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| Qualcomm launched 9205 LTE modem designed for IoT applications |
12/19/2018 |
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The US chip giant said on Monday that the modem has been purpose-built for devices and applications which operate on LPWAN, which includes wearables, asset trackers, health monitors, security systems, smart city sensors, and smart meters.
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| Semi equipment order shows concentration on logic vs memory |
12/18/2018 |
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Generally, the equipment industry saw enormous demand in 2017, and the momentum extended into the first part of 2018. But then the memory market began deteriorating in the middle of this year, causing both DRAM and NAND vendors to push out their equipment orders.
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| Smartphone growth projected to resume next year |
12/18/2018 |
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Shipments are expected to grow 2.6% in 2019 after falling by 3% to 1.42 billion units in 2018 from 1.47 billion in 2017, said IDC. Longer term, smartphone shipments are forecast to reach 1.57 billion units in 2022.
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| New Radeon game software is 15% better in performance |
12/17/2018 |
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The software gives an average 15 percent boost on games such as Tom Clancy’s Ghost Recon Wildlands, Mass Effect Andromeda, Overwatch, Prey, and Project Cars 2, AMD said, along with good performance on more recent titles as well.
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| Broadcom offers 64G Fibre Channel chips |
12/14/2018 |
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The 32G/64G Emulex products deliver more than 5 million I/O operations/second (IOPS) at less than 10-microsecond round-trip latencies. That’s up from 1.6 million IOPS and 30-microsecond latencies on the prior-generation 16G/32G products that rode the PCIe Gen 3 bus.
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| NAND flash prices rebounded slightly on holiday demand |
12/13/2018 |
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NAND flash prices will be under downward pressure again following the short-lived rebound, said the sources, adding that prices are set to fall after the Lunar New Year break in February due to oversupply.
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| Intel leads in 3D packaging |
12/13/2018 |
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The 3D packaging technology, known as Foveros, is the culmination of two decades of research at Intel into stacking die in three-dimensional heterogeneous structures combining logic and memory. Foveros extends the 3D packaging concept to include high-performance logic such as CPU, graphics and AI processors.
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| Qualcomm announced new powerful Snapdragon line ups |
12/12/2018 |
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The Snapdragon 855, along with its X50 modem, position the company to dominate the first wave of 5G devices. The Snapdragon 8cx, sports expanded GPU and I/O blocks, aiming to catch up with the performance and flexibility of mobile x86 chips from Intel and AMD.
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| Intel, Samsung and Globalfoundaries to offer embedded MRAM |
12/12/2018 |
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Intel (Santa Clara, California) described the key features of spin-transfer torque (STT)-MRAM–based non-volatile memory into its 22FFL process, calling it “the first FinFET-based MRAM technology. Samsung (Seoul), meanwhile, described STT — MRAM in a 28-nm FDSOI platform. STT-MRAM is regarded as the best MRAM technology in terms of scalability, shape dependence, and magnetic scalability.
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| Huawei suppliers fines employee who buy U.S. phones and equipments |
12/11/2018 |
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In an apparent show of nationalistic pride and support for its troubled counterpart, it also said it will cease to buy any American products such as office equipment, computers and cars, and will reward staff who buy Huawei or ZTE phones by giving them a 15 per cent subsidy.
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| November sales down on two major fab companies |
12/11/2018 |
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Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics (UMC) have reported sequential decreases in November consolidated revenues of 3.1% and 8.1%, respectively.
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