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| Smartphone growth projected to resume next year |
12/18/2018 |
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Shipments are expected to grow 2.6% in 2019 after falling by 3% to 1.42 billion units in 2018 from 1.47 billion in 2017, said IDC. Longer term, smartphone shipments are forecast to reach 1.57 billion units in 2022.
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| New Radeon game software is 15% better in performance |
12/17/2018 |
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The software gives an average 15 percent boost on games such as Tom Clancy’s Ghost Recon Wildlands, Mass Effect Andromeda, Overwatch, Prey, and Project Cars 2, AMD said, along with good performance on more recent titles as well.
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| Broadcom offers 64G Fibre Channel chips |
12/14/2018 |
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The 32G/64G Emulex products deliver more than 5 million I/O operations/second (IOPS) at less than 10-microsecond round-trip latencies. That’s up from 1.6 million IOPS and 30-microsecond latencies on the prior-generation 16G/32G products that rode the PCIe Gen 3 bus.
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| NAND flash prices rebounded slightly on holiday demand |
12/13/2018 |
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NAND flash prices will be under downward pressure again following the short-lived rebound, said the sources, adding that prices are set to fall after the Lunar New Year break in February due to oversupply.
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| Intel leads in 3D packaging |
12/13/2018 |
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The 3D packaging technology, known as Foveros, is the culmination of two decades of research at Intel into stacking die in three-dimensional heterogeneous structures combining logic and memory. Foveros extends the 3D packaging concept to include high-performance logic such as CPU, graphics and AI processors.
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| Qualcomm announced new powerful Snapdragon line ups |
12/12/2018 |
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The Snapdragon 855, along with its X50 modem, position the company to dominate the first wave of 5G devices. The Snapdragon 8cx, sports expanded GPU and I/O blocks, aiming to catch up with the performance and flexibility of mobile x86 chips from Intel and AMD.
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| Intel, Samsung and Globalfoundaries to offer embedded MRAM |
12/12/2018 |
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Intel (Santa Clara, California) described the key features of spin-transfer torque (STT)-MRAM–based non-volatile memory into its 22FFL process, calling it “the first FinFET-based MRAM technology. Samsung (Seoul), meanwhile, described STT — MRAM in a 28-nm FDSOI platform. STT-MRAM is regarded as the best MRAM technology in terms of scalability, shape dependence, and magnetic scalability.
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| Huawei suppliers fines employee who buy U.S. phones and equipments |
12/11/2018 |
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In an apparent show of nationalistic pride and support for its troubled counterpart, it also said it will cease to buy any American products such as office equipment, computers and cars, and will reward staff who buy Huawei or ZTE phones by giving them a 15 per cent subsidy.
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| November sales down on two major fab companies |
12/11/2018 |
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Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics (UMC) have reported sequential decreases in November consolidated revenues of 3.1% and 8.1%, respectively.
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| Samsung dedicates L8-1 fab to QD-OLED production |
12/10/2018 |
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The L8-1 fab is built in two phases with a total capacity of 200,000 substrates a month, and the transition will enable Samsung to roll out 160,000-180,000 substrates for QD-OLED panels.
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| Broadcom records a robust quarter |
12/10/2018 |
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Revenue and profit above analysts’ estimates, driven by strong demand for its enterprise storage and networking products from data centers.
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| Semi Industry to finish year strong |
12/10/2018 |
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WSTS now expects chip sales to reach $478 billion this year, an increase of 15.9% from 2017. The organization — which is comprised of 42 semiconductor companies that pool sales data — predicts that chip sales will grow by a much more modest 2.6% next year.
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