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When counterfeit supplies become a problem 1/31/2019
Technology advancements have only added to the problem: electronic components can now be cloned so well that they cannot be distinguished from the genuine article. But counterfeiting is not just a technology issue —procurement and supply chain practices also contribute to the proliferation of fake devices.
Mars surface details captured by Teledyne CCD Sensor 1/31/2019
Teledyne DALSA upgraded the imaging sensing technology to survey the InSight landing site and determine the optimum place to deploy, for the first time on another planet, a seismometer and a heat probe capable of drilling 15 feet down into the subsurface of Mars.
Defective chemical material conteminates production at TSMC 1/30/2019
"TSMC has discovered a shipment of chemical material used in the manufacturing process that deviated from the specification and will impact wafer yield," the company said in a statement. It said it was investigating the cause of the problems at the Fab 14B production site in southern Taiwan and contacting customers.
5G development activity benefits Xilinx and others 1/30/2019
“The start of this ramp [up of 5G spending] is happening faster than we had thought,” Xilinx Chief Executive Victor Peng said on the company’s quarterly earnings call on Jan. 23. “And the strength for coming out of the gate is pretty strong.”
Budget Office calculated the government shutdown cost $3 billions to economy 1/30/2019
Overall, CBO predicts that just $3 billion in lost gross domestic product will be permanently lost, a modest figure in a $20 trillion-plus economy. By year's end, CBO says, GDP would be just 0.02 smaller because of the shutdown, which shuttered many domestic agencies.
Intel to spend $10 billion expanding fab in Isreal 1/30/2019
Israeli business publication Globes reported that Intel asked that Israel for a state grant amounting to about 10% of the cost of the project. The report indicated that Intel is already preparing the physical infrastructure for the new fab.
AMD subcontracts PCIe 4.0 design work to Taiwan ASMedia 1/29/2019
AMD has announced that its 3rd generation Ryzen desktop processors fabricated by TSMC with 7nm process will hit the market in mid-2019, which will be the world's first PC processor platform that supports PCIe Gen 4 with transmission speed doubling to 16GT/s. The PCIe Gen 4 is expected to become mainstream motherboard PCH in the future.
SK Hynix reports 10% up on annual sales 1/29/2019
The South Korean semiconductor manufacturer reported sales of ?9.94tn ($8.9bn), up 10 per cent year-on-year but down 13 per cent on the prior quarter in what has historically been its busiest three months of the year. Similarly, net profit was up 6 per cent on a year ago to ?3.4tn ($3.04bn), but down 28 per cent sequentially.
Transition from DDR4 to DDR5 won/t be easy 1/29/2019
Those are the data and clock rate, VDD (or operating voltage), power architecture, channel architecture, burst length, and improvements for higher-capacity DRAM support. These new changes present special design considerations.
New Bluetooth and WiFi standard to improve location service within centimeter 1/29/2019
Smartphone giants Apple and Samsung have been active in the .4z meetings also attended by Huawei, leading some to suggest that the capability could be integrated in handsets within two years.
Mercury Systems to offer space qualified SSD 1/28/2019
Designed to operate reliably in high radiation environments, this is the first commercial SSD leveraging VITA 78 SpaceVPX standards to reduce cost and mitigate programme risk. In addition to commercial satellite applications, this device is also intended for high-altitude aircraft, airborne weapons and mission-critical ground computing systems.
Western Digital announced cost cuting 1/28/2019
Western Digital is targeting $800 million in annualized reductions in non-GAAP cost and expenses, Milligan said on the post-earnings call, adding that the company is accelerating the closure of a plant.
Intel reports China chip demand slowing 1/28/2019
Growth in data center sales came in far below what the company forecast as demand from Chinese customers weakened.
Semiconductor outlook unclear with many variables 1/28/2019
Big uncertainties over China and European trade and the bottom of the memory cycle predicts that the semiconductor industry will slow down over the next two years before picking up steam again. But in long term, don’t worry about China,
German government to spend $568 million research into next generation EV batteries 1/25/2019
The new facility aims to transfer known-how from Germany’s Fraunhofer science institute to private firms, helping reduce the risk for companies ready to start EV battery production.
Qualcomm, Intel and MediaTek are in the race for 5G modems 1/25/2019
Judging from actual field tests by related parties on 5G mobile communications technologies, the sources commented, Qualcomm, Intel and MediaTek will remain the only three players in the segment of 5G modem chips in the initial stage of the 5G era.
Semiconductor M & A down 75% from 2015 peak 1/25/2019
Total chip industry deals reached in 2018 — including semiconductor companies, business units, product lines, and related assets — were worth roughly $23.2 billion last year, down from $28.1 billion in 2017, according to estimates.
3D machine vision advancing 1/25/2019
Machine vision for guiding robotic movement has been implemented in factory applications for many years now and is in many ways a mature technology. Smart camera systems with built-in processing and calibration capabilities, robust recognition and measurement algorithms, and proven libraries that simplify application development are widely available and continually improving.
Business worries about global uncertainty 1/24/2019
Business executives had grown more worried about "increased financial market volatility, rising short-term interest rates, falling energy prices and elevated trade and political uncertainty.
Toshiba Electronics offers Ethernet bridge IC for automotive networks 1/24/2019
The TC9562 series has been designed to provide both reliability and performance, delivering Ethernet bridging capability up to 1Gbps transfer rate. The bridge IC also supports Time Sensitive Networking (TSN) protocol for various industrial and commercial applications.
Server demand predicted to be stable 1/24/2019
The major variable is the uncertainties arising from the US-China trade war, which may force cloud service providers to adjust downward their capital expenses on the establishment of datacenters, reducing demand for servers.
TSMC to tape out 5nm first half of this year 1/24/2019
The foundry is scheduled to start taping out 5nm chip designs later in the first half of 2019. TSMC is on track to move its 5nm process incorporating EUV lithography technology to volume production in the first half of 2020, according to Wei.
EU to fund compound semiconductor development 1/23/2019
The plan unlocks €1.75bn of funding for research activities and will bring in up to €6bn in private investment and will ultimately help bring new technology innovations to market.
DRAMeXchange predicts 50% price drop for Server DRAM 1/23/2019
DRAMeXchange said the expected price drop may flirt with a 50 percent drop for the whole of 2019, though price falls are expected to ease during the third and fourth quarters should inventory problems be solved properly.
China demanded U.S. to drop charges on Huawei VP 1/23/2019
China demands that the U.S. withdraw the arrest warrant against Meng and "not make a formal extradition request to the Canadian side.
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