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Micron expects headwind on DRAM sales |
12/20/2018 |
Micron reported on Tuesday quarterly sales and earnings at the low end of Wall Street estimates but said that it expects revenue to decline significantly in the current quarter due to “weak near-term supply-demand dynamics.
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DRAM prices to erode |
12/20/2018 |
Historically cyclical DRAM market appears to be headed for tougher times in 2019 after two strong years of growth.
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Manufacturers have to latch on new stretagy going into 2019 |
12/20/2018 |
Driven by the promise of greater profitability and competitiveness, manufacturers will continue to progress toward digital transformation, including connected environments that provide greater control and visibility, and forgoing antiquated processes in favor of automation and efficiency.
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Optical finger print sensor prices fall |
12/19/2018 |
Suppliers of TDDI chips and optical fingerprint sensors mainly China- and Taiwan-based players are set to experience a wave of price cuts in 2019 as competition among them intensifies.
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Qualcomm launched 9205 LTE modem designed for IoT applications |
12/19/2018 |
The US chip giant said on Monday that the modem has been purpose-built for devices and applications which operate on LPWAN, which includes wearables, asset trackers, health monitors, security systems, smart city sensors, and smart meters.
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Semi equipment order shows concentration on logic vs memory |
12/18/2018 |
Generally, the equipment industry saw enormous demand in 2017, and the momentum extended into the first part of 2018. But then the memory market began deteriorating in the middle of this year, causing both DRAM and NAND vendors to push out their equipment orders.
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Smartphone growth projected to resume next year |
12/18/2018 |
Shipments are expected to grow 2.6% in 2019 after falling by 3% to 1.42 billion units in 2018 from 1.47 billion in 2017, said IDC. Longer term, smartphone shipments are forecast to reach 1.57 billion units in 2022.
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New Radeon game software is 15% better in performance |
12/17/2018 |
The software gives an average 15 percent boost on games such as Tom Clancy’s Ghost Recon Wildlands, Mass Effect Andromeda, Overwatch, Prey, and Project Cars 2, AMD said, along with good performance on more recent titles as well.
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Broadcom offers 64G Fibre Channel chips |
12/14/2018 |
The 32G/64G Emulex products deliver more than 5 million I/O operations/second (IOPS) at less than 10-microsecond round-trip latencies. That’s up from 1.6 million IOPS and 30-microsecond latencies on the prior-generation 16G/32G products that rode the PCIe Gen 3 bus.
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NAND flash prices rebounded slightly on holiday demand |
12/13/2018 |
NAND flash prices will be under downward pressure again following the short-lived rebound, said the sources, adding that prices are set to fall after the Lunar New Year break in February due to oversupply.
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Intel leads in 3D packaging |
12/13/2018 |
The 3D packaging technology, known as Foveros, is the culmination of two decades of research at Intel into stacking die in three-dimensional heterogeneous structures combining logic and memory. Foveros extends the 3D packaging concept to include high-performance logic such as CPU, graphics and AI processors.
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