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Samsung is bringing foldable display into the mobile market 11/9/2018
Google said that it will create extensions to the next version of Android for foldable devices. It will also release APIs to support multi-windowing interfaces that Samsung described for its foldable.
Texas Instruments ventures into 60GHz mmWave sensor 11/9/2018
Texas Instruments made clear this week its intentions to muscle into the industrial market with a 60-GHz mmWave sensor family.
NAND prices dropped 17% in October 11/8/2018
DRAMeXchange noted that 3D NAND flash contract prices for October 2018 alone suffered a monthly fall of 13-17%, marking the biggest decline of its kind ever seen since November 2017.
Federal judge orders Qualcomm to license modem technology to competitors 11/8/2018
The preliminary ruling by Judge Lucy Koh in the U.S. District Court for the Northern District of California said that Qualcomm must license some patents involved in making so-called modem chips, which help smart phones connect to wireless data networks, to rival chip firms.
AMD to have 7nm CPU/GPU ahead of Intel 11/8/2018
Advanced Micro Devices launched its first 7-nm CPU and GPU at the lucrative target of the data center. It showed working chips.
Brexit talks enter into deadlock 11/8/2018
Britain is due to leave the EU on March 29, but divorce negotiations have been hamstrung by divisions within May's Conservative government over how close an economic relationship to seek with the bloc.
Reduce fertilizer usage by adding advanced soil sensor 11/7/2018
The bury-and-forget nitrogen sensors will be coupled with remote sensing technologies for real-time analysis of soil health.
ON Semiconductor teams with Mercedes on Formula 1 EV powertrain system 11/7/2018
The powertrain systems within both a Formula 1 and Formula E vehicle not only possess an increased number of power semiconductors, these semiconductors must meet extremely demanding performance and efficiency requirements.
China now has its own semiconductor wafer crystal furnace 11/7/2018
With government support, China's local silicon wafer suppliers and foundry chipmakers have been pouring significant capital into their capacity expansions.
Imagination announced offering of navigation and image compression IP core 11/7/2018
Imagination’s new global navigation satellite system (GNSS) IP offering, the Ensigma Location GNSS IP core, supports GPS, GLONASS, Galileo, and BeiDou as well as several satellite-based augmentation systems (SBAS) including WAAS and EGNOS.
Broadcom made billion dollar patent claim against Volkswagen 11/6/2018
Spiegel magazine, which first reported the conflict on Friday, said it concerned the use of 18 patents on Broadcom semiconductors which Volkswagen uses for navigation and entertainment system in some of its cars.
Fujian Jinhua denies charges on stealing DRAM technology 11/6/2018
Jinhua said it has been its standing policy to develop its own technology and has been expanding investments, resulting in a number of patent achievements.
SK Hynix claims 4D NAND using Charge Trap Flash (CTF) design paired with the Peri 11/6/2018
Mass production of the 96-Layer 4D NAND within this year. A single 512Gb NAND flash chip can represent 64 gigabytes (GB) storage.
Regardless of memory prices, global semiconductor sales is to hit record 11/6/2018
“While year-to-year growth has tapered in recent months, September marked the global industry’s highest-ever monthly sales, and Q3 was its top-grossing quarter on record,"
Amazon in advanced talks to Northern Virginia on HQ2 location 11/5/2018
The discussions include how quickly Amazon would move its employees there, which buildings it would occupy and how an announcement about the move would be made to the public. It’s unclear whether Amazon is having similar discussions with other finalists.
Cornami disclosed neural network AI chip 11/5/2018
Cornami aims to supply its chips to numerous markets, including in "edge computing," where automobiles and consumer electronics have an especial need for chips that have very responsive performance and are energy-efficient in how they run neural networks.
GlobalWafers' CEO Hsu predicts tight wafer supply ahead 11/5/2018
Demand for 8-inch and 12-inch wafers has been quite strong. GlobalWafers has signed long-term supply contracts with customers, most of which will remain valid through 2020. Contracts for large-size wafers now command 80-90% of her company's existing capacities.
UMC endicted on funneling Micron DRAM technology to China 11/5/2018
The case traces its roots back to last year, when Micron filed a civil suit against UMC and Fujian Jinhua alleging theft of its trade secrets and other misconduct after Taiwan authorities filed criminal indictments against UMC and three of its employees.
DRAM prices dropped over 10% in October 11/2/2018
According to the data compiled by industry tracker DRAMeXchange, the average price of DDR4 8 Gb, used mostly in PCs, reached US$7.31 per unit as of the end of October, down 10.7 percent from $8.19 posted a month earlier.
GLOBALFOUNDRIES setup Avera as a design house to help customers 11/2/2018
Avera offers flexible ASIC business engagement models that give clients the ability to supplement in-house resources with the level of support needed from experienced chip design, methodology, test and packaging teams
Samsung cautions slow growth on memory 11/2/2018
Samsung said it would cut its 2018 semiconductor capex to about 24.9 trillion won (about $22.6 billion), a decline of about 9% from last year’s total of 27.3 trillion won.
UMC pulled out of Fujian Jinhua project after Whitehouse's ban on technology transfer 11/2/2018
The U.S. government on Monday cut off U.S. firms from supplying Fujian Jinhua following allegations that the Chinese fab stole intellectual property from U.S. semiconductor company Micron Technology.
China trade war will be felt when shipment of MCU pulls back on Christmas Season 11/1/2018
Impact of the US-China trade conflicts can be judged from sales performance at the upcoming shopping festivals in the two countries.
Toshiba offers Bluetooth 5 for automotive applications 11/1/2018
The TC35681IFTG is based on an arm Cortex-M0 CPU and is compliant with Bluetooth Low Energy (LE) core specification 5.0. It will be used in a number of automotive applications including Remote Keyless Entry (RKE), On-Board Diagnostics (OBD) and Tire Pressure Monitoring Systems.
China's manufacturing slows 11/1/2018
The purchasing managers' index of the National Bureau of Statistics and an industry group, the China of Logistics and Purchasing, fell to 50.2 from September's 50.8.
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