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| AT&T downgraded on concern of complex Warner merger |
8/29/2018 |
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There are “many new balls to juggle (and invest in) with Time Warner assets,” the analysts said. “Entering a new sector by owning media content, AT&T is destined to learn maintaining the content machine (and the talent behind it) is not inexpensive.”
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| Majority of semi Capex goes to Memory in 2018 |
8/29/2018 |
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The total for NAND capex would represent an increase of 13% over 2017, when NAND flash capex grew by 91%. Meanwhile, the report forecasts that capital spending for DRAM and SRAM will increase more than any other industry segment, growing 41% in 2018 after an 82% increase last year.
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| Globalfoundries to skip 7nm process |
8/29/2018 |
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It would have cost GF $2-4 billion to ramp up the 40-50,000 wafers/month capacity needed to have a chance of making a return on the node.
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| Qualcomm plans operations center in Taiwan |
8/28/2018 |
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Qualcomm senior vice president Jim Cathey on Friday last week said that the company is to set up a Center for Operations, Manufacturing Engineering and Testing in Taiwan as a hub for the firm to extend its reach overseas.
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| Huawei to announce new model phone with 7nm HiSilicon SOC |
8/27/2018 |
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The HiSilicon Kirin 980 SoC is reportedly manufactured by TSMC using the foundry's 7nm FinFET process. The SoC features four Cortex-A77 cores along with four Cortex-A55, and 24-core Mali-G72 GPU. It comes with LPDDR4X DRAM memory.
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| Global chip sales hit record again at $120.8 billion |
8/24/2018 |
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"The explosive growth in enterprise and storage drove the market to new heights in the second quarter. This growth contributed to record application revenue in data processing and wired communication markets as well as in the microcomponent and memory categories."
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| Apple/Qualcomm dispute continue |
8/24/2018 |
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At their peak, Qualcomm’s chip sales to Apple were projected to be worth about $2.1 billion in 2016, or about 13% of its total revenue. Apple paid Qualcomm about $2.8 billion in royalties that year, then cut off the payments in early 2017 after it filed suit.
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| Apple takes risk with sole source from TSMC |
8/24/2018 |
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Apple will be risking the regular launch of new iPhones and iPads by counting on TSMC for production of follow-up processors to the A11 without a backup supplier. TSMC, on the other hand, will depend on Apple to fill up nearly 80 percent of its leading-edge 7nm capacity.
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| India aims at human space flight 2022 |
8/23/2018 |
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“We are not doing this for the first time, and we are also not starting the mission from the scratch. We are already on the job and several important components s such as crew module, crew escape systems, and environment control and life support systems, have already been completed,”
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| Startup thinks that its carbon nanotube NRAM can be a DRAM alternative |
8/23/2018 |
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Nantero’s non-volatile NRAMs use electrostatic charge to activate systolic arrays of CNT cells it claims are relatively easy to sputter on to any CMOS process. It claims it will outstrip the DRAM roadmap starting with stacks of 4-Gbit, 100mm2 die made in a 28nm process into initial 8- and 16-Gbit chips.
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| Police crack down on bitcon trading operation |
8/22/2018 |
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BitConnect’s dubious multi-level marketing practices in a statement recorded by the Times of India. “They lured investors with 60% monthly interest, and incentives in the form of ‘referral interest,'” Bhatia reportedly said.
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| Mobile DRAM revenues hit record again |
8/21/2018 |
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Smartphone unit production increased nearly 3% sequentially. Besides, 6GB has become the mainstream storage spec for high-end smartphones, while there are more models featuring 8GB of RAM. Meanwhile, the global supply of mobile DRAM chips remained tight driving up the memory contract prices in the second quarter.
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| China to become a serious competitor in 3D Flash |
8/21/2018 |
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YMTC, has another approach. The company processes the circuitry on one wafer and the NAND structure on another wafer. Then, the two wafers are bonded and connected electrically using millions of metal vertical interconnect access structures. YMTC’s approach, dubbed Xtacking, reduces the manufacturing cycle time by 20% and allows for higher bit density.
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