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Huawei to announce new model phone with 7nm HiSilicon SOC 8/27/2018
The HiSilicon Kirin 980 SoC is reportedly manufactured by TSMC using the foundry's 7nm FinFET process. The SoC features four Cortex-A77 cores along with four Cortex-A55, and 24-core Mali-G72 GPU. It comes with LPDDR4X DRAM memory.
Qualcomm announced jointly developed automotive chipset with Chinese partner 8/27/2018
"The chipset, which is supported by a cellular connected car technology, can be supplied to different automakers and thus help the development of China's auto industry,"
Global chip sales hit record again at $120.8 billion 8/24/2018
"The explosive growth in enterprise and storage drove the market to new heights in the second quarter. This growth contributed to record application revenue in data processing and wired communication markets as well as in the microcomponent and memory categories."
Apple/Qualcomm dispute continue 8/24/2018
At their peak, Qualcomm’s chip sales to Apple were projected to be worth about $2.1 billion in 2016, or about 13% of its total revenue. Apple paid Qualcomm about $2.8 billion in royalties that year, then cut off the payments in early 2017 after it filed suit.
Apple takes risk with sole source from TSMC 8/24/2018
Apple will be risking the regular launch of new iPhones and iPads by counting on TSMC for production of follow-up processors to the A11 without a backup supplier. TSMC, on the other hand, will depend on Apple to fill up nearly 80 percent of its leading-edge 7nm capacity.
A new ride-share company geared toward women 8/24/2018
Safr, a Boston-based company with a focus on women's safety, will arrive in the District, Orlando, Atlanta, Dallas and San Francisco this fall.
SK hynix posted sharp growth in sales 8/23/2018
SK hynix saw its sales jump 56 percent on-year to reach US$17.7 billion in the January-June period.
China based Gree Electric to invest $1 billion RMB to start semiconductor unit 8/23/2018
Gree’s new business scope covers the design and sales of semiconductors, integrated circuits, chips, electronic components and electronic products, the development and sales of communication technology, IoT technology, embedded software, computer software and mobile device software.
India aims at human space flight 2022 8/23/2018
“We are not doing this for the first time, and we are also not starting the mission from the scratch. We are already on the job and several important components s such as crew module, crew escape systems, and environment control and life support systems, have already been completed,”
Startup thinks that its carbon nanotube NRAM can be a DRAM alternative 8/23/2018
Nantero’s non-volatile NRAMs use electrostatic charge to activate systolic arrays of CNT cells it claims are relatively easy to sputter on to any CMOS process. It claims it will outstrip the DRAM roadmap starting with stacks of 4-Gbit, 100mm2 die made in a 28nm process into initial 8- and 16-Gbit chips.
Qualcomm and MediaTek racing to ready 5G chipsets 8/22/2018
More 5G-compatible end devices are getting field-testing, and 5G smartphones are to officially debut in 2019, according to industry sources.
UMC applied to have its Chinese subsidary listed at the Shanghai Stock Exchange 8/22/2018
Shareholders have approved the company's plans to have subsidiary Hejian Technology (Suzhou) apply for listing on the Shanghai Stock Exchange (SSE). UMC expects to raise new capital through Hejian's A-shares IPO on the SSE.
CBS ad-support streaming to be included with Amazon Prime Video 8/22/2018
CBS recently said it believes it will have 4 million All Access subscribers by next year, and 8 million by 2022. Many of those are drawn in by its flagship program.
Police crack down on bitcon trading operation 8/22/2018
BitConnect’s dubious multi-level marketing practices in a statement recorded by the Times of India. “They lured investors with 60% monthly interest, and incentives in the form of ‘referral interest,'” Bhatia reportedly said.
Mobile DRAM revenues hit record again 8/21/2018
Smartphone unit production increased nearly 3% sequentially. Besides, 6GB has become the mainstream storage spec for high-end smartphones, while there are more models featuring 8GB of RAM. Meanwhile, the global supply of mobile DRAM chips remained tight driving up the memory contract prices in the second quarter.
China to become a serious competitor in 3D Flash 8/21/2018
YMTC, has another approach. The company processes the circuitry on one wafer and the NAND structure on another wafer. Then, the two wafers are bonded and connected electrically using millions of metal vertical interconnect access structures. YMTC’s approach, dubbed Xtacking, reduces the manufacturing cycle time by 20% and allows for higher bit density.
T-Mobile getting rid of robotic voice customer service lines 8/21/2018
" It will stop customers from being endlessly transferred among agents, the company said. Instead, customers will work with a specific "team of experts."
Where can the U.S. stock market go next? 8/21/2018
Allocations to U.S. stocks jumped 10 percentage points this month to a net 19% overweight, the highest since January 2015. That makes America the most popular equity region for the first time in five years.
Streaming TV services grown a remarkable 58% 8/20/2018
comScore estimates these live TV services will continue to grow in the months ahead, and even forecast that newcomers like Hulu Live and YouTube TV to well exceed a million users each sometime this year.
Keysight introduced solder-in probe head for high-end oscilloscopes 8/20/2018
“Existing oscilloscope probe head solutions available today are even larger than the devices being tested in some cases. This makes signal probing access a continual challenge for modern electronic technologies,”
Oversupply drove down NAND prices 8/20/2018
Average NAND flash contract prices fell between 15% and 20% sequentially in the second quarter, but bit shipments bounced back thanks to a pick-up in demand for high-density products from China-based smartphone vendors.
SK Telecom turns to Xilinx FPGA for AI accelerator 8/20/2018
SKT is using Xilinx's Kintex UltraScale FPGAs to run its automatic speech-recognition (ASR) application to accelerate NUGU, its voice-activated assistant. According to SKT, it has been able to achieve up to five times higher performance in ASR applications when compared to GPUs
Purdue scientists combines transistor and laser on new FET 8/17/2018
The Purdue transistor and laser combination features a large on-current and a low off-current with a small subthreshold swing, which allows for increased speed and energy savings.
EDA giant Cadence Design to expand into Nanjing, China 8/17/2018
Nanjing is where Taiwan Semiconductor Manufacturing Company (TSMC) operates a 12-inch wafer fab and a design service center.
Infineon to post and sell its IoT chips on Chinese e-commerce site 8/17/2018
The aim of the partnership is to speed up applications in scenarios such as smart homes and assist in the continuous improvement of JD’s cloud service platform.
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