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| FCC want engineers to explore the 95GHz spectrum |
2/26/2019 |
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The FCC will start work on releasing a whopping 21 GHz of spectrum above 95GHz at proceedings in March. In addition, it aims to open up bands from 95GHz to 3THz for experiments, and it will propose broadband uses at the other end of the spectrum in the unlicensed 900-MHz band.
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| Fed is taking a back seat on interest rate for now |
2/26/2019 |
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The Fed's semi-annual report to Congress on monetary policy stood in contrast to its last report in July when it signaled that it was on track to keep raising rates at a gradual pace over the next two years.
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| JEDEC released LPDDR5 RAM standard |
2/25/2019 |
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LPDDR5 boasts a 50-percent faster input/output rates, and it also offers data transfer rates of 6400Mbps, which is twice faster than what LPDDR4 RAM has to offer, as it supports 3200Mbps speeds. These improvements help enhance the performance of devices like smartphones and tablets equipped with the latest memory standard.
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| 5G and AI chips are turning to EUV process |
2/25/2019 |
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TSMC claimed it is making progress in the development of sub-7nm process technologies with plans to move a newer 5nm EUV process to volume production by 2020 well on track.
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| Processing technology continue to advance |
2/25/2019 |
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There is more variety than ever among the logic-oriented process technologies that companies offer, and derivative versions of each process generation between major nodes have become regular occurrences,
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| Only 17% of Indian company report cyber attack |
2/25/2019 |
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Commenting on the findings, Burgess Cooper, Partner - Cyber Security, EY India said, “In comparison to the previous years, organizations are planning to spend more on cybersecurity, devoting more resources for improving their defences, and working harder to embed security-by-design.
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| Samsung and SK Hynix described their DDR5 technology at ISSCC |
2/22/2019 |
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DDR5 — or Double Data Rate 5 — is still under development at the Jedec standards organization. DDR5 offers double the bandwidth and double the density of DDR4 along with delivering improved channel efficiency. The standard was expected to be finalized last year, but remains a work in progress. DDR5 products are now expected to appear beginning late this year.
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| Micron Technology to enter volume production of 1x nm DRAM |
2/22/2019 |
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Micron has entered volume production of 1xnm DRAM chips at both its factory sites in Taoyuan (northern Taiwan) and Taichung (central Taiwan), and is gearing up for commercial production of 1ynm-made chips in the second half of this year.
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| Toshiba Memory claims highest-capacity NAND memory chip |
2/22/2019 |
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The Toshiba device stores 4 bits per cell and achieves bit density of 8.5 Gb/mm2, more than 40% better than a 512-Gb TLC 3D NAND device also described at the ISSCC Tuesday by Toshiba and its partner in NAND development and manufacturing, Western Digital.
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| Qualcomm wants to lead U.S. with X55 5G modem |
2/21/2019 |
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"I believe that the X55 is Qualcomm's continuation of their leadership in 5G. The fact that this is Qualcomm's second generation of chips and it is already shipping to customers means that they're considerably further ahead of the competition,"
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| DRAM contract prices dropped 15% in Q2 |
2/21/2019 |
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Continued oversupply in the DRAM market will result in "significant price declines" for the memory chips in the first half of 2019, said DRAMeXchange. End-market demand stays weak coupled with high inventory levels at PC and other device OEMs.
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| Intel put MRAM design into production |
2/21/2019 |
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Intel said it has used a "write-verify-write" scheme and a two-stage current sensing technique to create 7Mb perpendicular STT-MRAM arrays in its 22FFL FinFET process.
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| Plenty of work remains to be done on 5G |
2/21/2019 |
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“From early trials, [operators] realized it can work, but they are not getting all they would like. There is room for improvement, especially to deploy 5G cheaply in a wide variety of places.”
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| SK hynix keeps waste out of landfills |
2/20/2019 |
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The semiconductor supplier has diverted 90 percent of the waste from its main corporate campus in Icheon, Gyeonggi Province, away from landfills and toward alternative disposal methods such as reuse or recycling.
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| Globalfoundries denies Chengdu fab. closure rumor |
2/20/2019 |
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Globalfoundries has named Americo Lemos as its China country manager on the heels of speculation about layoffs and a likely shutdown of the foundry's joint-venture wafer fab in Chengdu.
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| Intel quietly acquired graphic chip design firm in India |
2/19/2019 |
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The company is acquired mainly for the skill sets of its workforce rather than products or services. According to sources, Intel has acquired around 100 engineers of Ineda for their skills in graphics, an area where the US giant has chalked out ambitious plans.
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| Semiconductor wafer demand continue to rise |
2/19/2019 |
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Semi’s latest Global 200mm Fab Outlook has announced that they anticipate a 14% increase in production, with the addition of 700,000 200mm wafers from 2019 to 2022. Semi has reported that the increase will bring their 200mm wafer fab capacity to 6.5 million wafers per month.
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