Washington over Chinese technology ambitions.
3D NAND is becoming a challenged market 5/28/2019
Currently, Intel is evaluating its 3D NAND business amid losses in this market, and is mulling over the idea of finding a new NAND partner or exiting the market, analysts said. No decision has been reached. Meanwhile, it’s unclear if YMTC will ship its initial 3D NAND products this year, as previously planned.
6 Space Initiatives suuported by NASA 5/28/2019
>NIAC funds cutting-edge concepts with the potential to transform future aerospace missions, enable new capabilities, or significantly alter current approaches to launching, building and operating aerospace systems. NIAC Phase II awards are worth as much as $500,000 for two-year studies to further develop Phase I concepts.
USB flash demand continue to grow 5/28/2019
“There are also people who would rather keep their information not on their computer but on something that they control more.” One scenario might be to archive a large amount of data on a drive and then place it in a safety deposit box.
TSMC will continue supply to Hwawei 5/28/2019
TSMC said that after careful consideration, it will maintain its shipments to Huawei's chip arm HiSilicon throughout this year. The world’s biggest foundry noted that any impact to one client could result in gains for another client.
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