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Computer virus caused production lost at TSMC 8/7/2018
The infection, which was eventually contained, will delay shipments of its products and could wipe as much as $171 million off its revenue.
French Leti to fabricate Resistive RAM on multi-project wafer 8/6/2018
“Leti’s integrated silicon memory platform is developed for backend memories and non-volatility associated with embedded designs,”
Qualcomm expects watches and connected speaker to bring billion dollar sales 8/6/2018
Qualcomm had disclosed that it expected $5 billion in non-mobile chip sales this year, up from $3 billion last year. The rest of the $5 billion beyond IoT chips comes from networking chips, Qualcomm’s own automotive chips and a few other areas.
ARM acquired Treasure Data, a data management platform for large enterprise customers 8/6/2018
The company calls the acquisition of Treasure Data “the final piece” of its “IoT enablement puzzle."
Semiconductor sales rise 20% 8/6/2018
Growth of more than 20% for the first half of the year is no small achievement, particularly since 2017 semiconductor sales of $412 billion set an all-time high. The most recent WSTS forecast, released in June, calls for chip sales to increase 12.4% this year.
Toshiba Electronics Europe offers new three-phase brushless fan motor controller IC 8/3/2018
Switching from an 8-pole to 12-pole rotor achieves higher drive efficiency and reduces system noise. However, rotation control for an 8-pole rotor can also be implemented, thereby shortening the development cycle.
Tesla readying its own AI chip for autonomus driving 8/3/2018
The Tesla computer, otherwise known as “Hardware 3,” it’s a Tesla-built piece of hardware meant to be swapped into the Model S, X and 3 to do all the number crunching required to advance those cars’ self-driving capabilities.
Advance sensors are the key to IoT applications 8/3/2018
3D sensing technology can be well applied to various fields. 3D sensors are now mainly used for facial recognition, replacing touch ID for smartphone unlocking and mobile payment. Besides smartphones, long-range outdoor cameras, short-range VR (virtual reality) glasses, and low-luminance face recognition inside cars.
NAND market see oversupply 8/3/2018
Average selling price of NAND flash is expected to decline by 10 percent in the third quarter and another 10 percent in the fourth quarter.
Allegro MicroSystems signed long term foundry contract with UMC 8/2/2018
The agreement covers technical collaboration and establishes capacity at UMC for Allegro’s proprietary automotive-grade technologies, supporting the strong long-term growth of Allegro.
Samsung donates US$44.7 million to the Korea Smart Factory Foundation 8/2/2018
Samsung said it wishes to support local companies' efforts to improve their production capabilities and safety environment, regardless of their partnership with the world's largest producer of semiconductors and smartphones.
Sign of manufacturing growth slowing 8/2/2018
Manufacturing expanded in July as the PMI registered 58.1 percent, a decrease of 2.1 percentage points from the June reading of 60.2 percent. This indicates strong growth in manufacturing for the 23rd consecutive month, led by continued expansion in new orders, production and employment.
Fed left interest alone for now 8/2/2018
The Fed has already raised rates two times this year in March and June. It signaled at the June meeting that it expected to raise two more times in 2018. Many analysts believe those hikes will occur in September and December.
A new method of 3D printing battery electrodes 8/1/2018
In normal batteries, 30-50% of the total electrode volume is unutilised. The new method overcomes this issue by using 3D printing where we create a microlattice electrode architecture that allows the efficient transport of lithium through the entire electrode, which also increases the battery charging rates.
Demand for Android chip slows down 8/1/2018
Foundry houses are experiencing a slowdown in orders from Android smartphone chipmakers, who will observe sales performance of new iPhones for a while before launching new smartphone chipset solutions, according to industry sources.
GDDR6 found its way into AI and Networking 8/1/2018
Advanced driver assistance systems (ADAS) that must be responsive to a driver’s actions immediately, while autonomous vehicles need high-performance memory to process the vast amounts of real-time data. Other emerging applications include augmented reality (AR) and virtual reality (VR). Finally, video is always hungry for memory as 4K gets more widely adopted and 8K nips at its heels.
Nokia North Texas to build 5G network for T-Mobile 8/1/2018
A $3.5 billion agreement to accelerate the deployment of the next-generation of wireless called 5G. Nokia is set to provide T-Mobile with 5G technology, software and services.
Infineon succeed in producing 1200V IGBT from 12 inch wafer 7/31/2018
It is the first discrete IGBT duopack on the market manufactured on 12 inch wafer size.
TSMC leads patent filing in Taiwan 7/31/2018
Data compiled by the office showed that TSMC filed 345 invention patent applications in the past six months, up 5 percent from a year earlier.
South Korean government invest $1.34 billion to initiate next generation semiconductor development 7/31/2018
The priorities will be to develop next-generation materials and devices in memory chips, foster logic and contract-chip making businesses, and attract global semiconductor materials and equipment makers to build their production lines in South Korea.
Foldable OLED ready for smartphone production by 2019 7/31/2018
A smartphone with a bendable OLED display could open to a 7- to 8-inch screen size, delivering perhaps UHD resolution at 120 Hz.
Intel to have 10nm chips in PCs on store shelves for the 2019 holiday season 7/30/2018
Intel has been dogged by yield issues at the 10nm node, causing the company in April to delay the launch of 10nm products until next year.
Analog Devices announced micro-module cool switchers 7/30/2018
The LTM4678 expose its two inductors on top of BGA package, it uses the inductors as heat sinks to transfer heat from inside, keeping the device cool.
Custom MMIC offers new LNA/Phase Shifter combo for satellite C-band receiver 7/30/2018
The LNA, designsted CMD270P3, is suitable for EW and communications receivers where high performance, small size and low power consumption are needed. The CMD174 die is also a GaAs MMIC 5-bit phase shifter that operates from 3 to 6 GHz and provides 0 to 360 degrees of monotonic phase coverage, with a LSB of 11.25 degrees.
SK Hynix has extra profit to spend 7/30/2018
The $121 billion global memory chip industry has enjoyed an unprecedented boom since late 2016, with profits surging to record highs and margins rising above 70 percent thanks to disciplined production after years of consolidation.
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